Printed elements for providing electric connections to or between printed circuits

Industry

CPC
H05K1/11

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/11Printed elements for providing electric connections to or between printed circuits

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Wiring circuit board
- Patent number 12,369,247
- Issue date Jul 22, 2025
- Nitto Denko Corporation
- Hideki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,369,250
- Issue date Jul 22, 2025
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Addressable switch assembly for wellbore systems and method
- Patent number 12,366,143
- Issue date Jul 22, 2025
- Geodynamics, Inc.
- Phillip Phelps
- F42 - AMMUNITION BLASTING
Information Patent Grant
Circuit forming method
- Patent number 12,369,259
- Issue date Jul 22, 2025
- FUJI CORPORATION
- Kenji Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical communication module substrate
- Patent number 12,369,251
- Issue date Jul 22, 2025
- Nitto Denko Corporation
- Tadao Okawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit and connector element alignment, circuit board assemblies
- Patent number 12,369,253
- Issue date Jul 22, 2025
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Coil structure
- Patent number 12,362,084
- Issue date Jul 15, 2025
- Cyntec Co., Ltd.
- Min-Feng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure for flexible printed board and method for manu...
- Patent number 12,362,525
- Issue date Jul 15, 2025
- Autonetworks Technologies, Ltd.
- Shinji Nozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable mounting substrate
- Patent number 12,363,823
- Issue date Jul 15, 2025
- Murata Manufacturing Co., Ltd.
- Tadahiko Matsumoto
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,363,827
- Issue date Jul 15, 2025
- Ibiden Co., Ltd.
- Yoshiki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic substrate and electronic device
- Patent number 12,362,300
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disk device having an electronic component on a flexible printed ci...
- Patent number 12,354,625
- Issue date Jul 8, 2025
- Kabushiki Kaisha Toshiba
- Taichi Okano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component-incorporated substrate and method for manufacturing same
- Patent number 12,356,556
- Issue date Jul 8, 2025
- Fujikura Ltd.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having circuit carrier
- Patent number 12,356,558
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High durability solder terminals
- Patent number 12,356,545
- Issue date Jul 8, 2025
- Skyworks Solutions, Inc.
- Yuji Yashiro
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power supply device
- Patent number 12,355,347
- Issue date Jul 8, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Kai Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and image display device including same
- Patent number 12,356,540
- Issue date Jul 8, 2025
- LG Electronics Inc.
- Geumsub Sin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,356,546
- Issue date Jul 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woo Seok Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,356,547
- Issue date Jul 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package, electronic structure and manufacturing method t...
- Patent number 12,354,885
- Issue date Jul 8, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recyclable electronic device
- Patent number 12,349,286
- Issue date Jul 1, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Stephan Harkema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package component
- Patent number 12,349,268
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for achieving certain characteristics...
- Patent number 12,349,267
- Issue date Jul 1, 2025
- Juniper Networks, Inc.
- Dylan G. Rust-Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile SODIMM (small outline dual inline memory module)
- Patent number 12,349,274
- Issue date Jul 1, 2025
- Intel Corporation
- Raghavendra Rao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,349,283
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board including a core layer provided with plurality of ins...
- Patent number 12,349,288
- Issue date Jul 1, 2025
- LG Innotek Co., Ltd
- Myung Jae Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Co-planar interconnection mechanisms for circuit boards
- Patent number 12,349,276
- Issue date Jul 1, 2025
- Intel Corporation
- Mooi Ling Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitors in through glass vias
- Patent number 12,349,282
- Issue date Jul 1, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for linear lighting
- Patent number 12,345,398
- Issue date Jul 1, 2025
- Elemental LED, Inc.
- Kenneth A. Afan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost, low loss material for microwave or antenna printed circui...
- Patent number 12,347,927
- Issue date Jul 1, 2025
- Hughes Network Systems, L.L.C.
- Bingqian Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER DELIVERY SYSTEM FOR HIGH DENSITY SIGNALING AND HIGH POWER DEL...
- Publication number 20250240870
- Publication date Jul 24, 2025
- Cisco Technology, Inc.
- Wenbin Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250240876
- Publication date Jul 24, 2025
- KYOCERA CORPORATION
- Daichi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELAY, POWER DISTRIBUTION APPARATUS, AND CHARGING PILE
- Publication number 20250240892
- Publication date Jul 24, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Qiao WANG
- B60 - VEHICLES IN GENERAL
Information Patent Application
MULTI-LAMINATION STRUCTURE THAT ELIMINATES MICRO CAVITY RESONANCE
- Publication number 20250240873
- Publication date Jul 24, 2025
- Cisco Technology, Inc.
- Wenbin Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20250240874
- Publication date Jul 24, 2025
- Murata Manufacturing Co., Ltd.
- Ryutatsu MIZUKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20250240888
- Publication date Jul 24, 2025
- SAMSUNG DISPLAY CO., LTD.
- JAEJIN OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250240889
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LENS DRIVING DEVICE, CAMERA DEVICE, AND OPTICAL APPARATUS INCLUDING...
- Publication number 20250240897
- Publication date Jul 24, 2025
- LG Innotek Co., Ltd.
- Do Yun KIM
- G02 - OPTICS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20250237900
- Publication date Jul 24, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Ren XIONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD FASTENED INSIDE...
- Publication number 20250240900
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jinhwan JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWIN CRYSTAL COPPER MATERIAL AND HYBRID BONDING STRUCTURE
- Publication number 20250236981
- Publication date Jul 24, 2025
- SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY CHINESE ACADEMY OF SCIENCES
- Zhi-Quan LIU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN
- Publication number 20250239911
- Publication date Jul 24, 2025
- Milwaukee Electric Tool Corporation
- Matthew J. Mergener
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
CIRCUIT BOARD AND DISPLAY APPARATUS
- Publication number 20250240872
- Publication date Jul 24, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuang LEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Cooling Using PCB Through Holes
- Publication number 20250240878
- Publication date Jul 24, 2025
- Jordan K. Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250240881
- Publication date Jul 24, 2025
- Canon Kabushiki Kaisha
- TAKESHI HONDA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INTERPOSER FOR ACTIVE IMPLANTABLE MEDICAL DEVICE
- Publication number 20250240886
- Publication date Jul 24, 2025
- NeuroPace, Inc.
- Joseph Vandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250240887
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED ELECTRODE ASSEMBLY
- Publication number 20250240896
- Publication date Jul 24, 2025
- Coloplast A/S
- Anders Grove Sund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE MEMBER
- Publication number 20250234453
- Publication date Jul 17, 2025
- Hitachi, Ltd
- Daigo KOMESU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE
- Publication number 20250233092
- Publication date Jul 17, 2025
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...
- Publication number 20250227837
- Publication date Jul 10, 2025
- Rockwell Collins, Inc.
- John A. Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227841
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227842
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wearable Device for Sports Headwear
- Publication number 20250227839
- Publication date Jul 10, 2025
- HEAD IMPACT TRAUMA LIMITED
- David Euan Murray BOWEN
- A42 - HEADWEAR
Information Patent Application
SPLICED PRESSURE SENSING DEVICE AND SPLICABLE PRESSURE SENSING UNIT...
- Publication number 20250227843
- Publication date Jul 10, 2025
- TAIWAN ALPHA ELECTRONIC CO., LTD.
- Shuo-Tsan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CON...
- Publication number 20250227854
- Publication date Jul 10, 2025
- HAMILTON SUNDSTRAND CORPORATION
- Robert C. Cooney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER
- Publication number 20250227857
- Publication date Jul 10, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE C...
- Publication number 20250227840
- Publication date Jul 10, 2025
- LG Innotek Co., Ltd.
- Sang Hun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING SOLDER WALL
- Publication number 20250227852
- Publication date Jul 10, 2025
- Samsung Electronics Co., LTD
- Eun-seok HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20250218917
- Publication date Jul 3, 2025
- LG Display Co., Ltd.
- Jun HEO
- H01 - BASIC ELECTRIC ELEMENTS

