The invention is in the field of electronics. More specifically, the invention relates to an electric component, a pin header and a method of manufacturing such a component.
In the field of electronics, electric components are nowadays expected to meet a variety of requirements regarding ease of manufacturing, life expectancy, ease of repair or replacement, design aspects etc. Since many of such electric components are bulk products, such as light components (LED's) or sensor components, the costs of such components are also critical.
Moulding is a well known and advantageous technique for manufacturing (parts of) such electric components. Typically, a polymer is used as a moulding material. During a moulding step of a part of the electric component, the moulding material may get poured into undesired places of the product due to pressure and the viscous nature of the moulding material.
It is an object of the invention to provide an improved product and method that reduces the probability the moulding material ends up in undesired places in the product.
Aspects of the invention are defined in claims 1, 9, 10, 11 and 15.
By appropriate structuring of at least one of the first member and the frame, the leads of the frame may extend through the corresponding openings in the first member, while the remaining part of these lead openings is substantially closed by the structures before moulding. As a consequence, during moulding, moulding material cannot leak through the opening along the leads to undesired places in the electric component.
The moulding material is advantageously injected under low pressure, e.g. below 20 atmospheres or below 10 atmospheres, in order to further reduce the probability of undesired leakage of moulding material. The moulding material may have a lower melting point than the melting point of the frame material.
The embodiment of the invention according to claim 2 provides for an appropriate protection of the frame and a major part of the leads from the environment and to provide a mechanically strong component.
The embodiment of the invention according to claim 3 allows the frame to determine the distance between the first and second member, i.e. the frame has a spacer function. Consequently, the frame (and not the leads) carries the force exerted on the second member during moulding.
The structures may close each opening individually, as defined or multiple holes. Closing each opening individually is applicable if the pitch of the leads is sufficiently large to allow a corresponding structure around each lead. Structures surrounding multiple leads can be applied for smaller pitches.
The embodiments of the invention as defined in claims 7 and 13 save material and reduce the weight of the frame. Moreover, the insertion force for inserting the leads into openings of the frame is reduced.
The embodiments of the invention as defined in claims 4 and 14 provides for an appropriate contact force of the leads against the second member (before installation, the leads extend further from the frame than the stand-off structures), while in the installed position the stand-off structures abut against the second member to carry forces exerted on the second member.
The embodiment of claim 8 allows for easy replacement of the electronic component upon malfunction.
The invention will hereafter be more fully explained with reference to the drawings showing different embodiments of the invention by way of example.
The electric component has a planar first member 1 made of plastic having a first side I and a second side II through which openings 2 extend.
The first side I is intended for positioning a connector header 3 comprising a frame 4 with leads or pins 5, also referred to as pin header. The second side II has a space 6 wherein means 7 for locking and unlocking a connector (not shown) are provided in order to allow replacement of the electric component.
The latter connector can be connected to the leads 5 by positioning the pin header 3 on the first member as illustrated in
Examples of electric components include light-emitting devices for e.g. a video wall or sensors. Such electronic products are typically connected to a connector having contact corresponding to the leads 5 of the pin header 3. Guiding poles 21 are provided to facilitate such connection. It should be noted that locking means 7, as indicated in space 6 of
The pin header 30 of
The first portion 31, intended to face the first member 1 of the electric component, is provided with the cone-shaped structures 8 around each of the leads 5 (See
The pin header 30 may be produced by moulding the plastic frame 4 in an appropriate mould, followed by inserting the pins 5 and bending them at the second portion 32. Bending is performed such that the bent portions extend a little further from the surface S of the second portion than the end surfaces of the stand-off structures 35. The pins 5 may also be insert-moulded in the frame 4.
As a result of bending the leads 5 as described above, a good electrical connection between the leads 5 and contacts (not shown) of the second member 40 is guaranteed, while the abutment of the stand-off structures 35 against the surface of the second member 40 ensures that forces exerted on the second member are carried by the frame 4.
Clearly, each of the leads 5 is surrounded individually by a cone-like structure 8.
Subsequently, as illustrated in
It should be noted that the header 30 and the second member 40 may abut each other for example via the bent part of the pins and/or or the stand-off structures 35 so as to press in the mould the surface of the header or structures 8 against the corresponding surface of the first component. Controlling this pressure avoid leaks of material 10 through the openings 2.
It should be noted that the structures 8, 9 configured for substantially closing the openings 2 may come in a variety of shapes. Exemplary embodiments are shown in
In
Structures 8 surrounding multiple leads can be applied for smaller pitches. In
Again, it should be noted that the header 30 and the second member 40 may be pressed, with a controlled pressure, against each other via the bent part of the pins or the stand-off structures 35 so as to avoid leaks of material 10 through the openings 2.
Both the structures of
The invention provides an improved product and an economical and time shortened method for manufacturing an electrical product that reduces the probability the moulding material ends up in undesired places in the product.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/IB2008/055640 | 11/7/2008 | WO | 00 | 6/27/2011 |