This disclosure relates to a method of dust conditioning of sinter band gases for an electrostatic precipitator.
The dust removal from the primary gas of a sinter band with an electrostatic precipitator (ESP) is generally a difficult process, despite the relatively low concentration of dust. This is due to the high electrical resistivity of the dust cake formed on the ESP collecting plates, owing mainly to high amounts of alkali chlorides and hydrocarbons that are present in the dust. In order to compensate for this, the size of the ESP has to be large, but even with increased size it is challenging to accomplish really low emission levels.
The raw material is then discharged from the mixing station 104 onto the sinter band 106 where the raw material is ignited and sintered. The sintered material at the end of the sinter band is crushed in a hot screening and crushing device 108 and the dust generated from the crushing is swept up in ventilation hood 306 and transported via lines 308, 310 and 322 to the secondary dust collection device 324 for treatment as detailed above.
The hot screening and crushing device 108 is in operative communication with a cooling device 110 where the temperature of the hot sintered material is reduced. Gas from the cooling process ends up in hood 312 and is transported to the secondary dust collection device 324 via lines 314, 320 and 322. The cooled sintered material is received by a cold screen 112 that discharges the material for onward transportation to, for example, a blast furnace. A ventilation hood 316 collects dust at the cold screen while gas lines 318, 320 and 322 carry the dust laden gas to the secondary dust collection device 324.
Gas and dust generated by the sintering process in the material bed on the sinter band 106 is collected in the suction boxes 202 and transported via a primary gas line 204 to the primary electrostatic precipitator 206, where the dust is collected on the collecting electrodes (collecting plates) of the ESP. The dust laden gas flowing through the primary gas line is termed the primary gas stream. The primary gases are driven via a fan 208 to the primary stack 210 and discharged to the atmosphere. It is to be noted that in the device 100 there is no fluid communication between the primary gas line and the secondary gas line and the dust in the primary gas line does not contact dust from the secondary gas line.
The dust in the primary gas stream in line 204, emanating from the sintering material on the sinter band, typically contains hydrocarbons and alkali chlorides, such that when a dust cake is formed on the collecting plates of the primary electrostatic precipitator 206 it has a very high electrical resistivity which reduces the collection efficiency of the ESP. Attempts have been made to resolve this problem by increasing the size of the ESP. This, however, is very costly and has had limited success. Other solutions to improve the ESP efficiency that have been tried are, for example, microsecond pulsing technology and moving electrode ESPs. These are expensive solutions and the increase in ESP collection efficiency is still uncertain.
It is therefore desirable to develop a method to reduce the electrical resistivity of the dust cake formed on the collecting electrodes in the primary ESP, and associated problems with particle collection efficiency, without any large scale modifications to the process or to the equipment.
Disclosed herein is a system for improving dust collection efficiency at a sinter band device, the system comprising a sinter band with material handling stations and auxiliary equipment, operative to sinter a metal or metal ore; a primary electrostatic precipitator operative to remove primary dust from a primary gas stream that has passed through a bed of sintering material on the sinter band; a secondary dust collection device operative to remove secondary dust from a secondary gas stream emanating from one or more suction points at the material handling stations and the sinter band; where the secondary dust has a lower electrical resistivity than the primary dust; and a dust transportation line that is operative to transport secondary dust to the primary gas stream downstream of the sinter band, and injecting it at a position upstream of the primary electrostatic precipitator and/or directly into the precipitator itself.
Disclosed herein too is a system for improving dust collection efficiency at a sinter band device, the system comprising a sinter band with material handling stations and auxiliary equipment, operative to sinter a metal or metal ore; a primary electrostatic precipitator operative to remove primary dust from a primary gas stream that has passed through a bed of sintering material on the sinter band; a storage facility containing conditioning dust; where the conditioning dust has a lower electrical resistivity than the primary dust; and a dust transportation line that is operative to transport conditioning dust from the storage facility to the primary gas stream downstream of the sinter band, and injecting it at a position upstream of the primary electrostatic precipitator and/or directly into the precipitator itself.
Disclosed herein too is a system for improving dust collection efficiency at a sinter band device, the system comprising a sinter band with material handling stations and auxiliary equipment, operative to sinter a metal or metal ore; a primary electrostatic precipitator operative to remove primary dust from a primary gas stream that has passed through a bed of sintering material on the sinter band; a secondary dust collection device operative to remove secondary dust from a secondary gas stream emanating from one or more suction points at the material handling stations and the sinter band; where the secondary dust has a lower electrical resistivity than the primary dust; and a gas duct that is operative to transport a slipstream of the secondary gas stream from a position upstream of the secondary dust collection device to the primary gas stream downstream of the sinter band, and injecting it at a position upstream of the primary electrostatic precipitator and/or directly into the precipitator itself.
