Droplet discharging head and manufacturing method for the same, and droplet discharging device

Abstract

A droplet discharging head comprises a pressure chamber in which fluid is filled through a channel, and a nozzle that is connected to the pressure chamber and which discharges the fluid as a droplet. After the droplet discharging head is assembled, at least the wall surfaces contacting the fluid are coated with a carbonized silicon film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention will be described in detail based on the following figures, wherein:

FIG. 1 is an outline frontal drawing showing an inkjet recording device;

FIG. 2 is an explanatory drawing showing the arrangement of the inkjet recording heads;

FIG. 3 is an explanatory drawing showing the relation between the width of the recording medium and the width of the printing region;

FIG. 4A is an outline planar drawing showing the overall structure of the inkjet recording head, and FIG. 4B is an outline planar drawing showing the structure of one element of the inkjet recording head;

FIG. 5A is a cross-sectional drawing of the A-A′ line of FIG. 4B, FIG. 5B is a cross-sectional drawing of the B-B′ line of FIG. 4B, and FIG. 5C is a cross-sectional drawing of the C-C′ line of FIG. 4B;

FIG. 6 is an outline cross-sectional drawing showing the composition of the inkjet recording head of the first embodiment;

FIG. 7 is an outline planar drawing showing the bumps of the drive IC of the inkjet recording head;

FIG. 8 is an explanatory drawing of the entire process for manufacturing the inkjet recording head of the first embodiment;

FIGS. 9A-9D are explanatory drawings showing a process for manufacturing the piezoelectric element substrate of the first embodiment;

FIGS. 9E-9G are explanatory drawings showing a process for manufacturing the piezoelectric element substrate of the first embodiment;

FIGS. 9H-9J are explanatory drawings showing a process for manufacturing the piezoelectric element substrate of the first embodiment;

FIGS. 9K-9M are explanatory drawings showing a process for manufacturing the piezoelectric element substrate of the first embodiment;

FIGS. 10A-10B are explanatory drawings showing the process of manufacturing a top panel component of the first embodiment;

FIGS. 11A-11C are explanatory drawings showing the process after joining the piezoelectric element substrate to the top panel component of the first embodiment;

FIGS. 11D-11E are explanatory drawings showing the process after joining the piezoelectric element substrate to the top panel component of the first embodiment;

FIGS. 11F-11G are explanatory drawings showing the process after joining the piezoelectric element substrate to the top panel component of the first embodiment;

FIGS. 11H-11I are explanatory drawings showing the process after joining the piezoelectric element substrate to the top panel component of the first embodiment;

FIGS. 12A-12B are explanatory drawings showing the process after joining the nozzle plate to the piezoelectric element substrate of the first embodiment;

FIGS. 12C-12D are explanatory drawings showing the process after joining the nozzle plate to the piezoelectric element substrate of the first embodiment;

FIGS. 12E-12F are explanatory drawings showing the process after joining the nozzle plate to the piezoelectric element substrate of the first embodiment;

FIG. 13A is an explanatory drawing showing another method of mounting solder, and FIG. 13B is an explanatory drawing showing yet another method of mounting solder;

FIG. 14A is a chart comparing the contact angles of the SiC film with other components using purified water, and FIG. 14B is a chart comparing the amount of change in contact angles of the SiC film after contact with purified water;

FIG. 15 is an explanatory drawing showing a case where a thin organic film is provided at the inkjet recording head of the first embodiment prior to formation of the SiC film;

FIG. 16 is an explanatory drawing of the overall process of manufacturing the inkjet recording head of the second embodiment;

FIGS. 17A-17F are explanatory drawings showing the manufacturing process for the piezoelectric element substrate of the second embodiment;

FIGS. 17G-17K are explanatory drawings showing the manufacturing process for the piezoelectric element substrate of the second embodiment;

FIGS. 18A-18C are explanatory drawings showing the process after joining the piezoelectric element substrate to the top panel component of the second embodiment;

FIGS. 18D-18F are explanatory drawings showing the process after joining the piezoelectric element substrate to the top panel component of the second embodiment;

