The present invention is directed generally to conductive power contacts used in electronic applications, and more particularly, to low inductance and low resistance contacts for use in quickly transferring power between circuits on two circuit boards.
The power demands made on computer processors increases with the development of newer and faster peripheral devices and circuits. Semiconductor devices, and particularly, computer processors now require more power than did their predecessors. Processor manufacturers, ASIC manufacturers and mother board designers are all interested in new ways to increase the power conveyed to the processor or semiconductor device without taking up a large amount of space on the mother board, meaning that they are reluctant to increase the size of the contacts that connect circuits on a motherboards to an integrated circuit or a daughter board. When the size of the contacts is increased, the contacts take up more room than is desired on the motherboard.
For designs that require high power, it is important to keep resistance of the contacts low. Keeping the resistance low also lowers the self-inductance of the power contact. However, another design aspect which is known as “mutual inductance” is an important design factor. Mutual inductance imparts loop inductance to contacts and this loop inductance may not be directly related to the resistance of the contact. Self and mutual inductance are directly related to loop inductance as expressed by the formula:
LLOOP=Self InductancePOWER PATH+Self InductanceRETURN PATH−(2×Mutual Inductance between power and return path).
It is also desirable to provide high power delivery systems with low impedance over a large frequency range. As a side benefit of increasing mutual inductance, capacitive coupling is typically increased. As a general rule, the impedance of an interconnect can be represented by:
Z=(LLOOP/Capacitance)
Contacts that utilize only a single contact arm, have only a single path cannot supply the desired level of inductance. The use of a single contact arm, may result in a contact force that may be less than desirable. In almost all cases, the current source and sink points must be offset from one another. As terminals must be soldered to one of the two circuit boards (either the motherboard or a secondary board), this also requires a single deflection force.
Typical known power contacts utilize either single spring arms, or a unitary base having a plurality of discrete spring arms extending therefrom. The base is usually soldered to a circuit board and the spring arms are bent upon themselves on their base so that the middle of the spring arm defines a contact surface that is approximately parallel with the base when the two circuit boards are pressed together to establish an electrical connection therebetween.
The present invention is directed to a power contact that overcomes the aforementioned disadvantages.
The contact design philosophy can be used with interposer or soldered down type interconnects. The design can accommodate one piece or two-piece designs. Our design contemplates the use of a box contact in order to obtain lower loop inductance while raising capacitance of the contact. This is found to significantly decrease the impedance of the power path. The designs shown in this application illustrate alternate ways of executing mechanical geometries to work in specific applications, however, slight obvious variations to these geometries can be done to accommodate other planar power interconnect architectures The following are definitions of terms that will be used in this description: VR=Voltage Regulator; VRD=Voltage Regulator Down, i.e., a voltage regulator that is soldered to a motherboard; VRM=Voltage Regulator Module; ZVR=Z-axis Voltage Regulator; NZVR=Negative Z-axis Voltage Regulator; and DZVR=Dual Z-axis Voltage Regulator.
It is therefore an object of the present invention to provide an improved low impedance, high power delivery contact for use with processors and semiconductor devices.
Another object of the present invention is to provide a power contact having multiple contact beams and which also has multiple current paths.
Still another object of the present invention is to provide a power contact that utilizes mutual coupling to reduce the overall inductance and resistance of the contact.
Yet a further object of the present invention is to provide a beam terminal for use in transmitting power between a circuit board and a processor in which the beam terminal includes two interengaging members, which cooperatively define four (4) current paths therein for the transmittal of power, and which paths assist on defining a low self-inductance and resistance current path through the beam terminal.
Still yet another object of the present invention is to provide a power contact for use in Z-axis (vertical) applications for connecting processors to circuit boards, the power contact having a plurality of current paths defined therein and reliable contact beams formed therewith.
The present invention provides these and other objects by way of its structure, which is briefly described below and is described in greater detail in the detailed description and drawings to follow.
In one aspect of the present invention, an improved power contact is provided by utilizing a box-type structure formed form the mating together of two interengaging U-shaped channels. The channels have a web and two flanges extending from the web, in a spaced-apart fashion, to define a hollow, intervening space that extends lengthwise through the channel. A contact arm may be formed in the webs of the two channels, and the contact arms extend inwardly from their respective webs into the hollow, intervening space. The contact arms engage each other when the channels are engaged together in a fashion so that the webs are on opposing surfaces of the contact.
The contact arms preferably extend at angles in opposite directions, so that when the two channels are assembled together, the contact arm of one of the channels, typically the top channel, will slide along and contact the contact arm of the second, or bottom channels. In this manner, multiple points of contact are achieved, both by the inner contact arms and the sidewalls of the two channels.
In another embodiment, the power contact is also formed by engaging together two channel members together, but each of the channel members includes a contact arm formed in one of the sidewalls, while the other channel sidewall includes a flat, deflectable beam, upon which the contact arm of the other channel rests. The webs of these two channels are oriented so they serve as sides of the overall power contact, and one end of each of the webs is provided with a faceplate that is bet at an angle to the channel web. These faceplates are interposed between the channel contact arms and are contacted by thc contact arms when the processor is assembled onto the power contact. The contact between the contact arms and the faceplate provide additional current paths to the power contact.
The power contacts of the present invention may be mounted on circuit board stubs that project outwardly and the stubs may project into the hollow, intervening spaces of the channels and support them in an insulating manner, without shorting the contacts but while providing an internal ground plane therein.
These and other objects, features and advantages of the present invention will be clearly understood through a consideration of the following detailed description.
In the course of this detailed description, the reference will be frequently made to the attached drawings in which:
The contacts 12 may be interconnected by a single base portion in some applications. This type of structure relies upon a single contact, or spring arm, namely the body portion 17 and free end portion 16. The contacts 12 shown have openings 18 that are formed in their base portions 14 and by which the contacts 12 may be attached to the circuit board 15 by way of soldering or fastening.
The channel members 102a, 102b may also include as shown, projections 109 in the form of bumps that provide points by which the channel members may be soldered to an opposing circuit board, semiconductor or processor. The contacts are placed together in side-by-side order in the same fashion as that with the ordinary contacts of
Each channel member 102a, b can be further seen to include a contact arm 110a, b that is formed from the channel member web and which is bent to some extent back upon the web to define a spring contact arm. These two contact arms 110a,b extend inwardly into their respect channels in different directions, as best shown in
As shown best in
As illustrated best in
This type of construction permits the contact assembly components to be mounted on a support structure 400 that has a series of individual support arms 402 that are cantilevered therefrom. This structure may be used in an interposer application and in such an application, as best shown in
In the first two embodiments, the connector components may be attached to their respective circuit boards and then snapped together into engagement.
Testing has shown that this box contact style design, with its plurality of engaging walls and multiple current paths lowers the inductance of the contact and raises the capacitance. This results in a significant decrease in the power path impedance.
While the preferred embodiment of the invention have been shown and described, it will be apparent to those skilled in the art that changes and modifications may be made therein without departing from the spirit of the invention, the scope of which is defined by the appended claims.
Number | Date | Country | |
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60498078 | Aug 2003 | US |