Electrical connection to keycap

Abstract

There is disclosed in an example a key having a tactile element; and a flexible and conductive external element disposed over the tactile element. There is also disclosed an example method of manufacturing the key, and an electronic device comprising a plurality of active keys, including at least one of the key.

Description

This application is a national stage application under 35 U.S.C. § 371 of PCT International Application Serial No. PCT/US2016/068775, filed on Dec. 28, 2016 and entitled “ELECTRICAL CONNECTION TO KEYCAP”, which application is considered part of and is hereby incorporated by reference in its entirely in the disclosure of this application.

FIELD OF THE SPECIFICATION

This disclosure relates in general to the field of electronics, and more particularly, though not exclusively to, a system and method for an electrical connection to a keycap.

BACKGROUND

Tactile keyboards provide physical feedback to users, thus improving the keyboarding experience.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detailed description when read with the accompanying figures. It is emphasized that, in accordance with the standard practice in the industry, various features are not necessarily drawn to scale, and are used for illustration purposes only. Where a scale is shown, explicitly or implicitly, it provides only one illustrative example. In other embodiments, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1A is a simplified schematic diagram illustrating a perspective view of an embodiment of an electronic device, in accordance with one embodiment of the present disclosure;

FIG. 1B is a simplified schematic diagram illustrating a perspective view of an embodiment of an electronic device, in accordance with one embodiment of the present disclosure;

FIG. 2A is a simplified schematic diagram illustrating a plan view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 2B is a simplified schematic diagram illustrating a plan view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 3 is a simplified schematic diagram illustrating an orthographic view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 4 is a simplified schematic diagram illustrating an orthographic view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 5A is a simplified schematic diagram illustrating an orthographic view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 5B is a simplified schematic diagram illustrating an orthographic view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 6A is a simplified schematic diagram illustrating an orthographic view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 6B is a simplified schematic diagram illustrating an orthographic view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 6C is a simplified schematic diagram illustrating an orthographic view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 6D is a simplified schematic diagram illustrating an orthographic view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 6E is a simplified schematic diagram illustrating an orthographic view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 6F is a simplified schematic diagram illustrating an orthographic view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 7 is a simplified schematic diagram illustrating a side block diagram view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 8 is a simplified schematic diagram illustrating a side block diagram view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 9 is a simplified a simplified flow diagram illustrating potential operations associated with one embodiment of the present disclosure;

FIG. 10 is a simplified a simplified flow diagram illustrating potential operations associated with one embodiment of the present disclosure;

FIG. 11 is a simplified schematic diagram illustrating a side block diagram view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 12 is a simplified schematic diagram illustrating a side block diagram view of an embodiment of a portion of a keyboard, in accordance with one embodiment of the present disclosure;

FIG. 13 is a simplified schematic diagram illustrating an exploded block diagram view of an embodiment of a portion of a key, in accordance with one embodiment of the present disclosure;

FIG. 14A is a simplified schematic diagram illustrating a block diagram view of an embodiment of a portion of a key, in accordance with one embodiment of the present disclosure;

FIG. 14B is a simplified schematic diagram illustrating a block diagram view of an embodiment of a portion of a key, in accordance with one embodiment of the present disclosure;

FIG. 15A is a simplified schematic diagram illustrating a block diagram view of an embodiment of a portion of a key, in accordance with one embodiment of the present disclosure;

FIG. 15B is a simplified schematic diagram illustrating a block diagram view of an embodiment of a portion of a key, in accordance with one embodiment of the present disclosure;

FIG. 16 is a simplified schematic diagram illustrating an exploded block diagram view of an embodiment of a portion of a key, in accordance with one embodiment of the present disclosure;

FIG. 17A is a simplified schematic diagram illustrating a block diagram view of an embodiment of a portion of a key, in accordance with one embodiment of the present disclosure;

FIG. 17B is a simplified schematic diagram illustrating a block diagram view of an embodiment of a portion of a key, in accordance with one embodiment of the present disclosure;

FIG. 17C is a simplified schematic diagram illustrating a block diagram view of an embodiment of a portion of a key, in accordance with one embodiment of the present disclosure;

FIG. 18 is a simplified a simplified flow diagram illustrating potential operations associated with one embodiment of the present disclosure;

FIG. 19 is a block diagram illustrating an example computing system that is arranged in a point-to-point configuration in accordance with an embodiment;

FIG. 20 is a simplified block diagram associated with an example system on chip (SOC) of the present disclosure; and

FIG. 21 is a block diagram illustrating an example processor core, in accordance with an embodiment;

FIG. 22 illustrates views of a dome having a conductive external elements according to an embodiment;

FIG. 23 is a flow chart of a method of preparing a dome according to an embodiment;

FIG. 24 provides various view illustrating structures and methods of preparing a dome according to an embodiment;

FIG. 25 is a top view of a carrier sheet according to an embodiment;

FIG. 26 is a top view of domes attached to a carrier sheet according to an embodiment;

FIG. 27 provides various views illustrating structures and methods according to an embodiment; and

FIG. 28 provides various view illustrating structures and methods according to an embodiment.

The FIGURES of the drawings are not necessarily drawn to scale, as their dimensions can be varied considerably without departing from the scope of the present disclosure.

EMBODIMENTS OF THE DISCLOSURE

The following disclosure provides many different embodiments, or examples, for implementing different features of the present disclosure. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. Further, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Different embodiments may have different advantages, and no particular advantage is necessarily required of any embodiment.

This specification discloses embodiments of various methods and structures for manufacturing tactile keyboards. In engineering a particular embodiment of the tactile keyboards disclosed herein, design considerations may drive certain tradeoffs and decisions. Thus, while certain embodiments are advantageous over other embodiments in certain contexts, nothing disclosed herein should be understood to a particular method or structure in every case. Factors that may influence manufacturing include quality considerations, cost considerations, brand differentiation, engineering locations, materials availability, and many others.

In one particular embodiment of the present disclosure, an adaptive tactile keyboard, or in other words, an “intelligent” and interactive keyboard, which may include a display embedded within the key of at least some keys. One design consideration in certain embodiments of such a keyboard is providing an electrical connection to the keycap (including power and data) to drive the display, without compromising the tactile feel and properties of the keyboard.

The electrical connection may include a conductive external element disposed on the dome structure to provide an electrical connection from the base of the dome to the keycap base. The external element may have properties of conductivity, flexibility, and robustness, by way of example. This external element may not be part of the structure of the dome, but rather may be attached to it externally.

One example of such an external element is rip stop, woven conductive fabric made of very fine nylon or nylon-like strands coated with conductive material. This creates a conductive, flexible and durable connection to keycap without compromising the tactile feel of the key when it is pressed. Rather, the fabric deforms with the dome without hindering its movement in any way. Thus, the tactile feel of the dome is not changed. Embodiments of this material are also robust, and able to maintain their operation over multiple millions of key presses, which is a quality metric for many keyboards. This highly robust manufacturing approach also eases handling on the assembly line. Furthermore, multiple connections can be formed over the dome using this method.

FIG. 1A is a simplified schematic diagram illustrating an embodiment of an electronic device 100 in accordance with one embodiment of the present disclosure. Electronic device 100 can include a first housing 102 and a second housing 104a. Second housing 104a can include a keyboard portion 106. Keyboard portion 106 can include a plurality of keys 108 and each key 108 can include a keycap 110. In one or more embodiments, electronic device 100 may be any suitable electronic device having a keyboard or keys such as a computer that includes keys, a desktop computer, a mobile device that includes keys, a tablet device that includes keys, a Phablet™ that includes keys, a personal digital assistant (PDA) that includes keys, an audio system that includes keys, a movie player of any type that includes keys, etc.

Turning to FIG. 1B, FIG. 1B is a simplified schematic diagram of a detachable second housing 104b in accordance with one embodiment of the present disclosure. Detachable second housing 104b can include keyboard portion 106 and plurality of keys 108. Each key 108 can include a keycap 110. Second housing 104b may be a keyboard in communication with an electronic device (e.g., a standalone keyboard or Bluetooth™ keyboard in wireless communication with a smartphone, a desktop keyboard connected to a computer through a wire or cable) or may be physically attached to an electronic device (e.g. a keyboard integrated into the chassis of an electronic device).

For purposes of illustrating certain example features of a keycap with an active element, the following foundational information may be viewed as a basis from which the present disclosure may be properly explained. A tactile keyboard is mechanical keyboard where keys travel down when a user applies a force to press the keys and the keys strikes back to its original position after the user applied force is released. Such keyboards are used for data input in variety of applications such as laptops, desktop keyboards, industrial control systems, remote controls, automotive and many others etc. Tactile keyboards typically consist of different functional elements or blocks, such as a key, a dome, scissor, switch, and base plate. The dome can be a rubber, plastic, silicone, or metallic dome or any other similar element which is compressed and deforms when force is applied and rebounds back to its original shape and size when the applied force is removed. The scissor can be a scissor or any other similar element to lock the key and constrain its motion to only in the vertical direction. The switch is some form of switch which is closed when the key is pressed (to detect the input). The base plate can be a base plate or any other similar element which acts as a foundation for components of the keyboard.

A keycap of a keyboard is a small mechanical component which travels up and down when the key is pressed by a user. A typical keycap includes a fine curved surface on the top to provide ergonomic comfort when a finger of a user rests on the keycap. The typical keycap also includes a fine textured surface to prevent a glossy/shining finish and provide a subtle grip for the finger of the user when the finger presses the key. Some keycaps include a label (either printed or etched) on a topmost surface of the keycap to provide a wide angle of view (almost 180 degree) and allow identification of the key. In addition, the typical keycap can include a locking mechanism on the bottom side to provide mechanical (usually a snap fit) connection with rest of the keyboard subsystem. The thickness of the keycap at a periphery and at the locking mechanism is usually around 2 mm while the thickness in other areas is often around 1 mm. Most keycaps are designed to withstand multi-million operations.

Keyboards have traditionally remained passive mechanical devices for gathering user input. The focus on keyboards has generally been on the on mechanical aspects in making the keyboards thinner, quieter, with lower operating pressure, etc. The key is typically a passive component of the keyboard because there is not an electrical connection available at the key. Some keys do have an electrical connection but the electrical connection using existing methods (e.g., wires, cables, or pogo pins) have serious limitations as there is typically not enough space for the electrical connection. For example, the typical dimension of a typical key cap is about 14 mm×13.5 mm×1.8 mm. The air gap between a bottom surface of the key and the base plate is typically about 1.2 to 2.5 mm. In addition, use of an interconnect cable or wire is difficult and infeasible from an assembly standpoint for high volume production. Further, use of an interconnect cable or wire can interfere with other components when the key is in a vertical motion. Also, use of interconnect cables or wires can impact the operating pressure. For example, the operating pressure can increase and become inconsistent with the use of interconnected cables or wires and hence, impacts the usability of key. Also, the use of interconnect cable/wiring is not reliable to withstand multi-million operations. Use of wireless energy transfer solution is also expensive and increases power consumption. In the past, an electrical contact to a key has been attempted by creating a customized electromechanical switch. However, the addition of new parts to make the electrical connection under each key increases the overall weight, expensive, and can be complex to assemble. For example, many current keys include a dome/scissor assembly with 3-layer PET for a conductive membrane based switch and require simple snap fit assembly. Electro-mechanical based tactile switch often requires additional parts and a special tool for assembly. Further, the keys require diligent periodic maintenance or periodic cleaning of dust and can require periodic greasing to reduce the noise level of the keys as the additional mechanical parts seems to make the key vulnerable to noise if not regularly maintained.

Interactive or intelligent customizable keyboards in the past typically employ custom and sophisticated designs. They often utilize custom parts and connection mechanisms that add significant cost thereby limiting their usability. Interactive customizable keyboards can also change the fundamental feel of using a keyboard thereby limiting their acceptance. For example, often Interactive customizable keyboards are bulkier, the display is at a visual depth from the surface of the key, the display has a limited viewing angle and brightness, the surface finish is not similar to conventional keyboards, the keys feel more “clicky” or do not have any tactile response, etc. In addition, the interactive customizable keyboards often demand more maintenance from end users and consume a relatively high amount of power.

Because an acceptable electrical connection is not available at the key, the typical keycap does not contain an active element like a display or sensor. One reason for this is because given the thin mechanical profile, surface topology, viewing, and lifetime requirements of a key, it can be difficult to embed active element inside a keycap without compromising use of the key. For example, the current process to design and build displays in a keycap has multiple problems. One such problem is ghosting. Ghosting can occur when the insulation gap between adjacent bottom electrodes leaves the dielectrics in that region in an in-deterministic state after few cycles of state change. As a result, the entire display needs a periodic full screen refresh. Ghosting can spoil the user experience.

One solution to mitigate ghosting is to refresh the entire display. However, refreshing the entire display (as opposed to a portion of display) increases the overall system power consumption. Another common problem is an aspect ratio mismatch where the aspect ratio of an outer dimension of a display is not same as the aspect ratio of an active display region. An aspect ratio mismatch can occur when the area required to make a connection from a bottom electrode to a top electrode is outside the active area. This causes a situation where the aspect ratio of active area is not same as the aspect ratio of the outer dimension and can introduce constrains to the aesthetics as well as the mechanical and industrial design. Also, additional space (in the X and Y plane) is required which is not always available, especially on special or small displays.

Another possible issue is that the display cannot be made with a zero or near zero millimeter (mm) bezel because the top electrode connection and edges (e.g., inactive protective edges to protect the dielectric from environment, heat seal, etc.) add a margin to the display. An active area is the actual visible area of a display and a border is required to laminate all layers of stack with a heat seal or a similar process to prevent the dielectric from being exposed to moisture. In addition, design rule constraints can introduce issues or problems. For example, an insulation gap between adjacent bottom electrodes (segments) depends on the dielectric and the material used for the base substrate and the minimum spacing in the graphic artwork (being created on bottom electrode) is limited by the insulation gap.

The electrical interface of an interactive customizable keyboard can also create problems as the connection to bottom electrodes is brought out through printed silver traces (or equivalent material). This causes the traces to extend outside the active area on the same horizontal plane of the base substrate to form a tail. If the display drive PCB is directly underneath the display, then an additional area (in the X and Y plane) to allow for a bending radius for the tail is required. Further, the process to remove dielectric material (to enable electrical connection to the top electrode) is manual and can take a significant amount of time and require a relatively large area of removal.

Key 108 can be configured to change a traditional keyboard from a passive device to an intelligent, interactive customizable device while at the same time overcoming some of the above issues. In an embodiment, key 108 can be configured to change a traditional keyboard from a passive device to an intelligent, interactive customizable device with a display, while at the same time overcoming some of the above issues. Keyboard portion 106 and key 108 can utilize the elements or components of existing keyboards with few modifications and no significant impact to usability, productivity, feel, or reliability as compared to traditional keyboards. Keyboard portion 106 and key 108 can have relatively minimal cost addition and minimal impact to assembly as compared to traditional keyboards. Further, keyboard portion 106 and key 108 can have little or no added maintenance and relatively low additional power consumption as compared to a traditional keyboard. As the same elements or components are used as a regular mechanical keyboard, there can be co-existence of traditional keys and active keys within the same system. For example, one row in keyboard portion 106 can be active while the rest of the keyboard uses traditional mechanical keys.

In addition, keyboard portion 106 can be configured to provide an interactive customizable keyboard that provides an interactive and contextual experience without compromising on the feel, function, or reliability of traditional keyboards. The basic elements of a traditional mechanical keyboard like keycap, silicone dome, scissor, base plate, scan matrix are all retained with modifications to certain elements. In an example, a key can include an embedded segmented bi-stable e-paper display that can change state interactively based on user input or contextually (content or application displayed on the screen).

Keyboard portion 106 can be configured to use existing keyboard components as ingredients and use similar assembly methods. In addition, keyboard portion 106 does not impact the feel or function of traditional keyboards and can be implemented even within small Z-height keycaps, existing ergonomic layout considerations like pitch and spacing can remain virtually unaffected, no change or minimal change to operating force or travel, texture and curvature for ergonomics of keys can be maintained as per traditional keyboards, and significant height or weight compared with traditional keyboards is not added. Further, existing form factors can be retained and an interactive component such as a display can appear to be right at the surface of the typing surface as in traditional keyboards to provide an almost 180 degree viewing angle. This can also allow the keyboard to be daylight readable. In addition, keyboard portion 106 can be configured for reliable operation for multimillion cycles as in traditional keyboards and have no additional maintenance or cleaning required. Further, relatively low power is consumed (power is consumed only during state change) as state is retained even after the power is removed. This and other factors allow for a relatively minimal cost addition to implement keyboard portion 106.

In addition, an active element such as a display as outlined here can resolve the active keycap issues (and others) mentioned above. In an example, the display can be configured to print or integrate a colored mask on an outer most surface or user facing side of a display. In an example, two artworks may be prepared instead of the typical one artwork. The two artworks can include a coarse artwork for a bottom electrode or base substrate and a fine artwork for a mask or top layer. The fine artwork can be unconstrained by design rules of an underlying dielectric layer. A matte or glossy overcoat may be used to create uniform surface texture such that there is no mismatch between the surface texture of exposed areas and the mask printed area. The dielectric may be removed from the active area. In addition, a laser ablation may be used for dielectric removal. With laser ablation, the removal process can be made faster and the dimensions of the dielectric removal area can be made significantly smaller. In an example, the dielectric removal area can be made small enough to not be noticed or perceived by the naked eye of a typical user. Where a large area is required and the area is noticeable, the region can be covered with the mask. Further, a Z axis adhesive may be used and may be a conductive via or channel on the base substrate to establish an electrical connection to the segments instead of using a traditional tail.