FIGS. 18G-18H are explanatory drawings showing the process after joining the piezoelectric element substrate to the top panel component of the second embodiment;

FIG. 181 is an explanatory drawing showing the process after joining the piezoelectric element substrate to the top panel component of the second embodiment;

FIGS. 19A-19C are explanatory drawings showing the process of manufacturing the channel substrate of the second embodiment;

FIGS. 19D-19F are explanatory drawings showing the process of manufacturing the channel substrate of the second embodiment;

FIGS. 20A-20B are explanatory drawings showing the process after joining the piezoelectric element substrate to the channel substrate of the second embodiment;

FIGS. 20C-20D are explanatory drawings showing the process after joining the piezoelectric element substrate to the channel substrate of the second embodiment; and

FIG. 21 is an explanatory drawing showing a plasma CVD method device that forms the SiC film.

Claims

1. A droplet discharging head comprising: a pressure chamber in which fluid is filled through a channel; anda nozzle that is connected to the pressure chamber and which discharges the fluid as a droplet,wherein a wall surface of the droplet discharging device that contacts the fluid is coated with a carbonized silicon film.

2. The droplet discharging head of claim 1, wherein a thin organic film is provided between the wall surface and the carbonized silicon film.

3. A droplet discharging head comprising: a pressure chamber in which fluid is filled through a channel; anda nozzle that is connected to the pressure chamber and which discharges the fluid as a droplet,wherein at least a wall surface of the droplet discharging device that contacts the fluid is coated with a carbonized silicon film.

4. The droplet discharging head of claim 3, wherein a thin organic film is provided between the wall surface and the carbonized silicon film.

5. The droplet discharging head of claim 1, further comprising: a vibration plate that comprises a portion of the pressure chamber; anda piezoelectric element that displaces the vibration plate,wherein a wall surface of the droplet discharging device that contacts the fluid is coated with a carbonized silicon film.

6. The droplet discharging head of claim 5, wherein a thin organic film is provided between the wall surface and the carbonized silicon film.

7. A method of manufacturing a droplet discharging head comprising: a pressure chamber in which fluid is filled through a channel; anda nozzle that is connected to the pressure chamber and which discharges the fluid as a droplet,wherein a wall surface of the droplet discharging device that contacts the fluid is coated with a carbonized silicon film by a chemical vapor growth method.

8. The method of manufacturing the droplet discharging head of claim 7, wherein a thin organic film is provided on the wall surface of the droplet discharging device prior to coating the carbonized silicon film.

9. The method of manufacturing the droplet discharging head of claim 7, wherein the droplet discharging head further comprises: a channel substrate in which the pressure chamber and the nozzle are formed;a piezoelectric element substrate provided with a vibration plate and a piezoelectric element, wherein the vibration plate comprises a portion of the pressure chamber, and the piezoelectric element displaces the vibration plate; anda support substrate comprising a portion of the channel;wherein a wall surface of the droplet discharging device that contacts the fluid is coated with a carbonized silicon film by a chemical vapor growth method after forming the channel substrate in which the pressure chamber is formed, the piezoelectric element substrate, and the support substrate.

10. The method of manufacturing the droplet discharging head of claim 9, wherein a thin organic film is provided on the wall surface of the droplet discharging device prior to coating the carbonized silicon film.

11. A method of manufacturing a droplet discharging head, wherein a droplet discharging head comprises: a pressure chamber in which fluid is filled through a channel;a nozzle that is connected to the pressure chamber and which discharges the fluid as a droplet;a vibration plate that comprises a portion of the pressure chamber; anda piezoelectric element that displaces the vibration plate,the manufacturing method comprising:prior to joining a channel substrate, in which the pressure chamber and nozzle are formed, to a piezoelectric element substrate provided with the vibration plate and piezoelectric element, the piezoelectric element substrate and the channel substrate are coated with a carbonized silicon film by a chemical vapor growth method.

12. The method of manufacturing the droplet discharging head of claim 11, wherein a thin organic film is provided on the piezoelectric element substrate and the channel substrate prior to coating the carbonized silicon film.

13. A droplet discharging device comprising the droplet discharging head of claim 1.