Printed elements for providing electric connections to or between printed circuits

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CPC
H05K1/11

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/11Printed elements for providing electric connections to or between printed circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Spectral module and method for manufacturing spectral module
- Patent number 12,181,339
- Issue date Dec 31, 2024
- Hamamatsu Photonics K.K.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including electrostatic discharge path
- Patent number 12,181,936
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Separable interface cable structure for high voltage under-module p...
- Patent number 12,183,999
- Issue date Dec 31, 2024
- International Business Machines Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 12,177,971
- Issue date Dec 24, 2024
- Kyocera Corporation
- Tadashi Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,177,976
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,177,974
- Issue date Dec 24, 2024
- LG Innotek Co., Ltd
- Dong Hun Joung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extended center stiffener plate for improved structural dynamics of...
- Patent number 12,176,013
- Issue date Dec 24, 2024
- Western Digital Technologies, Inc.
- Jung-Seo Park
- G11 - INFORMATION STORAGE
Information Patent Grant
High frequency and high power thin film component
- Patent number 12,177,960
- Issue date Dec 24, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical transition from CPW to air waveguide using half-mode excit...
- Patent number 12,176,610
- Issue date Dec 24, 2024
- Oculii Corp
- Jun Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 12,177,973
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Shoichiro Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,177,975
- Issue date Dec 24, 2024
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Minimizing impedance tolerances due to misregistration
- Patent number 12,177,963
- Issue date Dec 24, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a flexible electronics assembly
- Patent number 12,177,968
- Issue date Dec 24, 2024
- The Boeing Company
- John E. Rogers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 12,177,977
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency circuit and communication module
- Patent number 12,171,059
- Issue date Dec 17, 2024
- Mitsubishi Electric Corporation
- Nobuo Ohata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect and method for manufacturing the same
- Patent number 12,171,064
- Issue date Dec 17, 2024
- Raytheon Company
- Brandon W. Pillans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 12,171,063
- Issue date Dec 17, 2024
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-throughput additively manufactured power delivery vias and traces
- Patent number 12,170,244
- Issue date Dec 17, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with inspection terminals
- Patent number 12,171,061
- Issue date Dec 17, 2024
- Seiko Epson Corporation
- Kyosuke Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and connector
- Patent number 12,170,423
- Issue date Dec 17, 2024
- Murata Manufacturing Co., Ltd.
- Takayoshi Obata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulation structures and printed circuit board including the same
- Patent number 12,167,532
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hyejin Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wiring substrate
- Patent number 12,167,535
- Issue date Dec 10, 2024
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image sensor package and camera device including same
- Patent number 12,160,946
- Issue date Dec 3, 2024
- LG Innotek Co., Ltd
- Seong Su Eom
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device
- Patent number 12,160,950
- Issue date Dec 3, 2024
- Innolux Corporation
- Roger Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board having a wiring pattern that has a multi-layer structure
- Patent number 12,160,954
- Issue date Dec 3, 2024
- Shinko Electric Industries Co., Ltd.
- Yusuke Gozu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,160,955
- Issue date Dec 3, 2024
- LG Innotek Co., Ltd
- Dong Sun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SWITCHES FOR MEDICATION CONTAINER CAPS
- Publication number 20240423872
- Publication date Dec 26, 2024
- Verily Life Sciences LLC
- Jasper Lodewyk Steyn
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240431024
- Publication date Dec 26, 2024
- Murata Manufacturing Co., Ltd.
- Hirofumi OIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...
- Publication number 20240431027
- Publication date Dec 26, 2024
- TOPPAN Holdings Inc.
- Yuki UMEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS
- Publication number 20240431026
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jaeho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431031
- Publication date Dec 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240431023
- Publication date Dec 26, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS
- Publication number 20240431025
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Takeshi Nogami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DESIGN OF A RECYCLABLE ELECTRONIC DEVICE
- Publication number 20240431037
- Publication date Dec 26, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Stephan HARKEMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DYNAMICALLY RECONFIGURABLE MAGNETIC CIRCUIT SYSTEMS WITH TUNABLE CO...
- Publication number 20240422898
- Publication date Dec 19, 2024
- Albert Moses Haim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...
- Publication number 20240422904
- Publication date Dec 19, 2024
- Chongqing BOE Electronic Technology Co., Ltd.
- Jie ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...
- Publication number 20240422906
- Publication date Dec 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Continuously Extending Vertical Connection S...
- Publication number 20240422907
- Publication date Dec 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus LEITGEB
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL, DISPLAY DEVICE, AND DRIVER CHIP
- Publication number 20240422909
- Publication date Dec 19, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Yiyu GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240422912
- Publication date Dec 19, 2024
- PanelSemi Corporation
- Sheng-Ping CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND CIRCUIT BOARD
- Publication number 20240422913
- Publication date Dec 19, 2024
- Murata Manufacturing Co., Ltd.
- Ryutatsu MIZUKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422901
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422908
- Publication date Dec 19, 2024
- LG Innotek Co., Ltd.
- Kyo Hun KOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUES FOR A MODULE CONNECTOR DESIGN TO IMPROVE PIN CONNECTION
- Publication number 20240421516
- Publication date Dec 19, 2024
- Intel Corporation
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIABLE-SPEED WITCH MODULE HAVING A DISCRETE ON/OFF DETECTION PAD
- Publication number 20240422903
- Publication date Dec 19, 2024
- Black & Decker Inc.
- Sefa HAZIR
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
IMPLANTABLE ELECTRONIC DEVICES
- Publication number 20240416134
- Publication date Dec 19, 2024
- CURONIX LLC
- Laura Tyler Perryman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...
- Publication number 20240422905
- Publication date Dec 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT CONNECTION OF CONTACTORS AND SHUNT TO PRINTED CIRCUIT BOARD
- Publication number 20240413557
- Publication date Dec 12, 2024
- Our Next Energy, Inc.
- Richard Hampo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE AND WIRING SUBSTRATE
- Publication number 20240413063
- Publication date Dec 12, 2024
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIR...
- Publication number 20240414848
- Publication date Dec 12, 2024
- AUTONETWORKS TECHNOLOGIES, LTD.
- Hideo TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20240414836
- Publication date Dec 12, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOTOR UNIT
- Publication number 20240414895
- Publication date Dec 12, 2024
- JTEKT CORPORATION
- Yuki HAYASHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240414843
- Publication date Dec 12, 2024
- GOERTEK INC.
- Katsumi SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240414844
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS

Printed elements for providing electric connections to or between printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Spectral module and method for manufacturing spectral module

Electronic device including electrostatic discharge path

Separable interface cable structure for high voltage under-module p...

Wiring board

Module

Circuit board

Extended center stiffener plate for improved structural dynamics of...

High frequency and high power thin film component

Vertical transition from CPW to air waveguide using half-mode excit...

Printed wiring board

Wiring substrate

Minimizing impedance tolerances due to misregistration

Circuit board and manufacturing method thereof and electronic device

Method of forming a flexible electronics assembly

Flexible printed circuit board and method of manufacturing flexible...

High-frequency circuit and communication module

Interconnect and method for manufacturing the same

Backplane footprint for high speed, high density electrical connectors

High-throughput additively manufactured power delivery vias and traces

Semiconductor apparatus with inspection terminals

Connector structure and connector

Component carrier with embedded interposer laterally between electr...

Insulation structures and printed circuit board including the same

Wiring substrate

Image sensor package and camera device including same

Electronic device

Circuit board structure and manufacturing method thereof

Wiring board having a wiring pattern that has a multi-layer structure

Circuit board

High density 3D interconnect configuration

Patents Applicationslast 30 patents

SWITCHES FOR MEDICATION CONTAINER CAPS

ELECTRONIC COMPONENT

GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...

APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD

CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS

DESIGN OF A RECYCLABLE ELECTRONIC DEVICE

DYNAMICALLY RECONFIGURABLE MAGNETIC CIRCUIT SYSTEMS WITH TUNABLE CO...

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...

SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...

Component Carrier With Continuously Extending Vertical Connection S...

DISPLAY PANEL, DISPLAY DEVICE, AND DRIVER CHIP

ELECTRONIC DEVICE

CIRCUIT MODULE AND CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

TECHNIQUES FOR A MODULE CONNECTOR DESIGN TO IMPROVE PIN CONNECTION

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

VARIABLE-SPEED WITCH MODULE HAVING A DISCRETE ON/OFF DETECTION PAD

IMPLANTABLE ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...

DIRECT CONNECTION OF CONTACTORS AND SHUNT TO PRINTED CIRCUIT BOARD

TERMINAL STRUCTURE AND WIRING SUBSTRATE

FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIR...

HEATSINK BASED POWER DELIVERY FOR CPUS

MOTOR UNIT

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME