The present invention relates generally to an electrical contact for use with an electronic package having circuit pads thereon, and particularly to the contact having two soldering pads joined together via a solder ball thereunder.
The traditional contact for use with an electronic package, e.g., the CPU (Central Processing Unit), essentially includes an upper spring arm for contacting the CPU, and a soldering pad with a solder ball thereon for mounting to a printed circuit board. Anyhow, a single soldering pad may result in a relatively large capacitive effect, thus increasing the signal loss in the high frequency transmission.
It is desired to provide an electrical contact with a lower capacitive effect.
To achieve the above object, an electrical connector includes an insulative housing with a plurality of passageways extending through opposite upper and lower surfaces of the housing. A plurality of electrical contacts are received within the corresponding passageways, respectively. Each contact includes a first main body and a second main body side by side arranged with each other with a bridge transversely linked therebetween. At least one of the first main body and the second main body includes a retaining barb for retaining the contact in the passageway. One spring arm extends from one end of one of the first main body and the second main body with a contacting section for mating with the CPU. Two soldering pads are formed on the corresponding bottom ends of the first main body and the second main body, respectively. The two soldering pads intimately confront each other either in a horizontal direction or in a vertical direction, and are joined together via a solder ball located under the two soldering pads.
Other advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
Referring to
The contact 2 includes a first main body 21 and a second main body 22 linking to each other via a bridge 26 transversely extending therebetween. The first main body 21 lies in a first plane and the second main body 22 lies in a second plane perpendicular to the first plane. A spring arm 23 extends upwardly from an upper portion of the first main body 21 with a contacting section 27 at a free end thereof. A first soldering pad 24 is formed at a lower portion of the first main body 21. A second soldering pad 25 is formed at a bottom portion of the second body 22. A first bending section 211 is located between the first main body 21 and the first soldering pad 24. A second bending section 222, a third bending section 223 and the fourth bending section 224 are sequentially formed between the second main body 22 and the second soldering pad 25. A pair of bars 221 are formed on two sides of the second main body 225 for retaining the contact 2 within the passageway 13. A connecting section 225 is located at an upper portion of the second main body 22 for linking to a contact carrier strip (not shown) for downwardly assembling the contact 2 into the passageway 13.
The contacting section 27 has a slot to form two separate contacting parts. A slot 231 is formed at a junction between the first main body 21 and the spring arm 23 for releasing forces. The first soldering pad 24 and the second soldering pad 25 are neighboring to each other in a coplanar manner. The solder ball 3 is joined with both the first soldering pad 24 and the second soldering pad 25. The first soldering pad 24 forms a first side edge 241, and the second soldering pad 25 forms a second side edge 251 confronting the first side edge with an optional tiny gap therebetween for forgiving manufacturing tolerance. Understandably, such a tiny gap may be omitted. The first soldering pad 24 further forms another side edge 242 and the second soldering pad 25 further forms another side edge 252 to cooperate with the side edge 242 for constituting the boundary of the common soldering pad unit. Notably, both the first main body 21 and the second main body 22 constitute a dual-path structure to result in a parallel circuit wherein a first path is from the spring arm 23, the first main body 21 and the first soldering pad 24 and a second path is from the spring arm 23, the upper portion of the first main body 21, the bridge 26, the second main body 22 and the second soldering pad 25, thus reducing signal loss during transmission between the CPU 500 and printed circuit board 600.
Referring to
Although the present invention has been described with reference to particular embodiments, it is not to be construed as being limited thereto. Various alterations and modifications can be made to the embodiments without in any way departing from the scope or spirit of the present invention as defined in the appended claims.
Number | Date | Country | Kind |
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201910651623.8 | Jul 2019 | CN | national |
Number | Name | Date | Kind |
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20080160844 | Chiang | Jul 2008 | A1 |
20090215291 | Taguchi | Aug 2009 | A1 |
Number | Date | Country |
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109524815 | Sep 2017 | CN |
208571022 | Aug 2018 | CN |
Number | Date | Country | |
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20210021067 A1 | Jan 2021 | US |