Printed elements for providing electric connections to or between printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring circuit board

Circuit board structure and manufacturing method thereof

Addressable switch assembly for wellbore systems and method

Circuit forming method

Optical communication module substrate

Circuit and connector element alignment, circuit board assemblies

Coil structure

Connection structure for flexible printed board and method for manu...

Stretchable mounting substrate

Printed wiring board and method for manufacturing printed wiring board

Electronic substrate and electronic device

Disk device having an electronic component on a flexible printed ci...

Component-incorporated substrate and method for manufacturing same

Electronic assembly having circuit carrier

High durability solder terminals

Power supply device

Printed circuit board and image display device including same

Printed circuit board

Printed circuit board

Electronic package, electronic structure and manufacturing method t...

Recyclable electronic device

Package component

Apparatus, system, and method for achieving certain characteristics...

Low profile SODIMM (small outline dual inline memory module)

Electronic component embedded substrate

Circuit board including a core layer provided with plurality of ins...

Co-planar interconnection mechanisms for circuit boards

Capacitors in through glass vias

Connectors for linear lighting

Low cost, low loss material for microwave or antenna printed circui...

Patents Applicationslast 30 patents

POWER DELIVERY SYSTEM FOR HIGH DENSITY SIGNALING AND HIGH POWER DEL...

WIRING BOARD

RELAY, POWER DISTRIBUTION APPARATUS, AND CHARGING PILE

MULTI-LAMINATION STRUCTURE THAT ELIMINATES MICRO CAVITY RESONANCE

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

ELECTRONIC APPARATUS

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

LENS DRIVING DEVICE, CAMERA DEVICE, AND OPTICAL APPARATUS INCLUDING...

DISPLAY APPARATUS

ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD FASTENED INSIDE...

TWIN CRYSTAL COPPER MATERIAL AND HYBRID BONDING STRUCTURE

BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN

CIRCUIT BOARD AND DISPLAY APPARATUS

Liquid Cooling Using PCB Through Holes

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

INTERPOSER FOR ACTIVE IMPLANTABLE MEDICAL DEVICE

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED ELECTRODE ASSEMBLY

COMPOSITE MEMBER

ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE

SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

Wearable Device for Sports Headwear

SPLICED PRESSURE SENSING DEVICE AND SPLICABLE PRESSURE SENSING UNIT...

COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CON...

MANUFACTURING METHOD OF CIRCUIT CARRIER

FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE C...

ELECTRONIC DEVICE COMPRISING SOLDER WALL

DISPLAY DEVICE