The display can be configured to reduce or eliminate visible ghosting and reduce power consumption as a global refresh is not required. With coarse artwork for the bottom electrode and fine artwork on top of the display, the area which is undergoing a ghosting effect can be hidden. The ghosting effect is present, but it is not visible to the user because the mask can cover or hide the area where the ghosting would occur. In addition, the display can allow for finer graphics because visible artwork is not dependent on design rules of the dielectric layer. The display can also allow for a uniform aspect ratio of an active area and an outer dimension if the display can be laminated or allow for a zero mm bezel if the display is not laminated. Also, the number of drive lines can be reduced by one because a background segment is not required with a mask. Reducing the drive lines by one can be an advantage in tight space constraints. The display can further be configured to avoid the requirement of a display tail and the area required for its bending radius. This can be an advantage when the display is used in very small applications such as wearable or a keycap of a keyboard.

In an example, a user facing side of the display can be printed with a mask layer. The graphic on the mask can be very fine and independent of the design rules applicable on a bottom electrode or base substrate. The mask serves as the background and has the same color as the background segment (if it was present). The mask may have matte or glossy finish to match the look and feel of a traditional keycap. The area that is left exposed by the mask can be coated with a transparent overcoat. The thickness of overcoat can have the same as the thickness of mask ink. The finish of a transparent overcoat (glossy or matte) is kept same as the finish of ink used for printing the mask.

The display can include a coarse graphic printed on a bottom electrode or base substrate. If the background color is black, then a character printed on the mask is made visible by driving the bottom electrode to a white state. Similarly, the character printed with a mask can be driven to a hidden state by driving the bottom electrode to a black state. The display created by the bottom electrode can be used like the concept of backlight. The thickness and finish match of transparent overcoat applied on exposed area is same as the thickness and finish of the ink used for mask. The color used for mask can be the same as the effective color of a background segment as seen through the overcoat. This ensures that a hidden state can be effectively achieved.

For connecting the top electrode, the dielectric can be removed from active area itself. The dead region created by dielectric removal can be hidden by the mask. Since the dielectric removal can be performed by laser ablation, the size of the dead region is limited to a small dimension to minimize the loss of a display region within the active area. The insulation gap between adjacent bottom electrodes can also be hidden by the mask. As a result, the ghosting effect is never visible to a user. In an example, the base substrate (e.g., PET or FR4 or polyimide) can include conductive vias. The electrical connection to bottom electrode can be established to a PCB using a Z axis adhesive.

In one or more embodiments, the display can be included in a device that may include a battery and various components of an electronic system. The components may include a central processing unit (CPU), a memory, etc. Any processors (inclusive of digital signal processors, microprocessors, supporting chipsets, etc.), memory elements, etc. can be suitably coupled to a motherboard based on particular configuration needs, processing demands, computer designs, etc. Other components such as external storage, controllers for video display, sound, and peripheral devices may be attached to the motherboard as plug-in cards, via cables, or integrated into the motherboard itself.

Turning to FIG. 2A, FIG. 2A is a cross section side view of key 108, in accordance with one embodiment of the present disclosure. Key 108 can include keycap 110, scissors 112, and a dome 114. In an example, a coating can be applied on a dome already present in a keyboard structure to make the dome conductive. The coating can be etched to create multiple electrical paths on the body of dome 114. The coating treatment ensures conductivity over multi-million operations without impacting operating pressure (force and strike response of dome).

Key 108 does not require a new electro-mechanical switch design and reuses existing mature ingredients of a keyboard which are proven over several decades and are broadly available. In addition, key 108 does not require any new additional component for electrical interconnection. Hence there is no interference with a mechanical switch. Further, the system does not add new assembly steps for the interconnection of the elements. The connection is established using existing processes of a keyboard assemble and does not impact the operating pressure of keyboard. Also, key 108 does not require any additional (or no more than a typical mechanical keyboard assembly) periodical maintenance, disassembly, cleaning, reassembly and verification or require nominal cleaning. The system can provide reliable electrical and mechanical functionality over multi-million operations with no additional maintenance. Key 108 system is relatively inexpensive, relatively light, and there is no deviation or relatively minor deviation from to the shape and size of a traditional key.

During use, dome 114 can include silicone, metallic, or any other equivalent element that can absorb the operating pressure when key 108 is pressed and then strike back key 108 to its original position when the operating pressure is removed. Such a retractive element has to maintain consistent contact with a bottom side of key 108 at a top end of dome 114 and a bottom structural foundation of a keyboard module to facilitate smooth tactile motion. This structural requirement can be used to establish an electrical connection between a keycap and the rest of the system. The surface of dome 114 can be modified to include multiple electrical paths and is not limited to the illustrations, embodiments, or designs discussed herein.

Turning to FIG. 2B, FIG. 2B is a cross section side view of key 108a, in accordance with one embodiment of the present disclosure. Key 108a can include keycap 110, scissors 112, and a dome 114. Keycap 110 can include a resin layer 146 and an active element 164. Dome 114 can be coupled to a scan matrix layer 132 on a base substrate 134.

Active element 164 can be coupled to or in communication with scan matrix layer 132 through a conductive area 116 that extends over dome 114. Conductive area 116 can be a coating applied on dome 114 to make dome 114 conductive. The coating can be etched to create multiple electrical paths on the body of dome 114 can ensure conductivity over multi-million operations without impacting operating pressure (force and strike response of dome).

Turning to FIG. 3, FIG. 3 illustrates one example of dome 114. Dome 114 can include one or more conductive areas 116, one or more non-conductive areas 118, and a top portion 120. In an example, top portion 120 would be in contact with keycap 110. Each conductive area 116 can be an electrical trace. Non-conductive area 118 can isolate conductive areas 116 from each other.

Turning to FIG. 4, FIG. 4 illustrates one example of dome 114. The width of conductive area 116 and non-conductive area 118 can be equal or may be different. In an example, each conductive area 116 on dome 114 can be electrically connected to the rest of the system using conductive adhesive applied at bottom side 122 of dome 114. Different embodiments can increase or decrease the number of conductive areas 116 and can change the width of each conductive area 116 and non-conductive area 118.

Turning to FIG. 5A, FIG. 5A illustrates one example of dome 114. As illustrated in FIG. 5A, dome 114 can include four conductive areas 116a-116d and nonconductive area 118. Deposition to create conductive areas 116a-116d can be performed on the body of dome 114 and the substrate on which dome 114 is bonded. For example, conductive areas 116a-116d on dome can be electrically coupled to traces 124a-124d respectively. In some examples, dome 114 can be electrically coupled to the rest of the system using conductive adhesive applied on the base substrate of dome 114 which can also be coated and etched. Etching can be performed on dome 114 and the base substrate. In this example, conductive areas 116a-116d are much larger as compared to non-conductive area 118.

Turning to FIG. 5B, FIG. 5B illustrates one example of dome 114. As illustrated in FIG. 5B, dome 114 can include four conductive areas 116a-116d and nonconductive area 118. Nonconductive area 118 can be extended to create electrical isolation for conductive areas 116a-116d. In an example, dome 114 and a transmitter sheet are not two separate parts but are a single part design where during manufacture, only the domes are first bonded directly on a transmitter sheet (without any traces 124a-124d illustrated in FIG. 5A). The assembled sheet can then be coated with a conductive coating. The coating connects directly with conductive pads printed on a transmitter sheet. After coating, electrical isolation can be created on dome 114 with a laser etch process. Laser etching can also be used to create electrical isolation on the bottom of the transmitter sheet. The pattern of laser etching on the bottom of the transmitter sheet can be similar to the pattern of traces 124a-124d illustrated in FIG. 5A.

Turning to FIGS. 6A-6F, FIGS. 6A-6F illustrates examples of different embodiments of a dome. As illustrated in FIGS. 6A-6F, each dome 114a-114f may have a different number of conductive areas 116 and/or a different width of each conductive area 116. For example, as illustrated in FIG. 6A, dome 114a has four relatively large conductive areas 116, while, as illustrated in FIG. 6E dome 114e has three relatively small conductive areas 116. The number and thickness of conductive areas is only limited by design constraints and user preferences.

Turning to FIG. 7, FIG. 7 illustrates one example of a portion of a conductive dome. As illustrated in FIG. 7, a portion of a conductive dome can include a first layer 126, a second layer 128, and a third layer 130. First layer 126 and second layer 128 can be combined into conductive area 116. First layer 126 can include a thin coating of a metallic material that is electrically conductive. First layer 126 can also have strong adhesion properties with second layer 128. Second layer 128 can include a thin coating of metallic material that may be the same as first layer 126 or may be a different material than first layer 126. Second layer can have strong adhesion properties to third layer 130. Third layer 130 includes the outer surface of dome 114 and may include silicon or some other similar material. In an example, first layer 126 may be a material that will not bond or is difficult to bond with third layer 130. Second layer 128 can be configured to help bond first layer 126 to third layer 130.

Turning to FIG. 8, FIG. 8 illustrates one example of a portion of a conductive dome. As illustrated in FIG. 8, a portion of the conductive dome can include a plurality of first layers 126, a plurality of second layers 128, and third layer 130. The plurality of first layers 126 and second layers 128 can be combined into conductive area 116b. Each first layer 126 may be about 0.1 microns thick and each second layer 128 may be about 0.025 microns thick.

In an example, the surface of dome 114 may be coated with physical vapor deposition or any other similar coating technique. In another example, only one material such as Nickel Titanium is used and only one layer is coated. The overall thickness of the coating can vary from sub-micron to few microns depending on the target material used for deposition and the material composition of silicone.

Turning to FIG. 9, FIG. 9 is an example flowchart illustrating possible operations of a flow 900 that may be associated with the present disclosure. At 902, domes to be processed are obtained or identified. At 904, a substrate on which the domes are to (or should) be placed are obtained or identified. At 906, the domes are placed on the substrate. In an example, the domes are placed on the substrate using adhesive. At 908, the bonding between the domes and the substrate is cured and matured. At 910, alignment and orientation marks are placed on the substrate. At 912, the dome and substrate assembly are cleared or cleaned. At 914, the dome and substrate assembly are moved to thin film deposition equipment. At 916, inside a cleaning chamber of the deposition equipment, the dome and substrate assembly are baked. At 918, the dome and substrate assembly are moved to a deposition chamber. At 920, target material, power, pressure, and duration for deposition are selected. At 922, thin film deposition on the surface of the dome and substrate is performed. At 924, the system determines if all the layers have been deposited. If all the layers have not been deposited, then the system returns to 920 and target material, power, pressure, and duration for deposition are again selected. If all of the layers have been deposited, then the dome and substrate assembly are removed from the thin film deposition equipment, as in 926.

Turning to FIG. 10, FIG. 10 is an example flowchart illustrating possible operations of a flow 1000 that may be associated with the present disclosure. At 1002, a dome and substrate assembly are obtained (or located) and coated with thin film deposition. At 1004, adhesive is sprayed on etching equipment (e.g., laser etch equipment) to secure the dome and substrate assembly to the etching equipment. At 1006, the dome and substrate assembly are placed in the etching equipment. In an example, the dome and substrate assembly are aligned and orientated using the marks made on the substrate (as in flow 900, illustrated in FIG. 9). At 1008, the substrate is laser cut to separate each dome. In an example, a portion of the substrate associated with each dome is also cut. In another example, in a single part design, the substrate is not cut and is only etched to create electrical isolation on the substrate. At 1010, an orientation of each dome is set as per an etch pattern. In an example, the etch pattern may be a laser etch pattern. At 1012, one or more passes of etching is performed to remove the thin film deposition. At 1014, the system determines if an etch pattern was fully created. If the etch pattern was not fully created, then the system returns to 1010 and an orientation of each dome is set as per an etch pattern. If the laser etch pattern was fully created, then one or more domes are inspected for electrical conductivity along each patch created on the dome, as in 1016. At 1018, one or more domes are inspected for electrical insulation between all the paths created on the dome. At 1020, the base substrate is cut per a final shape needed for assembly.

Turning to FIG. 11, FIG. 11 is a cross section side view of a portion of a keyboard (e.g., keyboard 106), in accordance with one embodiment of the present disclosure. In an example, a portion of a keyboard (e.g., keyboard 106) can include dome 114, conductive areas 116a and 116b, a scan matrix layer 132, and a base substrate 134. Scan matrix layer 132 can include isolation region 136, support layer 138, tracings 140, insulation coating 142, and scan matrix 144. Isolation regions 136 can isolate signals or communications on one conductive area (e.g., conductive area 116a) from signals or communications on another conductive area (e.g., conductive area 116b) and from the rest of the system. Vias 148 can provide a communication path between conductive areas 116a and 116b and tracings 140. Tracings 140 can allow signals and communications to be communicated to a processor such as one in a transmitter board or host controller board. Support layer 138 can be a substrate and can include a polyester such as polyethylene terephthalate (PET). Scan matrix 144 can include scan matrix traces.

Turning to FIG. 12, FIG. 12 illustrates one example of keyboard portion 106. Keyboard portion 106 can include keycap 110, dome 114, scissors 150, a communication path 152, a transmitter sheet 154, a base plate 156, a transmitter board 158, a controller board 160, and a host connection 162. Keycap 110 can include an active element 164 (e.g., a display, bi-stable display, e-ink display, etc.). Scissors 150 can be coupled to base plate 156 using locking mechanism 166. In an example, transmitter sheet 168 can be similar to tracings 140 and can allow signals and communications to be communicated between keycap 110 and a transmitter board 158 or a controller board 160. Transmitter board 158 can be configured to control active element 164 in keycap 110. Controller board 160 can be configured to control or send communications to transmitter board 158. In an example, controller board 160 can include logic or instructions that can be communicated to transmitter board 158 and transmitter board can function as a driver to cause active element 164 to perform a function or action. Host interface 162 can be configured to communicate with various electronics (e.g., main motherboard) of second housing 104. In an example, tracing 140 can be done on a transmitter sheet to connect each conductive path on dome 114 to the output of transmitter board 158. There may be space constraints to route the traces on the transmitter sheet because the transmitter sheet can include a plurality of holes. The plurality of holes can allow a locking mechanism to protrude out from an underlying baseplate. The tracing in limited areas can be optimized by combing drive lines that always carry the same differential voltage signals in different electrodes. The optimization can be done even when the electrodes belong to different keys.

Turning to FIG. 13, FIG. 13 is a simplified plan view illustrating an embodiment of an active element 164a in accordance with one embodiment of the present disclosure. Active element 164a can include a transparent substrate 170a, a top electrode 172, a dielectric 174, a conductive adhesive 176, and a base substrate 178. In an example, a conductive adhesive may be located on a top side and on a bottom side of top electrode 172. Transparent substrate 170a can include a mask 180 and an exposed area 182a. While a star profile is shown as exposed area 182a, the profile can be almost any shape, number, letter, symbol, etc. Base substrate 178 can include a bottom electrode 184a and a top electrode connection area 186. Top electrode connection area 186 can be coupled to top electrode 172 using electrical path 188. In an example, there can be a one-to-one (1:1) or one-to-n (1:n) mapping between bottom electrode 184a and exposed area 182a. For example, if a symbol “!” and a number “1” are always shown or hidden at the same time, then they may both be independent (not connected) fine artwork on mask 180, but they can be controlled by one (connected) coarse artwork on bottom electrode 184a. The term “fine artwork” may be used to describe a feature or element similar to exposed area 182a and the term “course artwork” may be used to describe a feature or element similar to bottom electrode

Active element 164a may be a bi-stable display. The term bi-stable refers to the ability of a display to retain content on the display even after the source of power for the display is removed. Active element 164a may be used with any suitable electronic device having a display such as a computer, mobile device, a tablet device (e.g., iPad™), Phablet™, a personal digital assistant (PDA), a smartphone, an audio system, a movie player of any type, etc. In an example, a thickness of top electrode 172, dielectric 174, mask 180, and bottom electrode 184a is less than about three (3) millimeters.

Top electrode 172 may be a top electrode and can be facing a user side. Top electrode 172 can include transparent conductive material like Indium Tin Oxide (ITO). The color of dielectric 174, as seen from the user facing side, can change when a differential voltage is applied across the electrodes. There are different types of bi-stable display, such as electrophoretic displays (e-ink), electrochromic displays, and photonic displays. The displays differ based on the material used for the dielectric layer and all can be included in active element 164a.

As illustrated in FIG. 13, image 182a on mask 180 does not extend to top electrode connection area 186 so electrical path 188 and any ghosting effects are not visible. Base substrate 178 can include PET film, polyimide film, FR4, etc. Connective path 188 can be created by removing dielectric material and can be configured to enable a connection to top electrode 172 from base substrate 178. Electrical path 188 can be configured to allow for communication between top electrode 172 and base substrate 178.

Turning to FIG. 14A, FIG. 14A illustrates a block diagram view of an embodiment of a portion of a key (e.g., key 108) that includes a display (e.g., active element 164a), in accordance with one embodiment of the present disclosure. FIG. 14A illustrates an example of a display with lamination 186. When a user views the display, lamentation 186, mask 180, and exposed area 182a may be visible to the user. It is worth noting that electrical path 188a and any ghosting effects are not visible because electrical path 118a and any ghosting effects are hidden by mask 180.

