by forming conductive walled aperture in base

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CPC
Y10T29/49165

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

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Y10T29/49165by forming conductive walled aperture in base

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Patents Grantslast 30 patents

Information Patent Grant
3DIC package with interposer formed by spin on process
- Patent number 12,154,846
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed communication jack
- Patent number 12,051,878
- Issue date Jul 30, 2024
- SENTINEL CONNECTOR SYSTEMS
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of substrate having electrical interconnection s...
- Patent number 11,913,121
- Issue date Feb 27, 2024
- Siliconware Precision Industries Co., Ltd.
- Po-Yi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal delivery in stacked device
- Patent number 11,887,969
- Issue date Jan 30, 2024
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, system and device for manufacturing printed circuit board,...
- Patent number 11,770,905
- Issue date Sep 26, 2023
- INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD
- Dong Zhou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,737,205
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and semiconductor device including the same
- Patent number 11,602,056
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced capacitance land pad
- Patent number 11,516,915
- Issue date Nov 29, 2022
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating device having inductor
- Patent number 11,495,528
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,457,525
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,445,617
- Issue date Sep 13, 2022
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC package integration for high-frequency RF system
- Patent number 11,417,594
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing inductor built-in substrate
- Patent number 11,322,301
- Issue date May 3, 2022
- Ibiden Co., Ltd.
- Hiroaki Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 11,324,119
- Issue date May 3, 2022
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 11,304,311
- Issue date Apr 12, 2022
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multilayer laminate and method for producing multilayer printed wir...
- Patent number 11,285,700
- Issue date Mar 29, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with glass sheet, resin layer and through-glass via
- Patent number 11,276,584
- Issue date Mar 15, 2022
- Nippon Sheet Glass Company, Limited
- Keiji Tsunetomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal delivery in stacked device
- Patent number 11,264,360
- Issue date Mar 1, 2022
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate structures with hole plugs and methods of forming laminate...
- Patent number 11,246,226
- Issue date Feb 8, 2022
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 11,234,330
- Issue date Jan 25, 2022
- Innolux Corporation
- Po-Yun Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing the printed board
- Patent number 11,229,123
- Issue date Jan 18, 2022
- Nichia Corporation
- Masaaki Katsumata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for repairing a fine line
- Patent number 11,212,921
- Issue date Dec 28, 2021
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Chengqiang Cui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,191,165
- Issue date Nov 30, 2021
- Ethertronics, Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided circuit board and method for preparing the same
- Patent number 11,134,574
- Issue date Sep 28, 2021
- Taiwan Green Point Enterprises Co., Ltd.
- I-Lin Tseng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,127,664
- Issue date Sep 21, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 11,089,685
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3DIC PACKAGE WITH INTERPOSER FORMED BY SPIN ON PROCESS
- Publication number 20240395684
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Shiang LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Communication Jack
- Publication number 20240364059
- Publication date Oct 31, 2024
- Sentinel Connector Systems, Inc.
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
- Publication number 20230354503
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20230199973
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL DELIVERY IN STACKED DEVICE
- Publication number 20220415855
- Publication date Dec 29, 2022
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
- Publication number 20220386451
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGE INTEGRATION FOR HIGH-FREQUENCY RF SYSTEM
- Publication number 20220375841
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Shiang LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitive Compensation for Vertical Interconnect Accesses
- Publication number 20220201857
- Publication date Jun 23, 2022
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20220117087
- Publication date Apr 14, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20220087029
- Publication date Mar 17, 2022
- Ethertronics, Inc.
- Seung Hyuk Choi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210321520
- Publication date Oct 14, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASED ARRAY STEERING FOR LASER BEAM POSITIONING SYSTEMS
- Publication number 20210291296
- Publication date Sep 23, 2021
- ELECTRO SCIENTIFIC INDUSTRIES, INC.
- Jan Kleinert
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20210195761
- Publication date Jun 24, 2021
- Unimicron Technology Corp.
- Kai-Ming YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and method for manufacturing the same
- Publication number 20210176861
- Publication date Jun 10, 2021
- InnoLux Corporation
- Po-Yun HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20210153360
- Publication date May 20, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20210127500
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20210007215
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20200337152
- Publication date Oct 22, 2020
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...
- Publication number 20200187362
- Publication date Jun 11, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING DEVICE HAVING INDUCTOR
- Publication number 20200075471
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Shiang LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200068721
- Publication date Feb 27, 2020
- Unimicron Technology Corp.
- Kai-Ming YANG
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20200045827
- Publication date Feb 6, 2020
- Ethertronics, Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20200015364
- Publication date Jan 9, 2020
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD FOR PACKAGING CIRCUITS
- Publication number 20190362988
- Publication date Nov 28, 2019
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR A SUBSTRATE ASSOCIATED WITH A BACKSIDE REVEAL
- Publication number 20190355683
- Publication date Nov 21, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20190350091
- Publication date Nov 14, 2019
- Avary Holding (Shenzhen) Co., Limited.
- TZU-CHIEN YEH
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PRINTED CIRCUIT BOARDS WITH THICK-WALL VIAS
- Publication number 20190343001
- Publication date Nov 7, 2019
- ABB Schweiz AG
- Robert Joseph Roessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190239362
- Publication date Aug 1, 2019
- Unimicron Technology Corp.
- Kai-Ming YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE POLYMERS WITHIN DRILLED HOLES OF PRINTED CIRCUIT BOARDS
- Publication number 20190230797
- Publication date Jul 25, 2019
- International Business Machines Corporation
- Joseph Kuczynski
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

by forming conductive walled aperture in base

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3DIC package with interposer formed by spin on process

High speed communication jack

Stackable via package and method

Fabrication method of substrate having electrical interconnection s...

Manufacturing method of package structure

Signal delivery in stacked device

Method, system and device for manufacturing printed circuit board,...

Method for manufacturing a circuit having a lamination layer using...

Interconnect structure having conductor extending along dielectric...

Stackable via package and method

Circuit board and semiconductor device including the same

Reduced capacitance land pad

Method of fabricating device having inductor

Interconnect structure having conductor extending along dielectric...

Package structure and manufacturing method thereof

3DIC package integration for high-frequency RF system

Method for manufacturing inductor built-in substrate

Capacitive compensation for vertical interconnect accesses

Simultaneous and selective wide gap partitioning of via structures...

Multilayer laminate and method for producing multilayer printed wir...

Substrate with glass sheet, resin layer and through-glass via

Signal delivery in stacked device

Laminate structures with hole plugs and methods of forming laminate...

Electronic device

Method of manufacturing the printed board

Method for repairing a fine line

Method for manufacturing a circuit having a lamination layer using...

Double-sided circuit board and method for preparing the same

Circuit board and manufacturing method thereof

Stackable via package and method

Patents Applicationslast 30 patents

3DIC PACKAGE WITH INTERPOSER FORMED BY SPIN ON PROCESS

High Speed Communication Jack

STACKABLE VIA PACKAGE AND METHOD

INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

SIGNAL DELIVERY IN STACKED DEVICE

INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

3DIC PACKAGE INTEGRATION FOR HIGH-FREQUENCY RF SYSTEM

Capacitive Compensation for Vertical Interconnect Accesses

STACKABLE VIA PACKAGE AND METHOD

Method for Manufacturing a Circuit Having a Lamination Layer Using...

ELECTRONIC MODULE

PHASED ARRAY STEERING FOR LASER BEAM POSITIONING SYSTEMS

MANUFACTURING METHOD OF PACKAGE STRUCTURE

Electronic device and method for manufacturing the same

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

INTERCONNECT STRUCTURE

STACKABLE VIA PACKAGE AND METHOD

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...

METHOD OF FABRICATING DEVICE HAVING INDUCTOR

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Method for Manufacturing a Circuit Having a Lamination Layer Using...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

METHOD FOR PACKAGING CIRCUITS

INTERCONNECTIONS FOR A SUBSTRATE ASSOCIATED WITH A BACKSIDE REVEAL

FLEXIBLE PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARDS WITH THICK-WALL VIAS

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE POLYMERS WITHIN DRILLED HOLES OF PRINTED CIRCUIT BOARDS