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Printed elements for providing electric connections to or between printed circuits

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/11Printed elements for providing electric connections to or between printed circuits
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    DAMPING STRUCTURE
    • Publication number 20250071888
    • Publication date Feb 27, 2025
    • Apple Inc.
    • Shawn X. ARNOLD
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BURIED LINES AND RELATED FABRICATION TECHNIQUES
    • Publication number 20250072118
    • Publication date Feb 27, 2025
    • Micron Technology, Inc.
    • Hernan Castro
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD
    • Publication number 20250071889
    • Publication date Feb 27, 2025
    • Chipbond Technology Corporation
    • Kung-Tzu Tu
    • G01 - MEASURING TESTING
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250071887
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • In Gun KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250071897
    • Publication date Feb 27, 2025
    • LG Innotek Co., Ltd.
    • Dong Hun JOUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250071898
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Eun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD AND COIL DEVICE
    • Publication number 20250071899
    • Publication date Feb 27, 2025
    • SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    • Masaki MIYABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING WIRING...
    • Publication number 20250070003
    • Publication date Feb 27, 2025
    • TOPPAN Holdings Inc.
    • Kenta SUGAWARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD WITH INCREASED DURABILITY IN BENDING REGION A...
    • Publication number 20250071891
    • Publication date Feb 27, 2025
    • Samsung Electronics Co., Ltd.
    • Youngsun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
    • Publication number 20250071896
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seong Ho CHOI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR EFFICIENTLY CONNECTING MANY HIGH DENSITY SMT PCB/BACKPLA...
    • Publication number 20250071903
    • Publication date Feb 27, 2025
    • Samsung Electronics Co., Ltd.
    • Casey Glenn Thielen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BODY AND CONNECTOR-ATTACHED CIRCUIT BODY
    • Publication number 20250071900
    • Publication date Feb 27, 2025
    • YAZAKI CORPORATION
    • Hidehiko Shimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE PRINTED CIRCUIT AND DISPLAY DEVICE
    • Publication number 20250071901
    • Publication date Feb 27, 2025
    • KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD.
    • Ke LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250071902
    • Publication date Feb 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Eun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier With Embedded Interposer Laterally Between Electr...
    • Publication number 20250071907
    • Publication date Feb 27, 2025
    • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Minwoo Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS
    • Publication number 20250063664
    • Publication date Feb 20, 2025
    • Teradyne, Inc.
    • Daniel L. Engel
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER SUBSTRATE AND JIG
    • Publication number 20250063660
    • Publication date Feb 20, 2025
    • NIDEC ADVANCE TECHNOLOGY CORPORATION
    • Shigeki SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EDGE MOUNT MEMORY CONNECTOR WITH STAGGERED FOOTPRINT PINS
    • Publication number 20250063659
    • Publication date Feb 20, 2025
    • Intel Corporation
    • Landon HANKS
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20250063661
    • Publication date Feb 20, 2025
    • Sumitomo Electric Industries, Ltd.
    • Kenji TAKAHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250063653
    • Publication date Feb 20, 2025
    • InnoLux Corporation
    • Roger HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REUSABLE MODULAR SUBSTRATE
    • Publication number 20250063657
    • Publication date Feb 20, 2025
    • NXP USA, Inc.
    • Kabir Mirpuri
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VIA AND PAD ARRANGEMENT FOR PRINTED CIRCUIT BOARD
    • Publication number 20250063658
    • Publication date Feb 20, 2025
    • Cisco Technology, Inc.
    • Mike Sapozhnikov
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
    • Publication number 20250063662
    • Publication date Feb 20, 2025
    • Amphenol Corporation
    • Marc B. Cartier
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD FOR PLUG-IN TYPE BREAKERS
    • Publication number 20250063663
    • Publication date Feb 20, 2025
    • VERTIV CORPORATION
    • Yahya SAM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250063666
    • Publication date Feb 20, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Dae Jung BYUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Embedding Methods for Fine-Pitch Components and Corresponding Compo...
    • Publication number 20250063668
    • Publication date Feb 20, 2025
    • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Jeesoo Mok
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE INCLUDING INTERPOSER
    • Publication number 20250056723
    • Publication date Feb 13, 2025
    • Samsung Electronics Co., Ltd.
    • Dohyeong PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATES AND ELECTRONIC APPARATUSES
    • Publication number 20250056710
    • Publication date Feb 13, 2025
    • Hefei BOE Ruisheng Technology Co., Ltd.
    • Jiawei XU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250056713
    • Publication date Feb 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Ho-Jae LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAMERA MODULE AND OPTICAL DEVICE COMPRISING SAME
    • Publication number 20250056107
    • Publication date Feb 13, 2025
    • LG Innotek Co., Ltd.
    • Sang Yeon HAN
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE