This application claims priority of Chinese Patent Application No. 201320486960.4, filed on Aug. 9, 2013, the disclosure of which is incorporated herein by reference.
1. Field of the Invention
This invention relates to an electrical connector, more particularly to an electrical connector that is in contact with a circuit board through a support block and an assembly of the electrical connector and the circuit board.
2. Description of the Related Art
A conventional board in connector comprises an insulating body, and a plurality of conductive terminals disposed on the insulating body. To solder and fix the board in connector to the circuit board, the conductive terminals of the board in connector are first inserted into a plurality of solder holes of the circuit board, respectively, such that a bottom surface of the insulating body abuts flatly against a top surface of the circuit board. An assembly of the board in connector and the circuit board is then passed through a tin furnace, so that liquid tin flows into each solder hole. After the liquid tin is solidified, each of the conductive terminals is soldered to the respective solder hole.
Because the bottom surface of the insulating body abuts flatly against the top surface of the circuit board, the following problems may occur during the tinning process in the tin furnace:
1. Because a top end of each solder hole is closed by the insulating body, the top end of each solder hole cannot communicate with the ambient atmosphere. When the liquid tin flows into each solder hole through a bottom end thereof, the liquid tin cannot completely fill up each solder hole, so that the amount of liquid tin for soldering each conductive terminal in the respective solder hole may be insufficient.
2. Because each conductive terminal that protrudes from a bottom surface of the circuit board is long, each two adjacent ones of the conductive terminals are likely to be connected to each other after the liquid tin is solidified, thereby possibly causing a short circuit.
3. Because the bottom surface of the insulating body is in contact with the high-temperature liquid tin for a long time, the insulating body is likely to melt and get damaged.
4. Based on the aforesaid phenomenon, the assembly and the soldering quality of the board in connector and the circuit board are easily affected, even causing waste of maintenance time during machine production and increase in losses and costs.
Therefore, an object of the present invention is to provide an electrical connector that is capable of increasing the amount of liquid tin for soldering a conductive terminal in a solder hole of a circuit board.
Another object of the present invention is to provide an electrical connector that is capable of preventing interconnection between two adjacent ones of conductive terminals during a tinning process in a tin furnace.
Still another object of the present invention is to provide an electrical connector that is capable of preventing an insulating body from being melted and damaged by high-temperature liquid tin during the tinning process in the tin furnace.
According to one aspect of this invention, an electrical connector for mounting on a circuit board having a solder hole comprises an insulating body and a conductive terminal. The insulating body includes a bottom surface, a receiving groove formed in the bottom surface, and at least one support block projecting downwardly from the bottom surface for connection with the circuit board. The bottom surface and the support block cooperatively define a venting space that communicates with the receiving groove and that is adapted to communicate with the solder hole. The conductive terminal includes a first positioning portion extending into and positioned in the receiving groove, and a second positioning portion connected to the first positioning portion and extending through the venting space and adapted to be positioned in the solder hole.
Yet another object of the present invention is to provide an assembly of an electrical connector and a circuit board that is capable of increasing the amount of liquid tin for soldering a conductive terminal in a solder hole of the circuit board.
Still yet another object of the present invention is to provide an assembly of an electrical connector and a circuit board that is capable of preventing interconnection between two adjacent ones of conductive terminals during a tinning process in a tin furnace.
A still further object of the present invention is to provide an assembly of an electrical connector and a circuit board that is capable of preventing an insulating body from being melted and damaged by high-temperature liquid tin during the tinning process in the tin furnace.
According to another aspect of this invention, an assembly of an electrical connector and a circuit board comprises a circuit board and an electrical connector. The circuit board has at least one solder hole. The electrical connector includes an insulating body and at least one conductive terminal. The insulating body includes a bottom surface, at least one receiving groove formed in the bottom surface, and at least one support block projecting downwardly from the bottom surface and connected to the circuit board. The bottom surface and the support block cooperatively define a venting space that communicates with the receiving groove and the solder hole. The conductive terminal includes a first positioning portion extending into and positioned in the receiving groove, and a second positioning portion connected to the first positioning portion and extending through the venting space and positioned in the solder hole.
The efficiency of this invention resides in that the amount of liquid tin for soldering each conductive terminal on the respective solder hole can be effectively increased, and direct connection of the resilient arms of each two adjacent ones of the conductive terminals after the liquid tin is solidified can be effectively prevented to thereby prevent the occurrence of short circuit. Further, the liquid tin is prevented from directly contacting the bottom surface of the insulating body when it flows out of the top end of each solder hole, thereby preventing the insulating body from being in contact with and being damaged by the high-temperature liquid tin.
Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiment with reference to the accompanying drawings, of which:
Before the present invention is described in greater detail, it should be noted herein that like elements are denoted by the same reference numerals throughout the disclosure.
Referring to
As shown in
More specifically, in this embodiment, each support block 213 is rectangular and has a length equal to that of the respective short side 216, so that a contact area between each support block 213 and the top surface 11 of the circuit board 1 is large. Thus, the insulating body 21 can be stably positioned on the top surface 11 of the circuit board 1 through the support blocks 213. Alternatively, the length of each support block 213 may be smaller than that of the respective short side 216.
Referring to
With reference to
Referring once again to
Because the insulating body 21 is mounted on the top surface 11 of the circuit board 1 through the support blocks 213, the bottom surface 211 of the insulating body 21 is lifted up at a suitable distance, so that the lengths of the two resilient arms 223 of each conductive terminal 22 which protrude out of the bottom surface 12 of the circuit board 1 can be shortened. This can effectively reduce direct connection of the resilient arms 23 of each two adjacent ones of the conductive terminals 22 after the liquid tin is solidified, thereby preventing the occurrence of short circuit. Further, because a suitable distance is maintained between the bottom surface 211 of the insulating body 21 and the top surface 11 of the circuit board 1, the liquid tin is prevented from directly contacting the bottom surface 211 of the insulating body 21 when it flows out of the top end of each solder hole 13. Hence, the insulating body 21 is prevented from being in contact with and being damaged by the high-temperature liquid tin.
In sum, because the insulating body 21 is mounted on the top surface 11 of the circuit board 1 through the support blocks 213, during passing of the assembly of the circuit board 1 and the electrical connector 2 through the tin furnace, liquid tin can push air in each solder hole 13 into the venting space 215, and from the venting space 215, air is smoothly discharged out into the external environment of the insulating body 21. As such, the liquid tin can smoothly and completely fill each solder hole 13, thereby effectively increasing the amount of liquid tin for soldering each conductive terminal 22 on the respective solder hole 13. Further, because a suitable distance is maintained between the bottom surface 211 of the insulating body 21 and the top surface 11 of the circuit board 1, the lengths of the two resilient arms 223 of each conductive terminal 22 which protrude out of the bottom surface 12 of the circuit board 1 can be shortened. This can effectively prevent direct connection of the resilient arms 23 of each two adjacent ones of the conductive terminals 22 after the liquid tin is solidified, thereby preventing the occurrence of short circuit. Moreover, the liquid tin is prevented from directly contacting the bottom surface 211 of the insulating body 21 when it flows out of the top end of each solder hole 13, thereby prevent ing the insulating body 21 from being in contact with and being damaged by the high-temperature liquid tin. Through this, the assembly of and the soldering quality between the circuit board 1 and the electrical connector can be significantly enhanced, so that waste of maintenance time during machine production and the increase of cost can be prevented. Therefore, the objects of this invention can be achieved.
While the present invention has been described in connection with what is considered the most practical and preferred embodiment, it is understood that this invention is not limited to the disclosed embodiment but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Number | Date | Country | Kind |
---|---|---|---|
201320486960.4 | Aug 2013 | CN | national |