Downward type MEMS switch and method for fabricating the same

Abstract

A downward type micro electro mechanical system (EMS) switch and a method of fabricating the same is provided. The downward type MEMS switch includes first and second cavities formed in a substrate, first and second actuators formed on upper portions of the first and second cavities, first and second fixing lines formed on an upper surface of the substrate and not overlapped with the first and second cavities, and a contact pad which is spaced apart at a predetermined distance from surfaces of the first fixing line and the second fixing line but which can be contacted with the first fixing line and the second fixing line when the first actuator and the second actuator are driven. The contact pad, which is actuated downward by piezoelectricity, is fabricated as it shares a layer with a RF signal line, after the RF signal line is fabricated.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and advantages of the present invention will be more apparent from the following detailed description taken with reference to the accompanying drawings, in which:

FIG. 1 is a view illustrating a downward type MEMS switch according to an exemplary embodiment of the present invention;

FIG. 2 is a perspective view of a part of the downward type MEMS switch illustrated in FIG. 1, from which a supporting layer is removed;

FIG. 3 is a cross-sectional view of a downward type MEMS switch taken on line A-A′ of FIG. 1, from which a supporting layer is removed;

FIG. 4 is a cross-sectional view of a downward type MEMS switch taken on line B-B′ of FIG. 1; and

FIGS. 5A through 5F are views for explaining a fabrication method of a downward type MEMS switch illustrated in FIG. 1;

FIG. 6A is a view illustrating a configurable antenna employing a downward type MEMS switch illustrated in FIG. 1 according to a first exemplary embodiment of the present invention; and

FIG. 6B is a view illustrating a configurable antenna employing a downward type MEMS switch illustrated in FIG. 2 according to a second embodiment of the present invention.

Claims

1. A method of fabricating a downward type micro electro mechanical system (MEMS) switch comprising: (a) forming a first cavity and a second cavity in a substrate;(b) forming a first actuator on an upper portion of the first cavity and a second actuator on an upper portion of the second cavity;(c) forming a first fixing line and a second fixing line on an upper surface of the substrate so that they are not overlapped with the first cavity and the second cavity; and(d) forming a contact pad which is spaced apart at a predetermined distance from surfaces of the first fixing line and the second fixing line but can be contacted with the first fixing line and the second fixing line when the first actuator and the second actuator are driven.

2. The method as claimed in claim 1, further comprising: (e) forming a supporting layer which is spaced apart at a predetermined distance from a top surface of the contact pad to be connected to the first actuator and the second actuator.

3. The method as claimed in claim 1, wherein if power is applied, the contact pad is actuated downward by piezoelectricity generated from the first actuator and the second actuator so as to be connected to at least one of the first fixing line and the second fixing line.

4. The method as claimed in claim 1, wherein the first fixing line and the second fixing line are antenna signal lines of each different bandwidth.

5. The method as claimed in claim 1, wherein the contact pad is depressed at a certain area, and protrudes at opposite upper ends of the certain area so as to be connected to each of the first fixing line and the second fixing line.

6. The method as claimed in claim 1, wherein the operation (b) comprises: (b1) forming a lower electrode on the substrate to cover the first cavity and the second cavity;(b2) forming a piezo layer, comprising a piezo ceramic, on the lower electrode;(b3) forming an upper electrode on the piezo layer; and(b4) forming a membrane layer on the upper electrode.

7. A downward type micro electro mechanical system (MEMS) switch comprising: a substrate in which a first cavity and a second cavity are formed;a first fixing line and a second fixing line which are formed on an upper surface of the substrate and which do not cross with the first cavity and the second cavity;a contact pad which is spaced apart at a predetermined distance from surfaces of the first fixing line and the second fixing line; anda first actuator and a second actuator which are disposed on upper portions of the first cavity and the second cavity, respectively, and downward actuate the contact pad to be in contact with at least one of the first fixing line and the second fixing line when power is supplied.

8. The downward type MEMS switch as claimed in claim 7, further comprising: a supporting layer which is spaced apart at a predetermined distance from a surface of the contact pad to be connected to the first actuator and the second actuator.

9. The downward type MEMS switch as claimed in claim 7, wherein the first fixing line and the second fixing line are antenna signal lines of different bandwidths.

10. The downward type MEMS switch as claimed in claim 7, wherein the contact pad is depressed at a certain area, and protrudes at opposite upper ends of the certain area so as to be connected to each of the first fixing line and the second fixing line.

11. The downward type MEMS switch as claimed in claim 7, wherein the first actuator and the second actuator each comprises: a lower electrode which is disposed on the substrate to cover one of the first cavity and the second cavity;a piezo layer which is disposed on the lower electrode and comprises a piezo ceramic;an upper electrode which is disposed on the piezo layer; anda membrane layer which is disposed on the upper electrode.

12. The downward type MEMS switch as claimed in claim 7, wherein the contact pad is formed after the first actuator, the second actuator, the first fixing line, and the second fixing line are formed.