Turning to FIG. 14B, FIG. 14B illustrates a block diagram view of an embodiment of a portion of a key (e.g., key 108) that includes a display (e.g., active element 164a), in accordance with one embodiment of the present disclosure. When a user views the display, mask 180 and exposed area 182a may be visible to the user. It is worth noting that even without lamination 186 illustrated in FIG. 14A, electrical path 188a and any ghosting effects are not visible because electrical path 118a and any ghosting effects are hidden by mask 180.

Turning to FIG. 15A, FIG. 15A illustrates a block diagram view of an embodiment of a portion of a key, in accordance with one embodiment of the present disclosure. FIG. 15A illustrates an example of when dielectric layer is not the same or not close to the same color as mask 180. In FIG. 15A, exposed area 182a is visible to a user.

Turning to FIG. 15B, FIG. 15B illustrates a block diagram view of an embodiment of a portion of a key, in accordance with one embodiment of the present disclosure. FIG. 15B illustrates an example of when dielectric layer is the same or close to the same color as mask 180. In FIG. 15B, exposed area 182a is not visible to a user.

In an example, dielectric 174 is sandwiched between top electrode 172 (a first conductor) and bottom electrode 184a (a second conductor). When a differential voltage is crated between top electrode 172 and bottom electrode 184a, the differential voltage can be used to change the state of the dielectric and cause the dielectric to produce a different color. In one example, a first differential voltage can cause dielectric 174 to appear white such that exposed area 182a appears white or a contrasting color to the color of mask 180 (e.g., as illustrated in FIG. 15A). When a second differential voltage is applied across top electrode 172 and bottom electrode 184a, the color of dielectric 174 changes to appear black or to match mask 180 and exposed area 182a may not be visible to the user and the user would not see any visible indication or very little indication or trace of exposed area 182a (e.g., as illustrated in FIG. 15B). Note that the color of dielectric mater 174 may include colors other than black and a solid color may be used or two or more different colors may be used.

Turning to FIG. 16, FIG. 16 is a simplified plan view illustrating an embodiment of active element 164b in accordance with one embodiment of the present disclosure. Active element 164b can include a transparent substrate 170b, top electrode 172, dielectric 174, conductive adhesive 176, and base substrate 178. Base substrate 178 can include bottom electrodes 184b-184d and top electrode connection area 186. Top electrode connection area 186 can be coupled to top electrode 172 using electrical path 188.

Transparent substrate 170b can include a mask 180 and exposed areas 182b, 182c, and 182d. While a number three (“3”) profile is shown as exposed area 182b, the profile can be almost any shape, number, letter, symbol, etc. While a dollar sign (“$”) profile is shown as exposed area 182c, the profile can be almost any shape, number, letter, symbol, etc. While a speaker or volume profile is shown as exposed area 182d, the profile can be almost any shape, number, letter, symbol, etc. In an example, exposed area 182b can correspond with bottom electrode 184b, exposed area 182c can correspond with bottom electrode 184c, and exposed area 182d can correspond with bottom electrode 184d. If an exposed area on mask is small, then a coarse shape on bottom electrode can also be small. For example, there may be large inactive areas on bottom substrate that have no actual electrode. This can help in saving cost by using less material and in reducing the noise/EMI/EMC pickup by reducing the areas that need to be conductive. In an example, a thickness of top electrode 172, dielectric 174, mask 180, and bottom electrodes 184b-184d is less than about three (3) millimeters

Turning to FIG. 17A, FIG. 17A is a simplified plan view illustrating an embodiment of active element 164c in accordance with one embodiment of the present disclosure. FIG. 17A illustrates an example of when a first differential voltage is created between top electrode 172 and bottom electrode 184b in an area of dielectric 174 that is over bottom electrode 184b but under exposed area 182b. This causes dielectric 174 to change color such that the color of dielectric 174 appears white or some contrasting color to the color of mask 180 and exposed area 182b can be visible to the user. In addition, a second differential voltage is created between top electrode 172 and bottom electrodes 184c and 184d such that the color of dielectric 174 changes to appear black or to match mask 180 and exposed areas 182c and 182d may not be visible to the user and the user would not see any visible indication or very little indication or trace of exposed areas 182c and 182d.

Turning to FIG. 17B, FIG. 17B is a simplified plan view illustrating an embodiment of active element 164d in accordance with one embodiment of the present disclosure. FIG. 17B illustrates an example of when a first differential voltage is created between top electrode 172 and bottom electrode 184c in an area of dielectric 174 that is over bottom electrode 184c but under exposed area 182c. This causes dielectric 174 to change color such that the color of dielectric 174 appears white or some contrasting color to the color of mask 180 and exposed area 182c can be visible to the user. In addition, a second differential voltage is created between top electrode 172 and bottom electrodes 184b and 184d such that the color of dielectric 174 changes to appear black or to match mask 180 and exposed areas 182b and 182d may not be visible to the user and the user would not see any visible indication or very little indication or trace of exposed areas 182b and 182d.

Turning to FIG. 17C, FIG. 17C is a simplified plan view illustrating an embodiment of active element 164e in accordance with one embodiment of the present disclosure. FIG. 17C illustrates an example of when a first differential voltage is created between top electrode 172 and bottom electrode 184d in an area of dielectric 174 that is over bottom electrode 184d but under exposed area 182d. This causes dielectric 174 to change color such that the color of dielectric 174 appears white or some contrasting color to the color of mask 180 and exposed area 182d can be visible to the user. In addition, a second differential voltage is created between top electrode 172 and bottom electrodes 184b and 184c such that the color of dielectric 174 changes to appear black or to match mask 180 and exposed areas 182b and 182c may not be visible to the user and the user would not see any visible indication or very little indication or trace of exposed areas 182b and 182c.

Active element 164 may be a bi-stable display. The term bi-stable refers to the ability of a display to retain content on the display even after the source of power for the display is removed. The term “segmented” refers to a form of display that is alternate to a dot matrix display, for example, as illustrated in FIGS. 16 and 17A-C. A segmented display can be built with a collection of pre-defined shapes or segments (e.g., exposed areas 182a-182d). At runtime, each segment can be driven to either a visible or a hidden state to compose a final image that can be displayed on screen. The concept of a segmented display is similar to seven segment displays used in a calculator.

Turning to FIG. 18, FIG. 18 is an example flowchart illustrating possible operations of a flow 1800 that may be associated with a bi-stable display. At 1802, a colored mask is integrated on an outermost surface of a bi-stable display. At 1804, coarse artwork for a back (or bottom) electrode is prepared. For example, the back (or bottom) electrode may be base substrate 178. At 1806, fine artwork for a mask is prepared. At 1808, a matte or glossy overcoat is applied to the colored mask. At 1810, the dielectric is removed from the active area. At 1812, a z-axis adhesive and conductive layer is used in place of a tail to establish an electrical connection to segments of the bi-stable display.

Turning to FIG. 19, FIG. 19 illustrates a computing system 1900 that is arranged in a point-to-point (PtP) configuration according to an embodiment. In particular, FIG. 19 shows a system where processors, memory, and input/output devices are interconnected by a number of point-to-point interfaces. Generally, one or more of the network elements of electronic device 100 may be configured in the same or similar manner as computing system 1900.

As illustrated in FIG. 19, system 1900 may include several processors, of which only two, processors 1970 and 1980, are shown for clarity. While two processors 1970 and 1980 are shown, it is to be understood that an embodiment of system 1900 may also include only one such processor. Processors 1970 and 1980 may each include a set of cores (i.e., processor cores 1974A and 1974B and processor cores 1984A and 1984B) to execute multiple threads of a program. The cores may be configured to execute instruction code. Each processor 1970, 1980 may include at least one shared cache 1971, 1981. Shared caches 1971, 1981 may store data (e.g., instructions) that are utilized by one or more components of processors 1970, 1980, such as processor cores 1974 and 1984.

Processors 1970 and 1980 may also each include integrated memory controller logic (MC) 1972 and 1982 to communicate with memory elements 1932 and 1934. Memory elements 1932 and/or 1934 may store various data used by processors 1970 and 1980. In alternative embodiments, memory controller logic 1972 and 1982 may be discreet logic separate from processors 1970 and 1980.

Processors 1970 and 1980 may be any type of processor, and may exchange data via a point-to-point (PtP) interface 1950 using point-to-point interface circuits 1978 and 1988, respectively. Processors 1970 and 1980 may each exchange data with a control logic 1990 via individual point-to-point interfaces 1952 and 1954 using point-to-point interface circuits 1976, 1986, 1994, and 1998. Control logic 1990 may also exchange data with a high-performance graphics circuit 1938 via a high-performance graphics interface 1939, using an interface circuit 1992, which could be a PtP interface circuit. In alternative embodiments, any or all of the PtP links illustrated in FIG. 19 could be implemented as a multi-drop bus rather than a PtP link.

