The invention relates to an electrical receptacle, and particularly to the electrical receptacle adapted for transmitting high speed signal.
Currently high speed electrical connector has a plurality of electrical lanes. Each of the electrical lanes may run at the rate of 25 Gbit/s or 50 Gbit/s. U.S. Pat. No. 8,764,464, issued to Buck et al., on Jul. 1, 2014, discloses example electrical connectors including a plurality of electrical contacts configured to communicate between electrical devices. The plurality of electrical contacts includes a plurality of ground contacts. A ground coupling assembly is configured to electrically connect ground contacts of an electrical connector to adjust a performance characteristic of the electrical connector as desired.
U.S. Pat. No. 7,798,820, issued on Sep. 21, 2010, discloses an optical transceiver module including an edge connector and a female host connector. The female host connector includes a row of first terminals having first contact sections, a row of second terminals having second contact sections, a row of third terminals having third contact sections and a row of the fourth terminal having fourth contact sections. The first contact section forwardly extends beyond the second contact section. The fourth terminal is in front of the third terminal. The edge connector includes a mating circuit board, the mating circuit board defines a number of contact pads on top of board and bottom of board. The contact pads includes a row of first pads and a row of second pads on the top of board, a row of third of pads and a row of fourth pads on the bottom of board. The first contact section connects with the first pad, the second contact section connects with the second pad, the third contact section connects with the third pad, and the fourth contact section connects with the fourth pad.
U.S. Pat. No. 8,727,793, issued on May 20, 2014, discloses a small SFP board with an end portion configured to be insert into a connector device. The SFP board has a first set of signal pads and a fourth set of signal pads on top surface, a second set of signal pads and a third set of signal pads on bottom surface. The fourth set of signal pads are offset in a longitudinal direction from the first set signal pads on the top surface. The third set of signal pads are offset in a longitudinal direction from the second set signal pads on the bottom surface.
An improved better high-frequency performance of the electrical receptacle is desired.
An object of the present invention, is to provide an electrical receptacle having means to transmit high speed signal.
To achieve the above-mentioned object, an electrical receptacle mounted onto a host board and electrically connecting with a mating electrical circuit board, comprising an insulative housing; and a row of first terminals, a row of second terminals, a row of third terminals, and a row of fourth terminals arranged along a vertical direction and mounted in the insulative housing, the first terminals and the fourth terminals forming a first mating port, the second terminals and the third terminals forming a second mating port, the first mating port forwardly extending beyond the second mating port; wherein the row of first terminals align with the row of second terminals along a up-to-down direction, the row of third terminals align with the row of fourth terminals along an up-to-down direction, the first terminals and the second terminals are offset in a longitudinal direction from the third terminals and the fourth terminals.
Another object of the present invention, is to provide an electrical receptacle having means to transmit high speed signal.
To achieve the above-mentioned object, an electrical receptacle for mating with a plug connector, comprising an insulative housing defining a front card receiving space and a rear module receiving space; a terminal module received within the module receiving space and comprising an upper half module and a lower half module stacked with each other in a vertical direction; said upper half module including an upper front part and an upper rear part cooperating with each other to sandwich an upper shielding plate therebetween in the vertical direction, the upper front part including a plurality of upper front terminals integrally formed with an upper front insulator via insert-molding, the upper rear part including a plurality of upper rear terminals integrally formed with an upper rear insulator via insert-molding, said upper shielding plate forming a plurality of upper springs extending upwardly through corresponding holes in the upper front insulator to mechanically and electrically connect corresponding upper front terminals for grounding, and a plurality of lower springs extending downwardly through corresponding holes to mechanically and electrically connect corresponding upper rear terminals for grounding; wherein front contacting sections of the upper front terminals and those of the upper rear terminals are located on a same upper side of the card receiving space.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
Reference will now be made in detail to the preferred embodiment of the present invention. Referring to
Referring to
Referring to
Referring to
The first insulative body 32 defines a number of first slits 320 on top face for exposing the first horizontal sections 311 in air. The first position part 33 defines a number of first openings 330 on rear face for exposing the first vertical sections 312 in air. The second insulative body 42 defines a number of second slits 420 on top face for exposing the second horizontal sections 411 in air. The second position parts 43 defines a number of second openings 430 on rear face for exposing the second vertical sections 412 in air. The third insulative body 52 defines a number of third slits 520 on bottom face for exposing the third horizontal sections 511 in air. The third position parts 53 defines a number of third openings 530 on rear face for exposing the third vertical sections 512 in air. The fourth insulative body 62 defines a number of fourth slits 620 on bottom face for exposing the fourth horizontal sections 611 in air.
Referring to
Referring to
The electrical receptacle 700 includes an insulative housing 702 forming a front card receiving space 704 and a rear module receiving space 706. The insulative housing 702 defines a card receiving space 704,with a plurality of upper passageways 708 above the card receiving space 704, and a plurality of lower passageways 710 below the card receiving space 704. A terminal module 712 is disposed in the module receiving space 706 and includes an upper half module 714 and a lower half module 734 stacked with each other in the vertical direction. The upper half module 714 includes an upper front part 716 having a plurality of upper front terminals 718 integrally formed with an upper front insulator 720 via an insert-molding process, and an upper rear part 722 having a plurality of upper rear terminals 724 integrally formed with an upper rear insulator 726 via another insert-molding process, and further with a metallic upper shielding plate 728 sandwiched between the upper front insulator 720 and the upper rear insulator 726 in the vertical direction, wherein the upper shielding plate 728 includes a plurality of upper spring tangs 730 extending upwardly through corresponding holes 721 in the upper front insulator 720 to mechanically and electrically connect to the corresponding selected grounding terminals of the upper front terminals 718, and a plurality of lower spring tangs 732 extending downwardly through corresponding holes 727 of the upper rear insulator 726 to mechanically and electrically connect to the corresponding selected grounding terminals of the upper rear terminals 724. Notably, during mating the front contacting section 717 of the upper front terminals 718 extend into the corresponding upper passageways 708 while the front contacting section 723 of the upper rear terminal 724 extend into the corresponding upper grooves 719 formed in the upper front insulator 720.
