Moulds

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H01L21/565

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/565Moulds

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages including dam patterns and methods for manuf...
- Patent number 12,368,134
- Issue date Jul 22, 2025
- SK hynix Inc.
- Shin Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having underfill material surrounding a...
- Patent number 12,368,127
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-die semiconductor devices and corresp...
- Patent number 12,368,055
- Issue date Jul 22, 2025
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting InFO packages to reduce warpage
- Patent number 12,368,115
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode package structure and manufacturing method thereof
- Patent number 12,369,443
- Issue date Jul 22, 2025
- Lextar Electronics Corporation
- Yu-Jing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with ring structure
- Patent number 12,362,197
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for manufacturing an electronic package
- Patent number 12,362,267
- Issue date Jul 15, 2025
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making double shielding layers o...
- Patent number 12,362,287
- Issue date Jul 15, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
- Patent number 12,362,325
- Issue date Jul 15, 2025
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including direct-contact heat paths and methods of manufa...
- Patent number 12,362,255
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,362,321
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with a metal oxide coating and method of forming the same
- Patent number 12,362,195
- Issue date Jul 15, 2025
- STMICROELECTRONICS INTERNATIONAL N.V.
- Luca Maria Carlo Di Dio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor device and manufacturing method of molded semi...
- Patent number 12,358,194
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Feng Weng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,354,969
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with external power sensor
- Patent number RE50485
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Juergen Hoegerl
Information Patent Grant
Omni directional interconnect with magnetic fillers in mold matrix
- Patent number 12,354,883
- Issue date Jul 8, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including photo imageable dielectric
- Patent number 12,354,974
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Yuseon Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,355,005
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package comprising a package-on-package (PoP) arch...
- Patent number 12,347,743
- Issue date Jul 1, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding device with self-blocking feed channel
- Patent number 12,347,701
- Issue date Jul 1, 2025
- Robert Bosch GmbH
- Martin Fleischmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device
- Patent number 12,347,757
- Issue date Jul 1, 2025
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection apparatus, manufacturing method of integrated circuit, a...
- Patent number 12,347,708
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of three-dimensional integrated circuit by encapsulation...
- Patent number 12,347,763
- Issue date Jul 1, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a resin member having a rib includi...
- Patent number 12,347,741
- Issue date Jul 1, 2025
- Mitsubishi Electric Corporation
- Nobuyoshi Kimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly and manufacturing method thereof
- Patent number 12,345,935
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,341,106
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES
- Publication number 20250236955
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
- Publication number 20250239548
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yung Lin Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250239536
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250239569
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Device and Manufacturing Method Thereof
- Publication number 20250233116
- Publication date Jul 17, 2025
- DIODES INCORPORATED
- Shu-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
- Publication number 20250232978
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233089
- Publication date Jul 17, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
- Publication number 20250232979
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20250229512
- Publication date Jul 17, 2025
- AGC Inc.
- Tetsuo ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking and Interconnecting Sem...
- Publication number 20250226345
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- YongMoo SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BO...
- Publication number 20250218800
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20250218919
- Publication date Jul 3, 2025
- HEFEI SMAT TECHNOLOGY CO. LTD.
- Xiaochun TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR PROCESSING SINGULATED SUBSTRATES
- Publication number 20250218798
- Publication date Jul 3, 2025
- Octavo Systems LLC
- Erik WELSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20250218886
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE
- Publication number 20250218801
- Publication date Jul 3, 2025
- LINTEC CORPORATION
- Kanako KONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR
- Publication number 20250210536
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20250210544
- Publication date Jun 26, 2025
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...
- Publication number 20250210852
- Publication date Jun 26, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250210552
- Publication date Jun 26, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2.5D PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250210612
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hyoungjoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVES TO FACILITATE MOLD COMPOUND FLOW
- Publication number 20250201774
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chittranjan Mohan GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...
- Publication number 20250201784
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS
- Publication number 20250201675
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250201676
- Publication date Jun 19, 2025
- INFINEON TECHNOLOGIES AG
- Achim Althaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MONITORING HYBRID BONDS IN A SEMICONDUCTOR CHIP PACKAGE
- Publication number 20250201638
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING PACKAGES WITH DUMMY DIES HAVING A CONSTRUCTION THAT MIM...
- Publication number 20250201645
- Publication date Jun 19, 2025
- Microsoft Technology Licensing, LLC
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED BODY, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFAC...
- Publication number 20250197577
- Publication date Jun 19, 2025
- AGC Inc.
- Seigo KOTERA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES
- Publication number 20250201677
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250201695
- Publication date Jun 19, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages including dam patterns and methods for manuf...

Package structure and manufacturing method thereof

Semiconductor chip package having underfill material surrounding a...

Method of manufacturing multi-die semiconductor devices and corresp...

Supporting InFO packages to reduce warpage

Diode package structure and manufacturing method thereof

Semiconductor die package with ring structure

Methods of packaging semiconductor devices and packaged semiconduct...

Electronic package and method for manufacturing an electronic package

Semiconductor device and method of making double shielding layers o...

Monolithic chip stacking using a die with double-sided interconnect...

Semiconductor package and method of manufacturing semiconductor pac...

Apparatus including direct-contact heat paths and methods of manufa...

Semiconductor package

Leadframe with a metal oxide coating and method of forming the same

Molded semiconductor device and manufacturing method of molded semi...

Semiconductor device and method of manufacture

Semiconductor module with external power sensor

Omni directional interconnect with magnetic fillers in mold matrix

Semiconductor package including photo imageable dielectric

Semiconductor package and method of fabricating the same

Microelectronics package comprising a package-on-package (PoP) arch...

Molding device with self-blocking feed channel

Semiconductor device and measurement device

Inspection apparatus, manufacturing method of integrated circuit, a...

Packaging of three-dimensional integrated circuit by encapsulation...

Semiconductor device comprising a resin member having a rib includi...

Package assembly and manufacturing method thereof

Package structure

Resin shaping device

Patents Applicationslast 30 patents

CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES

BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Electronic Device and Manufacturing Method Thereof

SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS

FILM AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

Semiconductor Device and Method of Stacking and Interconnecting Sem...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BO...

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD

METHODS AND DEVICES FOR PROCESSING SINGULATED SUBSTRATES

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR

PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...

ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...

SEMICONDUCTOR DEVICE PACKAGE

2.5D PACKAGE AND METHOD OF MANUFACTURING THE SAME

PASSIVES TO FACILITATE MOLD COMPOUND FLOW

SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

STRUCTURE FOR MONITORING HYBRID BONDS IN A SEMICONDUCTOR CHIP PACKAGE

FABRICATING PACKAGES WITH DUMMY DIES HAVING A CONSTRUCTION THAT MIM...

LAYERED BODY, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFAC...

CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF