Printed elements for providing electric connections to or between printed circuits

Industry

CPC
H05K1/11

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/11Printed elements for providing electric connections to or between printed circuits

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Coil structure
- Patent number 12,362,084
- Issue date Jul 15, 2025
- Cyntec Co., Ltd.
- Min-Feng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure for flexible printed board and method for manu...
- Patent number 12,362,525
- Issue date Jul 15, 2025
- Autonetworks Technologies, Ltd.
- Shinji Nozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable mounting substrate
- Patent number 12,363,823
- Issue date Jul 15, 2025
- Murata Manufacturing Co., Ltd.
- Tadahiko Matsumoto
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,363,827
- Issue date Jul 15, 2025
- Ibiden Co., Ltd.
- Yoshiki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic substrate and electronic device
- Patent number 12,362,300
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disk device having an electronic component on a flexible printed ci...
- Patent number 12,354,625
- Issue date Jul 8, 2025
- Kabushiki Kaisha Toshiba
- Taichi Okano
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component-incorporated substrate and method for manufacturing same
- Patent number 12,356,556
- Issue date Jul 8, 2025
- Fujikura Ltd.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having circuit carrier
- Patent number 12,356,558
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High durability solder terminals
- Patent number 12,356,545
- Issue date Jul 8, 2025
- Skyworks Solutions, Inc.
- Yuji Yashiro
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Printed circuit board and image display device including same
- Patent number 12,356,540
- Issue date Jul 8, 2025
- LG Electronics Inc.
- Geumsub Sin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply device
- Patent number 12,355,347
- Issue date Jul 8, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Kai Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,356,546
- Issue date Jul 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woo Seok Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,356,547
- Issue date Jul 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package, electronic structure and manufacturing method t...
- Patent number 12,354,885
- Issue date Jul 8, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recyclable electronic device
- Patent number 12,349,286
- Issue date Jul 1, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Stephan Harkema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package component
- Patent number 12,349,268
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for achieving certain characteristics...
- Patent number 12,349,267
- Issue date Jul 1, 2025
- Juniper Networks, Inc.
- Dylan G. Rust-Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile SODIMM (small outline dual inline memory module)
- Patent number 12,349,274
- Issue date Jul 1, 2025
- Intel Corporation
- Raghavendra Rao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,349,283
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board including a core layer provided with plurality of ins...
- Patent number 12,349,288
- Issue date Jul 1, 2025
- LG Innotek Co., Ltd
- Myung Jae Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost, low loss material for microwave or antenna printed circui...
- Patent number 12,347,927
- Issue date Jul 1, 2025
- Hughes Network Systems, L.L.C.
- Bingqian Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-planar interconnection mechanisms for circuit boards
- Patent number 12,349,276
- Issue date Jul 1, 2025
- Intel Corporation
- Mooi Ling Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitors in through glass vias
- Patent number 12,349,282
- Issue date Jul 1, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for linear lighting
- Patent number 12,345,398
- Issue date Jul 1, 2025
- Elemental LED, Inc.
- Kenneth A. Afan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of a curved electronic device using differential heatin...
- Patent number 12,349,272
- Issue date Jul 1, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Margaretha Maria De Kok
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board
- Patent number 12,349,273
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards with integrated inductors and antennas
- Patent number 12,349,281
- Issue date Jul 1, 2025
- Super Micro Computer, Inc.
- Manhtien V. Phan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator module
- Patent number 12,348,141
- Issue date Jul 1, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Lead finger for printed circuit board
- Patent number 12,342,458
- Issue date Jun 24, 2025
- SanDisk Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed wiring board and electric wiring
- Patent number 12,342,459
- Issue date Jun 24, 2025
- MEKTEC CORPORATION
- Shunsuke Aoyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE MEMBER
- Publication number 20250234453
- Publication date Jul 17, 2025
- Hitachi, Ltd
- Daigo KOMESU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE
- Publication number 20250233092
- Publication date Jul 17, 2025
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...
- Publication number 20250227837
- Publication date Jul 10, 2025
- Rockwell Collins, Inc.
- John A. Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227841
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227842
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wearable Device for Sports Headwear
- Publication number 20250227839
- Publication date Jul 10, 2025
- HEAD IMPACT TRAUMA LIMITED
- David Euan Murray BOWEN
- A42 - HEADWEAR
Information Patent Application
SPLICED PRESSURE SENSING DEVICE AND SPLICABLE PRESSURE SENSING UNIT...
- Publication number 20250227843
- Publication date Jul 10, 2025
- TAIWAN ALPHA ELECTRONIC CO., LTD.
- Shuo-Tsan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CON...
- Publication number 20250227854
- Publication date Jul 10, 2025
- HAMILTON SUNDSTRAND CORPORATION
- Robert C. Cooney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER
- Publication number 20250227857
- Publication date Jul 10, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE C...
- Publication number 20250227840
- Publication date Jul 10, 2025
- LG Innotek Co., Ltd.
- Sang Hun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING SOLDER WALL
- Publication number 20250227852
- Publication date Jul 10, 2025
- Samsung Electronics Co., LTD
- Eun-seok HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20250218917
- Publication date Jul 3, 2025
- LG Display Co., Ltd.
- Jun HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250218918
- Publication date Jul 3, 2025
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250218968
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Buwon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-DENSE, LOW-PROFILE EDGE CARD CONNECTOR
- Publication number 20250219310
- Publication date Jul 3, 2025
- SAMTEC, INC.
- Marc Epitaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250220815
- Publication date Jul 3, 2025
- PanelSemi Corporation
- CHIN-TANG LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND TERMINAL DEVICE
- Publication number 20250220816
- Publication date Jul 3, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- MING-HSUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA
- Publication number 20250220804
- Publication date Jul 3, 2025
- Prime World International Holdings Ltd.
- Chao-Hung TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250220810
- Publication date Jul 3, 2025
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD FOR INTERCONNECTING PIN(S) AND SEM...
- Publication number 20250220814
- Publication date Jul 3, 2025
- Shenzhen STS Microelectronics Co., Ltd.
- Qiao CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250210272
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Min Sik WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212326
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Jong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212327
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Yub Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY
- Publication number 20250212317
- Publication date Jun 26, 2025
- NVIDIA Corporation
- Tibet Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250212324
- Publication date Jun 26, 2025
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
- Publication number 20250212328
- Publication date Jun 26, 2025
- Nitto Denko Corporation
- Takaya KOUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC BOARD
- Publication number 20250212329
- Publication date Jun 26, 2025
- Lenovo (Beijing) Limited
- Seiji Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250212323
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Minjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSER
- Publication number 20250212331
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Jungsik PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GRID ARRAY ELECTRICAL CONNECTORS
- Publication number 20250210894
- Publication date Jun 26, 2025
- Intel Corporation
- Arturo PACHON MUNOZ
- H01 - BASIC ELECTRIC ELEMENTS