Similarly, the lower half module 734 includes a lower front piece 736 having a plurality of lower front terminals 738 integrally formed with a lower front insulator 740 via an insert-molding process, and a lower rear piece 742 having a plurality of lower rear terminals 744 integrally formed with a lower rear insulator 746 via another insert-molding process, and further with a metallic lower shielding plate 748 sandwiched between the lower front insulator 740 and the lower rear insulator 746 in the vertical direction wherein the lower shielding plate 748 includes a plurality of lower spring fingers 750 extending downwardly through the corresponding holes 741 in the lower front insulator 740 to mechanically and electrically connect to the corresponding selected grounding terminals of the lower front terminals 738, and a plurality of upper spring fingers 752 extending upwardly through the corresponding holes 747 of the lower rear insulator 746 to mechanically and electrically connect to the corresponding selected grounding terminals of the lower rear terminals 744. Notably, during mating the front contacting section 737 of the lower front terminals 738 extend into the corresponding lower passageways 710 while the front contacting section 743 of the upperlower rear terminal 744 extend into the corresponding lower grooves 739 formed in the lower front insulator 740.
Notably, each of the upper shielding plate 728 and the lower shielding plate 748 forms the opening 729, 749 corresponding to the corresponding high speed terminals in the vertical direction for reduction of resonance. Understandably, the layout of the upper front terminals 718 and the upper rear terminals 724, and the lower front terminals 738 and the lower rear terminals 744 are arranged same with those in the first embodiment. The posts-holes structure may be applied to the insulators and shielding plate so as to have the shielding plate retained between the stacked insulator without relative movement both vertically and horizontally. Similar to the first embodiment, in this embodiment the terminals of the same part/piece of the module is equipped with an insulative spacer 760 to secure the tails of the terminals in position without relative movements, and two opposite ends of the spacer 760 is retained in the corresponding slots 703 in an interior surfaces of the housing 702. It is also noted that because the terminals are molded within the corresponding part/piece of the module, the holes 721, 727, 741 and 747 extend through at least one corresponding surface of the insulator of the corresponding part/piece in at least one vertical direction. It is also noted that means for securing the terminal module 712 and the housing 702, e.g., protrusions vs. steps, may be applied thereon optimally. Similar to the first embodiment, even though a rear card received slot or space 766 is formed between the upper front insulator 720 and the lower front insulator 740 in the vertical direction and communicatively aligned with the front card receiving space 704 in the front-to-back direction to commonly form a full card receiving space, in this embodiments, a pair of slots 705 are optimally formed in opposite interior surfaces of the housing 702 to additionally hold two opposite lateral side edges of the inserted mating tongue, i.e., the printed circuit board of the plug connector, during mating. Similar to what is disclosed in the first embodiment, the housing 702 forms a downward face 702a and an upward face 702b by two sides of the front card receiving space 704 in the vertical direction. The upper front insulator 720 includes a downward/bottom face 720a directly and intimately downwardly facing the rear card receiving slot 766 and being horizontally coplanar with the downward face 702a, and the lower front insulator 740 forms an upward/top face 740a directly and intimately upwardly facing the rear card receiving slot 766 and being horizontally coplanar with the upward face 704b. Furthermore, the upper front insulator 720 forms a forward chamfered structure 7201 directly and intimately downwardly facing the rear card receiving space 766, and the lower front insulator 740 forms a forward chamfered structure 7401 directly and intimately upwardly facing the rear card receiving space 766. In addition, as shown in FIGS. 25(A) and 25(B), when no plug connector is mated, the front contacting section 723 downwardly abuts against the upper front insulator 720, and the front contacting section 743 upwardly abuts against the lower front insulator 740.
Referring to
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set fourth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the members in which the appended claims are expressed.
The present application is a reissue application of U.S. Pat. No. 10,367,308, issued Jul. 30, 2019, filed as U.S. application Ser. No. 15/795,234 on Oct. 26, 2017. The Ser. No. 15/795,234 application claims the benefit of U.S. Provisional Application No. 62/412,841 filed Oct. 26, 2016.
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The first Office Action of CN application No. 201711019769.8 dated Jul. 1, 2020, 07 Pages (04 Pages of English Translation and 03 Pages of Official notification). |
The second Office Action of CN application No. 201711019769.8 dated Jan. 26, 2021, 15 Pages (08 Pages of English Translation and 07 Pages of Official notification). |
The third Office Action of CN application No. 201711019769.8 dated Mar. 26, 2021, 12 Pages (07 Pages of English Translation and 05 Pages of Official notification). |
Office Action received for CN application No. 201711013519.3, the first Office Action dated Apr. 30, 2020, 15 Pages (07 Pages of English Translation and 08 Pages of Official notification). |
QDFP-DD Specification for QSFP Double Density 8X Pluggable Transceiver Rev 1.0 Sep. 15, 2016. |
QDFP-DD Specification for QSFP Double Density 8X Pluggable Transceiver Rev 0.1 Mar. 8, 2016. |
Number | Date | Country | |
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62412841 | Oct 2016 | US |
Number | Date | Country | |
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Parent | 15795234 | Oct 2017 | US |
Child | 17389033 | US |