Control logic 1990 may be in communication with a bus 1920 via an interface circuit 1996. Bus 1920 may have one or more devices that communicate over it, such as a bus bridge 1918 and I/O devices 1916. Via a bus 1910, bus bridge 1918 may be in communication with other devices such as a keyboard/mouse 1912 (or other input devices such as a touch screen, trackball, etc.), communication devices 1926 (such as modems, network interface devices, or other types of communication devices that may communicate through a computer network 1960), audio I/O devices 1914, and/or a data storage device 1928. Data storage device 1928 may store code 1930, which may be executed by processors 1970 and/or 1980. In alternative embodiments, any portions of the bus architectures could be implemented with one or more PtP links.

The computer system depicted in FIG. 19 is a schematic illustration of an embodiment of a computing system that may be utilized to implement various embodiments discussed herein. It will be appreciated that various components of the system depicted in FIG. 19 may be combined in a system-on-a-chip (SoC) architecture or in any other suitable configuration. For example, embodiments disclosed herein can be incorporated into systems including mobile devices such as smart cellular telephones, tablet computers, personal digital assistants, portable gaming devices, etc. It will be appreciated that these mobile devices may be provided with SoC architectures in at least some embodiments.

Turning to FIG. 20, FIG. 20 is a simplified block diagram associated with an example SOC 2000 of the present disclosure. At least one example implementation of the present disclosure can include the keycap with an active element features discussed herein. For example, the architecture can be part of any type of tablet, smartphone (inclusive of Android™ phones, iPhones™, iPad™, Google Nexus™, Microsoft Surface™, personal computer, server, video processing components, laptop computer (inclusive of any type of notebook), Ultrabook™ system, any type of touch-enabled input device, etc.

In this example of FIG. 20, SOC 2000 may include multiple cores 2006-2007, an L2 cache control 2008, a bus interface unit 2009, an L2 cache 2010, a graphics processing unit (GPU) 2015, an interconnect 2002, a video codec 2020, and a liquid crystal display (LCD) I/F 2025, which may be associated with mobile industry processor interface (MIPI)/high-definition multimedia interface (HDMI) links that couple to an LCD.

SOC 2000 may also include a subscriber identity module (SIM) I/F 2030, a boot read-only memory (ROM) 2035, a synchronous dynamic random access memory (SDRAM) controller 2040, a flash controller 2045, a serial peripheral interface (SPI) master 2050, a suitable power control 2055, a dynamic RAM (DRAM) 2060, and flash 2065. In addition, one or more embodiments include one or more communication capabilities, interfaces, and features such as instances of Bluetooth™ 2070, a 3G modem 2075, a global positioning system (GPS) 2080, and an 802.11 Wi-Fi 2085.

In operation, the example of FIG. 20 can offer processing capabilities, along with relatively low power consumption to enable computing of various types (e.g., mobile computing, high-end digital home, servers, wireless infrastructure, etc.). In addition, such an architecture can enable any number of software applications (e.g., Android™, Adobe™ Flash™ Player, Java Platform Standard Edition (Java SE), JavaFX, Linux, Microsoft Windows Embedded, Symbian and Ubuntu, etc.). In at least one embodiment, the core processor may implement an out-of-order superscalar pipeline with a coupled low-latency level-2 cache.

FIG. 21 illustrates a processor core 2100 according to an embodiment. Processor core 21 may be the core for any type of processor, such as a micro-processor, an embedded processor, a digital signal processor (DSP), a network processor, or other device to execute code. Although only one processor core 2100 is illustrated in FIG. 21, a processor may alternatively include more than one of the processor core 2100 illustrated in FIG. 21. For example, processor core 2100 represents an embodiment of processors cores 1974a, 1974b, 1984a, and 1984b shown and described with reference to processors 1970 and 1980 of FIG. 19. Processor core 2100 may be a single-threaded core or, for at least one embodiment, processor core 2100 may be multithreaded in that it may include more than one hardware thread context (or “logical processor”) per core.

FIG. 21 also illustrates a memory 2102 coupled to processor core 2100 in accordance with an embodiment. Memory 2102 may be any of a wide variety of memories (including various layers of memory hierarchy) as are known or otherwise available to those of skill in the art. Memory 2102 may include code 2104, which may be one or more instructions, to be executed by processor core 2100. Processor core 2100 can follow a program sequence of instructions indicated by code 2104. Each instruction enters a front-end logic 2106 and is processed by one or more decoders 2108. The decoder may generate, as its output, a micro operation such as a fixed width micro operation in a predefined format, or may generate other instructions, microinstructions, or control signals that reflect the original code instruction. Front-end logic 2106 also includes register renaming logic 2110 and scheduling logic 2112, which generally allocate resources and queue the operation corresponding to the instruction for execution.

Processor core 2100 can also include execution logic 2114 having a set of execution units 2116-1 through 2116-N. Some embodiments may include a number of execution units dedicated to specific functions or sets of functions. Other embodiments may include only one execution unit or one execution unit that can perform a particular function. Execution logic 2114 performs the operations specified by code instructions.

After completion of execution of the operations specified by the code instructions, back-end logic 2118 can retire the instructions of code 2104. In one embodiment, processor core 2100 allows out of order execution but requires in order retirement of instructions. Retirement logic 2120 may take a variety of known forms (e.g., re-order buffers or the like). In this manner, processor core 2100 is transformed during execution of code 2104, at least in terms of the output generated by the decoder, hardware registers and tables utilized by register renaming logic 2110, and any registers (not shown) modified by execution logic 2114.

Although not illustrated in FIG. 21, a processor may include other elements on a chip with processor core 2100, at least some of which were shown and described herein with reference to FIG. 19. For example, as shown in FIG. 19, a processor may include memory control logic along with processor core 2100. The processor may include I/O control logic and/or may include I/O control logic integrated with memory control logic.

FIG. 22 is an illustration of a conductive dome provisioned with a conductive external element. This discloses a method of providing an electrical connection to a keycap that may be used in addition to, in conjunction with, or instead of the other methods disclosed herein, such as the methods disclosed in FIGS. 3-6D.

In this example, conductive paths are created on dome 2210 by disposing thereon an external element 2202 that is flexible, conductive and robust. External element 2202 may be wrapped around the structure of dome 2210, and then wrapped underneath as illustrated in this FIGURE. In certain embodiments, intermediate supporting structures may also be provided to enhance stability and strength. In this example, PET discs 2206 are disposed on top of dome 2210 and on the bottom of dome 2210.

FIG. 23 is a flow chart of a method of manufacturing a dome according to one or more examples of the present specification. The method of FIG. 23 may be performed by any manufacturer, such as a human, machine, or combination of the two.

In block 2302, the manufacturer prepares an effective quantity of the flexible, conductive material to be used as an external element. This may include, for example, selecting the material, selecting the appropriate quantity, and performing any pre-processing steps that may be necessary on the material. The material selected may be flexible to allow movement of the dome without any hindrance, electrically conductive (e.g. having conductors woven into the fabric), suitable for cutting and assembly processes, and durable for multiple millions of key presses. An example of such a material is Berlin RS (conductive, woven rip-stop fabric) from Statex.

In block 2304, the manufacturer cuts the material to the required shape. This may include, for example, cutting the material into a shape such that it has a circular center portion that approximates the size and shape of the top of the dome, with n arms (where n is selected to provide the desired number of conductive paths). In the illustrated example, n=4. The arms may be selected to be of a length appropriate to allow the arm to wrap down to the bottom of the dome, with enough underhang to provide a secure mechanical adhesive fixture. Other embodiments may require more or fewer conductive paths, or may have other requirements. The shape of the material may be selected to suit the particular application.

In block 2306, a PET disk may be affixed to the top of the key cap dome (such as with an adhesive) to provide additional structural support and rigidity. In certain embodiments, this may be applied with an adhesive resin. The adhesive resin may be of uniform thickness, such as between 30 to 100 microns. Advantageously, the adhesive resin may not harden after it cures. Rather, it may remain flexible, which may contribute to the long-term reliability of the key. In an embodiment, the adhesive resin is applied only to the top of the silicone dome. In an embodiment, the adhesive resin may be Dow Corning 3140 type adhesive, or Dow Corning 4600 adhesive. In other embodiments, a 3M tape adhesive may be used.

In block 2308, the manufacturer affixes the conductive external element to the dome, such as with a non-conductive adhesive.

In block 2310, the manufacturer wraps the conductive external element around the dome, such as by running the arms down to the bottom of the dome, and affixing the underhang with an appropriate adhesive. Note that the dome may be mounted on a carrier sheet, such as a PET sheet.

In block 2312, the manufacturer creates electrical isolation between the different conductors, such as by laser etching the material to isolate the paths from one another. In some embodiments, a dielectric material may also be placed in the etched paths to further isolate the conductors from one another.

In block 2399, the method is done.

FIG. 24 is a series of side views illustrating a method of affixing a conductive external element to a dome.

In illustration 1, an unprepared dome 2210 is shown.

In illustration 2, the dome (possibly along with a plurality of other domes) is mounted on a carrier sheet 2402, which may be for example a PET sheet. Dome 2210 may be mounted to carrier sheet 2402 with an appropriate adhesive. Note that carrier sheet 2402 may be prepared with appropriately-sized slots or other apertures 2404. These may allow strips of the conductive external element to pass underneath for affixing to the bottom. Note that a top PET disc 2206 may also be placed atop dome 2210 to provide additional rigidity.

In illustration 3, a conductive external element 2202 is disposed atop dome 2210 and secured, such as with a non-conductive adhesive. Note that conductive external element 2202 includes conductive arms 2408 extruding from a center. In this case, there may be n=4 arms, although only two are clearly visible in this side view. Other embodiments may have any suitable number of arms, such as n=2, n=3, n=5, or n=6.

In illustration 4, arms 2408 are wrapped down and under dome 2201, and affixed underneath PET sheet 2402, such as with a non-conductive adhesive.

In illustration 5, the center of conductive external element 2202 is etched, providing a dielectric aperture 2204, which provides electrical isolation between conductive arms 2408. Each arm 2408 now provides a separate conductive path.

In illustration 6, individual domes are cut away from carrier sheet 2402, thus providing individual domes prepared with flexible conductive external elements. These domes may be used, for example, to create keys on a “smart” keyboard, with a small display atop dome 2210, which allows dynamic reconfiguration of the keyboard according to methods discussed herein.

FIG. 25 is a top view of an example transmitter sheet 2502 according to an embodiment. In this example, transmitter sheet 2502 is provided to electrically couple prepared domes 2210 to a signal source (e.g., a transmitter board), so that active elements of dome 2210 can be driven by those signals.

In this example, transmitter sheet 2502 is a double-sided PET or polyimide sheet that provides connection between the conductive domes and transmitter board. Transmitter sheet 2502 has conductive pads 2504 corresponding to each conductive path on the prepared domes 2210. Each dome 2210 is placed on the transmitter sheet such that the fabric pads align with transmitter sheet pads. The two may be attached using either a uniform layer of Z-axis conductive adhesive or XYZ conductive adhesive applied only in the region of the pads. FIG. 26 illustrates conductive domes assembled atop transmitter sheet 2502.

The approach described above illustrates an example two-step process wherein individual conductive domes are first created and cut out, then affixed conductive pads 2504 on transmitter sheet 2502. This is a nonlimiting example. In an alternate approach, domes are affixed directly to transmitter sheet 2502, as illustrated in FIGS. 27 and 28.

In the example of FIG. 27, in illustration 1, an unprepared dome 2210 is shown.

In illustration 2, the dome (possibly along with a plurality of other domes) is mounted on a transmitter sheet 2502, which may be for example a PET with conductive traces as described above. In this example, conductive pads 2504 are disposed on the bottom of transmitter sheet 2502. Dome 2210 may be mounted to transmitter sheet 2502 with an appropriate adhesive. Note that transmitter sheet 2502 may be prepared with appropriately-sized slots or other apertures. These may allow strips of the conductive external element 2202 to pass underneath for affixing to the bottom. Note that a top PET disc 2206 may also be placed atop dome 2210 to provide additional rigidity.

In illustration 3, a conductive external element 2202 is disposed atop dome 2210 and secured, such as with a non-conductive adhesive. Note that conductive external element 2202 includes conductive arms 2408 extruding from a center. In this case, there may be n=4 arms, although only two are clearly visible in this side view. Other embodiments may have other numbers of conductive arms.

In illustration 4, arms 2408 are wrapped down and under dome 2201, and affixed underneath transmitter sheet 2502 to conductive pads 2504. In this case, the arms may be affixed with an appropriate conductive adhesive. As before, etching may be used to electrically isolate the electrical traces from one another. In this embodiment, there may be no need to cut out the individual domes, as they are already affixed to the transmitter sheet.

In the example of FIG. 28, in illustration 1, an unprepared dome 2210 is shown.

In illustration 2, the dome (possibly along with a plurality of other domes) is mounted on a transmitter sheet 2502, which may be for example a PET with conductive traces as described above. In this example, conductive pads 2504 are disposed on the top of transmitter sheet 2502. Dome 2210 may be mounted to transmitter sheet 2502 with an appropriate adhesive. Note that in this case, transmitter sheet 2502 may not need to be prepared with slots or apertures. Note that a top PET disc 2206 may also be placed atop dome 2210 to provide additional rigidity.

In illustration 3, a conductive external element 2202 is disposed atop dome 2210 and secured, such as with a non-conductive adhesive. Note that conductive external element 2202 includes conductive arms 2408 extruding from a center. In this case, there may be n=4 arms, although only two are clearly visible in this side view. Other embodiments may have other numbers of conductive arms.

In illustration 4, arms 2408 are wrapped down and affixed to conductive pads 2504. In this case, the arms may be affixed with an appropriate conductive adhesive. As before, etching may be used to electrically isolate the electrical traces from one another. In this embodiment, there may be no need to cut out the individual domes, as they are already affixed to the transmitter sheet.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand various aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

All or part of any hardware element disclosed herein may readily be provided in a system-on-a-chip (SoC), including central processing unit (CPU) package. An SoC represents an integrated circuit (IC) that integrates components of a computer or other electronic system into a single chip. Thus, for example, client devices or server devices may be provided, in whole or in part, in an SoC. The SoC may contain digital, analog, mixed-signal, and radio frequency functions, all of which may be provided on a single chip substrate. Other embodiments may include a multi-chip-module (MCM), with a plurality of chips located within a single electronic package and configured to interact closely with each other through the electronic package. In various other embodiments, the computing functionalities disclosed herein may be implemented in one or more silicon cores in Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs), and other semiconductor chips.

Note also that in certain embodiment, some of the components may be omitted or consolidated. In a general sense, the arrangements depicted in the figures may be more logical in their representations, whereas a physical architecture may include various permutations, combinations, and/or hybrids of these elements. It is imperative to note that countless possible design configurations can be used to achieve the operational objectives outlined herein. Accordingly, the associated infrastructure has a myriad of substitute arrangements, design choices, device possibilities, hardware configurations, software implementations, and equipment options.

In a general sense, any suitably-configured processor, such as processor 210, can execute any type of instructions associated with the data to achieve the operations detailed herein. Any processor disclosed herein could transform an element or an article (for example, data) from one state or thing to another state or thing. In another example, some activities outlined herein may be implemented with fixed logic or programmable logic (for example, software and/or computer instructions executed by a processor) and the elements identified herein could be some type of a programmable processor, programmable digital logic (for example, a field programmable gate array (FPGA), an erasable programmable read only memory (EPROM), an electrically erasable programmable read only memory (EEPROM)), an ASIC that includes digital logic, software, code, electronic instructions, flash memory, optical disks, CD-ROMs, DVD ROMs, magnetic or optical cards, other types of machine-readable mediums suitable for storing electronic instructions, or any suitable combination thereof.

In operation, a storage such as storage may store information in any suitable type of tangible, non-transitory storage medium (for example, random access memory (RAM), read only memory (ROM), field programmable gate array (FPGA), erasable programmable read only memory (EPROM), electrically erasable programmable ROM (EEPROM), etc.), software, hardware (for example, processor instructions or microcode), or in any other suitable component, device, element, or object where appropriate and based on particular needs. Furthermore, the information being tracked, sent, received, or stored in a processor could be provided in any database, register, table, cache, queue, control list, or storage structure, based on particular needs and implementations, all of which could be referenced in any suitable timeframe. Any of the memory or storage elements disclosed herein, such as memory 220 and storage 250, should be construed as being encompassed within the broad terms ‘memory’ and ‘storage,’ as appropriate. A non-transitory storage medium herein is expressly intended to include any non-transitory special-purpose or programmable hardware configured to provide the disclosed operations, or to cause a processor such as processor 210 to perform the disclosed operations.

Computer program logic implementing all or part of the functionality described herein is embodied in various forms, including, but in no way limited to, a source code form, a computer executable form, machine instructions or microcode, programmable hardware, and various intermediate forms (for example, forms generated by an assembler, compiler, linker, or locator). In an example, source code includes a series of computer program instructions implemented in various programming languages, such as an object code, an assembly language, or a high-level language such as OpenCL, FORTRAN, C, C++, JAVA, or HTML for use with various operating systems or operating environments, or in hardware description languages such as Spice, Verilog, and VHDL. The source code may define and use various data structures and communication messages. The source code may be in a computer executable form (e.g., via an interpreter), or the source code may be converted (e.g., via a translator, assembler, or compiler) into a computer executable form, or converted to an intermediate form such as byte code. Where appropriate, any of the foregoing may be used to build or describe appropriate discrete or integrated circuits, whether sequential, combinatorial, state machines, or otherwise.

In one example embodiment, any number of electrical circuits of the FIGURES may be implemented on a board of an associated electronic device. The board can be a general circuit board that can hold various components of the internal electronic system of the electronic device and, further, provide connectors for other peripherals. More specifically, the board can provide the electrical connections by which the other components of the system can communicate electrically. Any suitable processor and memory can be suitably coupled to the board based on particular configuration needs, processing demands, and computing designs. Other components such as external storage, additional sensors, controllers for audio/video display, and peripheral devices may be attached to the board as plug-in cards, via cables, or integrated into the board itself. In another example, the electrical circuits of the FIGURES may be implemented as stand-alone modules (e.g., a device with associated components and circuitry configured to perform a specific application or function) or implemented as plug-in modules into application specific hardware of electronic devices.

Note that with the numerous examples provided herein, interaction may be described in terms of two, three, four, or more electrical components. However, this has been done for purposes of clarity and example only. It should be appreciated that the system can be consolidated or reconfigured in any suitable manner. Along similar design alternatives, any of the illustrated components, modules, and elements of the FIGURES may be combined in various possible configurations, all of which are within the broad scope of this specification. In certain cases, it may be easier to describe one or more of the functionalities of a given set of flows by only referencing a limited number of electrical elements. It should be appreciated that the electrical circuits of the FIGURES and its teachings are readily scalable and can accommodate a large number of components, as well as more complicated/sophisticated arrangements and configurations. Accordingly, the examples provided should not limit the scope or inhibit the broad teachings of the electrical circuits as potentially applied to a myriad of other architectures.

Numerous other changes, substitutions, variations, alterations, and modifications may be ascertained to one skilled in the art and it is intended that the present disclosure encompass all such changes, substitutions, variations, alterations, and modifications as falling within the scope of the appended claims. In order to assist the United States Patent and Trademark Office (USPTO) and, additionally, any readers of any patent issued on this application in interpreting the claims appended hereto, Applicant wishes to note that the Applicant: (a) does not intend any of the appended claims to invoke paragraph six (6) of 35 U.S.C. section 112 (pre-AIA) or paragraph (f) of the same section (post-AIA), as it exists on the date of the filing hereof unless the words “means for” or “steps for” are specifically used in the particular claims; and (b) does not intend, by any statement in the specification, to limit this disclosure in any way that is not otherwise expressly reflected in the appended claims.

Example Implementations

There is disclosed in one example, a key comprising: a tactile element; and a flexible and conductive external element disposed over the tactile element.

There is further disclosed an example, wherein the tactile element is a dome.

There is further disclosed an example, further comprising a dielectric support member disposed between the external element and the tactile element.

There is further disclosed an example, wherein the dielectric support member is disposed atop the tactile element.

There is further disclosed an example, wherein the dielectric support member is disposed below the tactile element.

There is further disclosed an example, wherein the dielectric is a polyethylene terephthalate (PET) wafer.

There is further disclosed an example, wherein the dielectric support member is affixed to the tactile element via a non-hardening adhesive resin.

There is further disclosed an example, wherein the conductive element is divided into a plurality of electrically isolated conductors.

There is further disclosed an example, wherein the plurality of electrically isolated conductors comprises four conductors.

There is further disclosed an example, wherein the keycap further comprises a display electrically connected to the external element.

There is further disclosed an example, wherein the display conforms substantially to a top form factor of the keycap.

There is further disclosed an example, wherein the display comprises: a mask that includes a one or more exposed areas; a top electrode; one or more bottom electrodes; a dielectric between the top electrode and the one or more bottom electrodes; and an electrical connection to create a differential voltage between the top electrode and the one or more bottom electrodes.

There is further disclosed an example, wherein a color of the dialectic material changes when a differential voltage is applied.

There is further disclosed an example of a keyboard comprising an adaptive key comprising the key.

There is further disclosed an example of a transmitter sheet having an interface for connecting to a transmitter board, and having disposed thereon a plurality of keys.

There is further disclosed an example of a method of manufacturing a keyboard, comprising: preparing a flexible, conductive external element; disposing the conductive external element over a key dome; and securely affixing the conductive external element to the key dome.

There is further disclosed an example, wherein preparing the conductive external element comprises provisioning a plurality of conductive arms.

There is further disclosed an example, further comprising etching to isolate the conductive arms from one another.

There is further disclosed an example, wherein securely affixing the conductive external element to the key dome comprises applying a non-conductive adhesive.

There is further disclosed an example, further comprising securing a rigid wafer between the top of the key dome and the conductive external member.

There is further disclosed an example, further comprising affixing the key dome to a carrier sheet.

There is further disclosed an example, further comprising passing the conductive external element through apertures in the carrier sheet, and affixing the conductive external element to the bottom of the carrier sheet.

There is further disclosed an example, further comprising affixing the key dome to a transmitter sheet.

There is further disclosed an example, further comprising passing the conductive external element through apertures in the transmitter sheet, and affixing the conductive element to conductive pads on the bottom of the transmitter sheet.

There is further disclosed an example, further comprising affixing the conductive element to conductive pads on the top of the transmitter sheet.

An electronic device, comprising: a plurality of active keys, the active keys comprising an active keycap element comprising: an electrically-driven display screen; a tactile element; and a flexible and conductive external element disposed over the tactile element.

There is further disclosed an example, wherein the conductive element is divided into a plurality of electrically isolated conductors.

Claims

1. A key comprising: a structural dome member; andflexible and conductive external element disposed over and wrapped around the structural dome member.

2. The key of claim 1, further comprising a dielectric and a dielectric support member disposed between the external element and the structural dome member.

3. The key of claim 2, wherein the dielectric support member is disposed atop the structural dome member.

4. The key of claim 2, wherein the dielectric support member is disposed below the structural dome member.

5. The key of claim 2, wherein the dielectric is a polyethylene terephthalate (PET) wafer.

6. The key of claim 1, wherein the flexible and conductive external element is divided into a plurality of electrically isolated conductors.

7. The key of claim 6, wherein the plurality of electrically isolated conductors comprises four conductors.

8. The key of claim 1, further comprising a keycap, wherein the keycap further comprises a display electrically connected to the external element.

9. The key of claim 8, wherein the display conforms substantially to a top form factor of the keycap.

10. The key of claim 9, wherein the display comprises: a mask that includes one or more exposed areas;a top electrode;one or more bottom electrodes;a dielectric between the top electrode and the one or more bottom electrodes; andan electrical connection to create a differential voltage between the top electrode and the one or more bottom electrodes.

11. The key of claim 10, wherein a color of the dielectric material changes when a differential voltage is applied.

12. A keyboard comprising an adaptive key comprising the key of claim 1.

13. A transmitter sheet having an interface for connecting to a transmitter board, and having disposed thereon a plurality of keys according to claim 1.

14. A method of manufacturing a keyboard, comprising: preparing a flexible, conductive external element;wrapping the conductive external element around a key dome; andsecurely affixing the conductive external element to the key dome.

15. An electronic device, comprising: a plurality of active keys, the active keys comprising an active keycap element comprising: an electrically-driven display screen;a structural dome member; anda flexible and conductive wraparound external element disposed over and around the structural dome member.

16. The electronic device of claim 15, wherein the flexible and conductive wraparound external element is divided into a plurality of electrically isolated conductors.

17. A tactile computer keyboard, comprising: a plurality of adaptive keys, the adaptive keys comprising display means on a visible surface of the adaptive keys, and further comprising a conductive structural dome and an externally-attached conductive wrap-around element to provide power and data to the display means.

18. The tactile keyboard of claim 17, further comprising a structural disc on top of the structural dome.

19. The tactile keyboard of claim 18, wherein the structural disc is affixed to the top of the structural dome with a non-hardened adhesive resin.

20. The tactile keyboard of claim 18, wherein the structural disc is affixed to the top of the structural dome with tape adhesive.

21. The tactile keyboard of claim 17, further comprising a structural disc on bottom of the dome.

22. The tactile keyboard of claim 17, wherein the conductive wrap-around element comprises a conductive rip-stop fabric.

23. The tactile keyboard of claim 17, wherein the conductive wrap-around element comprises a nylon or nylon-like mesh.

24. The tactile keyboard of claim 23, wherein the nylon or nylon-like mesh comprises strands coated with conductive material.

25. The tactile keyboard of claim 17, wherein the conductive wrap-around is configured to provide electrical connection to a keycap without compromising the adaptive keys' tactile feel.