This application relates to the field of communication technologies, and in particular, to an electrical connection socket, a photoelectric module, a cage, and an electronic device.
When the Ethernet is used to supply power to an electronic device, an additional power over Ethernet (POE) interface needs to be disposed on the electronic device. However, the POE interface increases complexity of a structure of the electronic device, and increases a size of the electronic device. To resolve this problem, in the conventional technology, light and electricity are combined to form an integrated connection solution. In a structure shown in
However, after the electrical connection socket 10 is matched with the optical module as shown in
This application provides an electrical connection socket, a photoelectric module, a cage, and an electronic device, to increase a distance between a power terminal and an electrical signal slot in the electrical connection socket, and increase a distance between the power terminal and a metal housing of a module in a matching direction when the electrical connection socket is matched with the module.
According to a first aspect, this application provides an electrical connection socket. The electrical connection socket includes an insulated substrate. Specifically, the insulated substrate has an upper surface, a lower surface, and a side surface used to match with a to-be-plugged module, and the insulated substrate includes at least one plug portion. It should be understood that each of the at least one plug portion may be connected to one to-be-plugged module. Specifically, each plug portion includes an electrical connection area used to connect to a power terminal in the to-be-plugged module and a signal connection area used to connect to a signal terminal in the to-be-plugged module. At least two power terminals are disposed in the electrical connection area, one end of each of the at least two power terminals is disposed in the insulated substrate, and the other end extends to the lower surface of the insulated substrate through the insulated substrate. It should be noted that the power terminal has a connection section used to connect to the power terminal in the to-be-plugged module, and a connection port of the connection section is located on the side surface of the insulated substrate. For the signal connection area, the signal connection area is provided with an electrical signal slot, and an opening of the electrical signal slot is located on the side surface of the insulated substrate. Therefore, in the electrical connection socket provided in this application, both the connection port of the power terminal and the connection port of the electrical signal slot are located on the side surface of the insulated substrate. It should be understood that because the connection section of the power terminal and the electrical signal slot have a distance difference in a direction perpendicular to the lower surface of the insulated substrate, the connection section of the power terminal and the electrical signal slot are arranged vertically. In view of this, a distance between the connection section and the electrical signal slot may be increased by adjusting a position of the connection section of the power terminal, to improve an electromagnetic compatibility (EMC) capability of the electrical connection socket provided in this embodiment of this application, so that the electrical connection socket can meet an EMC certification standard. In addition, because the electrical signal slot in the electrical connection socket provided in this application exceeds the connection section on a matching interface, there is a distance difference between the connection section and the electrical signal slot in a direction perpendicular to the side surface of the insulated substrate. In view of this, in the matching direction, a distance between a metal housing in the to-be-plugged module and the power terminal can be increased, to meet a safety standard.
In a specific implementation, the insulated substrate has a concave portion whose opening is located on the side surface, and the connection port of the connection section is located on a bottom of the concave portion. The concave portion may further assist in adjusting the distance between the metal housing in the to-be-plugged module and the power terminal.
In a specific implementation, the electrical signal slot includes a first inner surface and a second inner surface that are disposed opposite to each other, and along a direction from the upper surface to the lower surface of the insulated substrate, the electrical connection socket further includes:
In a specific implementation, an extension direction of the connection section of the power terminal is parallel to an extension direction of the electrical signal slot, and along an arrangement direction of the connection section and the electrical signal slot, a distance between the connection section of the power terminal and the upper signal pin is greater than 1.4 mm. This resolves a small distance between the connection section of the power terminal and the upper signal pin, supports a transmission rate of 10/25/56 Gbps, and implements downward compatibility with a standard optical module, to meet an admission standard related to a device, and implement integrated photoelectric pluggable application of a 1U/48-port switch.
In a specific implementation, the insulated substrate includes a connection portion. Specifically, the electrical connection socket provided in this application is of a single-layer structure. When the electrical connection socket provided in this application is of a single-layer structure, the insulated substrate may include a first insulated substrate and a second insulated substrate, the power terminal is disposed on the first insulated substrate, and the second insulated substrate is provided with the electrical signal slot. It is clear that the first insulated substrate and the second insulated substrate may be separated, which is easy to disassemble and assemble, or may be integrated.
In a specific implementation, the insulated substrate has a central surface, the central surface is located between the upper surface and the lower surface and is parallel to the lower surface, the insulated substrate includes two plug portions, and the two plug portions are symmetrically disposed relative to the central surface. Specifically, the electrical connection socket provided in this application is of a two-layer structure, to increase density of a connector.
According to a second aspect, this application provides a photoelectric module, including a housing; and a circuit board disposed in the housing, where an electrical signal terminal is disposed on the circuit board, and the electrical signal terminal is configured to be plugged and connected to the electrical signal slot of any electrical connection socket, to transmit a signal between the photoelectric module and the electrical connection socket. The photoelectric module further includes at least two power terminals. The at least two power terminals are insulated from the housing, one end of the at least two power terminals protrudes from a front end of the housing, and another end is connected to a flexible circuit board in the housing. The at least two power terminals are electrically connected to at least two power terminals in the electrical connection socket in a one-to-one correspondence, to couple a power supply voltage to an electronic device.
The photoelectric module is adapted to a structure of the electrical connection socket provided in this application. When the photoelectric module is used as a to-be-plugged module, a connection section of each of the at least two power terminals in the electrical connection socket is correspondingly connected to the power terminals in the photoelectric module, to transmit power between the to-be-plugged module and the electrical connection socket. In addition, the electrical signal terminal in the photoelectric module may be plugged and connected to the electrical signal slot in the electrical connection socket provided in this application, to implement signal transmission.
In a specific implementation, an insulated substrate is disposed on the front end of the housing, the at least two power terminals are telescopically disposed inside the insulated substrate, one end of the at least two power terminals passes through the insulated substrate and protrudes from the housing, and another end passes through the insulated substrate and is connected to the circuit board in the housing.
In a specific implementation, the electrical signal terminal is a multi-source agreement MSA edge connector terminal.
In a specific implementation, the photoelectric module is a small form-factor pluggable SFP module.
According to a third aspect, this application provides a cage, including a cage housing and a cavity enclosed by the cage housing. The cavity is configured to accommodate any electrical connection socket and any photoelectric module in the foregoing.
According to a fourth aspect, this application provides an electronic device, including any electrical connection socket, any photoelectric module, and any cage in the foregoing. This can implement integrated photoelectric transmission and integrated plugging.
First, an application scenario of this application is described. Electronic devices such as a wireless access point (AP) device and a network camera are usually installed in an area such as an enterprise campus, an indoor ceiling, or a building wall. Because the devices are in distributed layout, obtaining power in a nearby manner increases additional user costs. Therefore, a power over Ethernet (POE) manner is usually used to supply power for the electronic devices.
When the power over Ethernet manner is used, a conventional optical module is disposed on the electronic device to connect to an optical fiber connector, and an additional POE interface further needs to be disposed on the electronic device to connect to an Ethernet connector. However, the additional POE interface disposed on the electronic device increases complexity of a structure of the electronic device, and increases a size of the electronic device.
To resolve this problem, in the conventional technology, light and electricity are combined to form an integrated connection solution. However, in the integrated connection solution of an electrical connection socket 10 and an optical module 20 shown in
Based on the application scenario, this application provides an electronic device, so that all mechanical parts in the electronic device meet safety and electromagnetic compatibility (EMC) standards.
Terms used in the following embodiments are merely intended to describe specific embodiments, but are not intended to limit this application. The terms “one”, “a” and “this” of singular forms used in this specification and the appended claims of this application are also intended to include expressions such as “one or more”, unless otherwise specified in the context clearly.
Reference to “an embodiment”, “some embodiments”, or the like described in this specification indicates that one or more embodiments of this application include a specific feature, structure, or characteristic described with reference to embodiments. Therefore, statements such as “in an embodiment”, “in some embodiments”, “in some other embodiments”, and “in other embodiments” that appear at different places in this specification do not necessarily mean referring to a same embodiment. Instead, the statements mean “one or more but not all of embodiments”, unless otherwise specifically emphasized in another manner. The terms “include”, “have”, and their variants all mean “include but are not limited to”, unless otherwise specifically emphasized in another manner.
The following clearly and describes the technical solutions in embodiments of this application with reference to the accompanying drawings in embodiments of this application.
In the structure shown in
To more clearly and intuitively indicate a connection relationship between the electrical connection socket 1 and the photoelectric module 2, a structure in
The following describes in detail a structure of the plug portion Q1. With reference to
It should be understood that a quantity of power terminals 111 in the plug portion Q1 is not limited to two shown in
In
In the structure shown in
Specifically, as shown in
It should be understood that a minimum distance between the connection section L and the upper signal pin 1123 is H, and the distance H may be designed to increase, to avoid interference of a power supply pulse of the power terminal 111 when the upper signal pin 1123 transmits a high-speed signal at a transmission rate of more than 10 Gbps. This can improve the EMC capability of the electrical connection socket 1 provided in this embodiment of this application, so that the electrical connection socket 1 can meet the EMC certification standard. For example, H may be set to be greater than 1.4 mm. It should be noted that, when the electrical connection socket 1 is matched with the photoelectric module 2 provided in this embodiment of this application, the upper signal pin 1123 in the electrical signal slot 112 bounces up a specific distance in a direction close to the upper surface S1. The minimum distance between the connection section L and the upper signal pin 1123 is a minimum distance between the connection section L and the upper signal pin 1123 after the upper signal pin bounces up.
It is clear that the structure of the connection section L of the power terminal 111 is not limited to the structure in
When the electrical connection socket 1 provided in this application is matched with the photoelectric module 2 provided in this application, because the photoelectric module 2 is adapted to the structure of the electrical connection socket 1, power and an electrical signal can be transmitted between the photoelectric module 2 and the electrical connection socket 1. A specific structure of the photoelectric module 2 provided in this application is described in detail subsequently.
It is clear that the electrical connection socket 1 provided in this application can be connected to the photoelectric module 2 provided in this application, and can further be applied to various encapsulation interface modules, for example, a small form-factor pluggable (SFP) encapsulated optical module, an electrical interface module, and a quad small form-factor pluggable (QSFP) encapsulated optical module. Specifically, the electrical signal slot 112 in the electrical connection socket 1 provided in this application can be adapted to various types of to-be-plugged modules.
When the to-be-plugged module is a common module 2′ shown in
It is clear that as a structure shown in
The plug portion Q1 and the plug portion Q2 are symmetrically disposed relative to the central surface 0, the structure in the plug portion Q2 and the structure in the plug portion Q1 are in a “mirror” state. Therefore, the structure inside the plug portion Q2 is not further described herein.
In addition, the electrical connection socket 1 provided in this application may alternatively include only the plug portion Q1. Specifically, in a structure shown in
It should be noted that in the structure shown in
It is clear that, in the structure shown in
In addition, the insulated substrate 11 may be disposed as two separate parts. Specifically, in a structure shown in
When the photoelectric module 2 provided in this embodiment of this application is matched with the electrical connection socket 1, and the electrical connection socket 1 is the electrical connection socket 1 shown in
During specific setting, because a preparation material of the housing 21 is usually metal, an insulated structure between the power terminal 23 and the housing 21 may be shown in
The photoelectric module 2 provided in this embodiment of this application may be matched with the electrical connection socket 1 provided in this embodiment of this application, and may further be connected to a common electrical connection socket 1′ (a socket different from the electrical connection socket 1 provided in this embodiment of this application is defined as a common electrical connection socket 1′) shown in
When the photoelectric module 2 provided in this embodiment of this application is matched with the common electrical connection socket 1′, the power terminal 23 in the photoelectric module 2 abuts against a side surface of the common electrical connection socket 1′. In view of this, the power terminal 23 shown in
It is clear that the common electrical connection socket 1′ is not limited to the structure in
It should be understood that, when the photoelectric module 2 provided in this application is matched with the electrical connection socket 1 provided in this application, the electrical connection socket 1 may have a different electrical signal slot 112 based on a different model of the electrical signal terminal 221 in the photoelectric module 2. For example, when the electrical signal terminal 221 in the photoelectric module 2 is a multi-source agreement (MSA) edge connector terminal, the electrical signal slot 112 in the electrical connection socket 1 may be an MSA edge connector slot.
It should be noted that, the photoelectric module 2 provided in this application may be prepared by adding at least one pair of telescopic elastic power terminals 23 based on a current standard small form-factor pluggable SFP module.
The foregoing descriptions are merely specific implementations of this application, but are not intended to limit the protection scope of this application. Any variation or replacement readily figured out by a person skilled in the art within the technical scope disclosed in this application shall fall within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.
Number | Date | Country | Kind |
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202011323961.8 | Nov 2020 | CN | national |
202011457092.8 | Dec 2020 | CN | national |
This application is a continuation of International Application No. PCT/CN2021/106234, filed on Jul. 14, 2021, which claims priority to Chinese Patent Application No. 202011323961.8, filed on Nov. 23, 2020 and Chinese Patent Application No. 202011457092.8, filed on Dec. 11, 2020. All of the aforementioned patent applications are hereby incorporated by reference in their entireties.
Number | Date | Country | |
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Parent | PCT/CN2021/106234 | Jul 2021 | US |
Child | 18320372 | US |