Printed elements for providing electric connections to or between printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Coil structure

Connection structure for flexible printed board and method for manu...

Stretchable mounting substrate

Printed wiring board and method for manufacturing printed wiring board

Electronic substrate and electronic device

Disk device having an electronic component on a flexible printed ci...

Component-incorporated substrate and method for manufacturing same

Electronic assembly having circuit carrier

High durability solder terminals

Printed circuit board and image display device including same

Power supply device

Printed circuit board

Printed circuit board

Electronic package, electronic structure and manufacturing method t...

Recyclable electronic device

Package component

Apparatus, system, and method for achieving certain characteristics...

Low profile SODIMM (small outline dual inline memory module)

Electronic component embedded substrate

Circuit board including a core layer provided with plurality of ins...

Low cost, low loss material for microwave or antenna printed circui...

Co-planar interconnection mechanisms for circuit boards

Capacitors in through glass vias

Connectors for linear lighting

Manufacture of a curved electronic device using differential heatin...

Printed circuit board

Printed circuit boards with integrated inductors and antennas

Voltage regulator module

Lead finger for printed circuit board

Flexible printed wiring board and electric wiring

Patents Applicationslast 30 patents

COMPOSITE MEMBER

ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE

SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

Wearable Device for Sports Headwear

SPLICED PRESSURE SENSING DEVICE AND SPLICABLE PRESSURE SENSING UNIT...

COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CON...

MANUFACTURING METHOD OF CIRCUIT CARRIER

FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE C...

ELECTRONIC DEVICE COMPRISING SOLDER WALL

DISPLAY DEVICE

ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ULTRA-DENSE, LOW-PROFILE EDGE CARD CONNECTOR

ELECTRONIC DEVICE

CIRCUIT BOARD ASSEMBLY AND TERMINAL DEVICE

OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA

CIRCUIT BOARD

MULTILAYER PRINTED CIRCUIT BOARD FOR INTERCONNECTING PIN(S) AND SEM...

MULTILAYER ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY

WIRING BOARD

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD

ELECTRONIC BOARD

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ELECTRONIC DEVICE INCLUDING INTERPOSER

GRID ARRAY ELECTRICAL CONNECTORS