Disclosed herein too is a method comprising discharging a primary gas stream that contains a primary dust to a primary electrostatic precipitator; where the primary gas stream has passed through a bed of sintering material on a sinter band; and injecting a dust with lower electrical resistivity than the primary dust into the primary gas stream, producing a mixed suspended dust that minimize problems associated with high resistivity when forming a dust cake on a collecting electrode in the primary electrostatic precipitator.
Disclosed herein is a method for conditioning the primary gas stream of a sinter band to increase the efficiency of the downstream electrostatic precipitator. The primary gas, which has been drawn through the material bed on the sinter band, typically contains particles of high electrical resistivity making it difficult to clean the gas in an electrostatic precipitator. The conditioning involves introducing particles of lower electrical resistivity into the primary gas stream, such that the combination of dust particles collected on the plates of the ESP forms a dust cake with significantly reduced electrical resistivity. The lower resistivity of the dust cake on the ESP collecting plates permits the ESP to operate at a high power input without significant back-ionization, thus achieving a high collection efficiency of the ESP.
In some embodiments, the dust particles with lower electrical resistivity are supplied to the primary gas stream from the secondary dust collection device. Thus, the low resistivity dust already collected in the secondary dust collection device is injected into the primary gas stream upstream of the primary ESP such that the mix of primary dust and secondary dust in the primary gas stream forms a dust cake of moderate resistivity on the collecting plates in the primary ESP. This is depicted in
In other embodiments, the low resistivity particles are supplied to the primary gas stream from an independent silo that has been added to the sinter band device. This is depicted in
In yet other embodiments, the low resistivity particles needed in the primary ESP are supplied by mixing a slipstream of the dust laden secondary gas stream into the primary gas stream. This is depicted in
With regard to
The secondary gas circuit 600 comprises lines 604, 608, 610, 614, 618, 620 and 622. The secondary gas, emanating from the suction points represented by the hoods 602, 606, 612 and 616, flows through the secondary gas circuit 600 and passes the secondary dust collection device 624 for dust separation. After cleaning the secondary gas is discharged to the atmosphere through the secondary stack 628 via a fan 626. The dust contained in the secondary gas circuit 600 has a relatively low electrical resistivity. In a preferred embodiment, the dust contained in the secondary gas circuit 600 has a volume resistivity of about 1×1011 Ω/cm (ohm-cm) or less.
With reference now again to
The crushed material then enters the cooler 410, in which the cooling gas ends up in a hood 612 for onward transfer to the secondary dust collection device 624 via lines 614, 620 and 622. The cooled material is received by a cold screen 412 that discharges the prepared material for further treatment (typically in a blast furnace for reduction to metal). A ventilation hood 616 collects dust at the cold screen and discharges the dust laden gas via lines 618, 620 and 622 to the secondary dust collection device 624.
The dust contaminated gas that has been drawn through the material bed on the sinter band 406 is collected in the suction boxes 502 and discharged via a primary gas line 504 to the primary electrostatic precipitator 506 where the dust is collected on the collecting plates. The dust laden gas flowing through the primary gas line is termed the primary gas stream. Finally, the primary gas is discharged to the atmosphere through the primary stack 510 via fan 508. As detailed earlier, the dust particles in the primary gas stream accumulate on the collecting plates of the primary ESP 506 and cause a build-up of high resistivity dust on the surface of the plates that reduces the efficiency of the primary ESP 506. The main reason for the resistivity problem is that dust in the primary gas that has passed through the material bed on the sinter band contains hydrocarbons and alkali chlorides. The dust generally has an electrical resistivity greater than 1×1012 Ωcm, which is high enough to cause problems with back-ionization in the collected dust layer and significantly reduce the collection efficiency of the primary ESP 506.
In order to prevent the creation of a dust cake with very high resistivity buildup on the ESP collecting plates, a dust with much lower electrical resistivity is mixed into the primary gas stream. A source of particles with low resistivity is the secondary dust collected in the secondary dust collection device from the secondary gas stream. This solution is exemplified in
The dust with low resistivity needed to condition the primary gas may also be taken from other sources inside or outside the integrated plant housing the sinter band.
Another way to condition the primary gas with low resistivity dust is to directly utilize the suspended particles in the secondary gas stream before they are collected in the secondary dust collection device. As exemplified in
The amount of low resistivity particles that facilitate the formation of a dust cake with suitable resistivity depends upon the properties (size, shape, electrical resistivity, and the like) of the low resistivity particles from the secondary gas stream versus the properties of the high resistivity particles present in the primary gas stream. In an embodiment, the content of low resistivity particles is greater than 20 wt %, preferably greater than 50 wt % and more preferably greater than 80 wt %, of the total weight of the dust entering the primary ESP 506.
In general, there is a strong non-linear relation between the resulting resistivity of a mixture of dust types and the resistivity and amount of the individual dusts. The key understanding is that the increased ESP performance that can be achieved with lower dust resistivity dominates the increased dust concentration and increased gas flow to the primary ESP. This is demonstrated by the theoretical example in
The presented method of dust conditioning in the primary sinter band gases is advantageous in that it avoids expanding the size of the ESP and consequent costs associated with such an expansion. This design is also advantageous because in existing sinter plants most of the dust collected in both the primary ESP and the secondary dust collection device is typically recycled back to the sinter band feed. Thus there is already some material handling in place, and the dust will still end up in the same place, with the only difference being that the secondary dust takes the path via the primary ESP. This improvement may therefore be performed on existing equipment as a simple retrofit.
Another positive factor that could further increase the perceived positive effect of the method concerns the rapping of the collecting plates. The dust cake formed on the collecting plates, conditioned with the secondary dust, not only obtains a lower electrical resistivity, but also higher density and reduced adhesion force. Both these factors, together with the lower resistivity, enhance the cleaning efficiency of the plates during rapping. The high amount of heavier, metal-rich, particles from the secondary dust thus creates a more porous dust cake with lower adhesion and with higher density that will dislodge easily during rapping. In conventional ESPs for primary gases, the cleaning of the collecting plates has always been a significant problem, which is further accentuated by the long-term increase of resistivity in the precipitated dust layer due to e.g., polarization of alkali chlorides. With the addition of secondary dust to the dust cake the cleaning of the plates of the primary ESP becomes more efficient.
The method of mixing a dust with lower resistivity into a primary dust laden gas stream to alleviate high resistivity problems in a downstream ESP may be advantageously used not only in sinter band devices but also in other processes utilizing ESPs for particle separation (e.g., coal-fired power plants, cement plants, and the like).
It will be understood that, although the terms “first,” “second,” “third” etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, “a first element,” “component,” “region,” “layer” or “section” discussed below could be termed a second element, component, region, layer or section without departing from the teachings herein.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, singular forms like “a” or “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising” or “includes” and/or “including” when used in this specification, specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and/or groups thereof.
Furthermore, relative terms, such as “lower” or “bottom” and “upper” or “top,” may be used herein to describe one element's relationship to other elements as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. For example, if the device in one of the figures is turned over, elements described as being on the “lower” side of other elements would then be oriented on “upper” sides of the other elements. The exemplary term “lower,” can therefore, encompasses both an orientation of “lower” and “upper,” depending on the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as “below” or “beneath” other elements would then be oriented “above” the other elements. The exemplary terms “below” or “beneath” can, therefore, encompass both an orientation of above and below.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Exemplary embodiments are described herein with reference to cross section illustrations that are schematic illustrations of idealized embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region illustrated or described as flat may, typically, have rough and/or nonlinear features. Moreover, sharp angles that are illustrated may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the present claims.
The term and/or is used herein to mean both “and” as well as “or”. For example, “A and/or B” may be construed to mean A, B or A and B.
The transition term “comprising” is inclusive of the transition terms “consisting essentially of” and “consisting of” and can be interchanged for “comprising”.
While this disclosure describes exemplary embodiments, it will be understood by those skilled in the art that various changes can be made and equivalents can be substituted for elements thereof without departing from the scope of the disclosed embodiments. In addition, many modifications can be made to adapt a particular situation or material to the teachings of this disclosure without departing from the essential scope thereof. Therefore, it is intended that this disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this disclosure.
Number | Date | Country | Kind |
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15185402.3 | Sep 2015 | EP | regional |
Filing Document | Filing Date | Country | Kind |
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PCT/EP2016/071525 | 9/13/2016 | WO | 00 |