BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded isometric view of an electrical connector of a prior art relating to the present invention;
FIG. 2 is an exploded isometric view of an electrical connector of a preferred embodiment in accordance with the present invention;
FIG. 3 is an enlarged view of the circled portion III of the FIG. 2;
FIG. 4 is an assembly view of the electrical connector of the present invention;
FIG. 5 is an plane view of an electrical connector of FIG. 4;
FIG. 6 is an enlarge view of a part of the electrical connector of FIG. 5;
FIG. 7 is an section view of the electrical connector of FIG. 6 take along the line VII-VII; and
FIG. 8 is an assembly view of the electrical connector, with the IC and the PCB assembled together.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE INVENTION
A preferred embodiment of the present invention will be described hereunder with reference to the accompanying drawings.
Referring to FIGS. 2-8, an LGA (Land Grid Array) electrical connector 1 of a preferred embodiment in accordance with the present invention is shown. The electrical connector is adapted to electrically connect two interfaces, such as an IC and a PCB, but not limited thereto. The electrical connector 1 mainly comprises an insulative housing 10 embedded with at least four electrical contacts 11 and defined a mating surface 101 adapted to support an IC 2. The insulative housing defines two opposite first sidewalls 100 and two opposite second sidewalls 104 adjacent to the first sidewalls 100, extending upwardly and seated around the mating surface 101. Said four sidewalls define a receiving cavity for receiving the IC 2. At least four passageways 1010 is defined in region with the mating surface 101 for receiving said at least four electrical contacts 11. A number of standoffs 102 is located between the mating surface 101 and said four sidewalls, seated around the mating surface 101 and extending upwardly above the mating surface 101. Each of the electrical passageways 1010 is associated a clipboard 1011 arranged between every two adjacent passageways 1010. The clapboard 1011 has protrusions 1013 extending upwardly therefrom along a direction perpendicular to a bottom surface of the IC package 2 seated on the mating surface 101, the cross section of the protrusions 1013 be of a triangle shape. The protrusions 1013 comprise first protrusions 1014 and second protrusions 1015 higher than the first protrusion 1014. Additionally, the second protrusion 1015 has a same height equal to the standoffs 102. The second protrusions 1015 and said standoffs are used to prop the IC 2 and reduce or cancel an external force, when the IC 2 is seated on the mating surface 101 and connects with the electrical contacts 11.
As shown in FIG. 7, the electrical contact 11 stamped from a sheet of resilient metal material comprises a resilient arm 110 having an engaging portion 1101 adapted to contact with the conductive pads 20 of the IC 2, a retaining portion 111 secured in the passageways 1010, which has a vertical portion 1110 for contacting with contact carrier (not shown), and a connecting portion 112 for connecting the retaining portion 111 and the resilient arm 110.
The two opposite second sidewalls 104 each have at least one post 1041 for positioning the IC 2 in the receiving cavity.
In an assembly process, the IC 2 is inserted into the receiving cavity under an external force and seated on the mating surface 101. During insertion of the IC into the receiving cavity, the IC 2 resilient deflect the resilient arm 110 downwardly, and the resilient arm 110 of the electrical contact exerts an normal force on the contact pads 20, thus ensuring proper electrical contact between the engaging portion 1101 of the electrical contact 11 and the conductive pads 20 of the IC 2. When the IC 2 is pressed downwardly by an external force, the second protrusions 1015 and said standoffs 102 being used to prop the IC and reduce or cancel the external force, thus ensuring the IC 2 avoided warpage and prop electrical connection between the engaging portion 1101 of the electrical contact 11 and the conductive pads 20 of the IC 2.
Furthermore, because of the first protrusion 1014 extending upwardly from the clipboard 1011 toward the IC 2, the connecting portion 112 of each electrical contact 11 is arranged between two adjacent first protrusions 1014, which allows the engaging portion 1101, the resilient arm 110 and the connecting portion of two adjacent electrical contacts without interference, while the IC is mated into the receiving cavity of the insulative housing 10 and seated on the mating surface 101 of the insulative housing 10. Thus, prop electrical connection between the engaging portions 1101 of the electrical contacts 11 and the conductive pads 20 of the IC 2 is provided and short-circuited is being avoided.
Furthermore, although the present invention has been described with the preferred embodiment referring to FIGS. 2-8, it is not to be construed as being limited thereto. Various alterations and modifications can be made to embodiment without in any way departing from the scope or spirit of the present invention as defined in appended claims.