Moulds

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CPC
H01L21/565

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/565Moulds

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 12,322,603
- Issue date Jun 3, 2025
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in package having antenna on package substrate
- Patent number 12,322,856
- Issue date Jun 3, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 12,322,725
- Issue date Jun 3, 2025
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,322,742
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,322,691
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating features for laser drilling process
- Patent number 12,322,716
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming RDLs and structure formed thereof
- Patent number 12,315,819
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package comprising a package-on-package (POP) arch...
- Patent number 12,315,777
- Issue date May 27, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, electronic device package and method for manufac...
- Patent number 12,315,828
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a fan-out panel level semiconductor package
- Patent number 12,315,822
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jeongho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 12,315,769
- Issue date May 27, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 12,308,329
- Issue date May 20, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating and accessing passive components in wafer-level packages
- Patent number 12,308,335
- Issue date May 20, 2025
- Intel Corporation
- Gianni Signorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 12,308,323
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 12,300,655
- Issue date May 13, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning bumps in fan-out packaging process
- Patent number 12,300,659
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,629
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Youngwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor package with internal gull wing lead structures
- Patent number 12,300,586
- Issue date May 13, 2025
- NXP USA, INC.
- Pat Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,665
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Jang-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,300,560
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 12,300,574
- Issue date May 13, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat sink with exposed side from enc...
- Patent number 12,300,584
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 12,293,974
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module having a compartment shield structure
- Patent number 12,293,975
- Issue date May 6, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 12,293,949
- Issue date May 6, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20250183213
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...
- Publication number 20250183123
- Publication date Jun 5, 2025
- Alpha and Omega Semiconductor International LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...
- Publication number 20250183245
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICOND...
- Publication number 20250178245
- Publication date Jun 5, 2025
- Namics Corporation
- Yu SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER STAGE PACKAGE WITH HALF BRIDGE-CONNECTED TRANSISTOR CHIPS AND...
- Publication number 20250183232
- Publication date Jun 5, 2025
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-WAFER RDLS IN CONSTRUCTED WAFERS
- Publication number 20250183058
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MAKING A SEMICONDUCTOR DEVICE
- Publication number 20250183138
- Publication date Jun 5, 2025
- STATS ChipPAC Pte Ltd.
- JungSub LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20250174591
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250174576
- Publication date May 29, 2025
- MEDIATEK INC.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
- Publication number 20250174523
- Publication date May 29, 2025
- Intel Corporation
- Ravindranath MAHAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250174612
- Publication date May 29, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174603
- Publication date May 29, 2025
- KIOXIA Corporation
- Akihito SAWANOBORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...
- Publication number 20250174509
- Publication date May 29, 2025
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TESTING SEMICONDUCTOR PACKAGE
- Publication number 20250174499
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-HUI LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20250167007
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS
- Publication number 20250167142
- Publication date May 22, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20250167060
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURE SENSOR CAVITIES
- Publication number 20250164296
- Publication date May 22, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250167138
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD
- Publication number 20250167183
- Publication date May 22, 2025
- Intel Corporation
- David O'SULLIVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250167061
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250157949
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250157958
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure and Manufacturing Method Therefor
- Publication number 20250157945
- Publication date May 15, 2025
- Huawei Technologies Co., Ltd
- Xuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHOD AND LEAD FRAME WITH SIDE PO...
- Publication number 20250157829
- Publication date May 15, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Mark Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20250157870
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD
- Publication number 20250157998
- Publication date May 15, 2025
- ROBERT BOSCH GmbH
- Dorothea Papathanassiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20250157974
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF THREE-DIMENSIONAL STACKING STRUCTURE
- Publication number 20250157984
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package and manufacturing method thereof

Device and method for UBM/RDL routing

Method of manufacturing semiconductor devices and corresponding sem...

Power module semiconductor device and inverter equipment, and fabri...

Antenna in package having antenna on package substrate

Chip package and method of forming the same

Semiconductor device and method of forming insulating layers around...

Semiconductor structure and manufacturing method thereof

Package structure and method of manufacturing the same

Heat dissipating features for laser drilling process

Method of forming RDLs and structure formed thereof

Microelectronics package comprising a package-on-package (POP) arch...

Package substrate, electronic device package and method for manufac...

Package structure and manufacturing method thereof

Methods of manufacturing a fan-out panel level semiconductor package

Build-up package for integrated circuit devices, and methods of mak...

Chiplet first architecture for die tiling applications

Integrating and accessing passive components in wafer-level packages

Package-on-package device

Integrated circuit assembly with hybrid bonding

Aligning bumps in fan-out packaging process

Semiconductor package and method of fabricating the same

Leadless semiconductor package with internal gull wing lead structures

Semiconductor package

Semiconductor device package and method of manufacturing the same

Adhesive and thermal interface material on a plurality of dies cove...

Semiconductor device including heat sink with exposed side from enc...

Photonics integrated circuit package

High-frequency module having a compartment shield structure

Semiconductor module and method for manufacturing semiconductor module

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...

SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...

LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICOND...

POWER STAGE PACKAGE WITH HALF BRIDGE-CONNECTED TRANSISTOR CHIPS AND...

CROSS-WAFER RDLS IN CONSTRUCTED WAFERS

SEMICONDUCTOR DEVICE AND A METHOD FOR MAKING A SEMICONDUCTOR DEVICE

Semiconductor Die Connection System and Method

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...

METHOD OF TESTING SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

MINIATURE SENSOR CAVITIES

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Chip Package Structure and Manufacturing Method Therefor

SEMICONDUCTOR DEVICE FABRICATION METHOD AND LEAD FRAME WITH SIDE PO...

PACKAGE STRUCTURES

MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

MANUFACTURING METHOD OF THREE-DIMENSIONAL STACKING STRUCTURE