Batteries tend to heat in various conditions. Due to the heating and the limited thermal conductivity of the battery—the internal parts of the battery may be warmer than the exterior of the battery.
The heating may damage and/or degrade the battery and there is a need to dissipate the heat developed even in the internal parts of the battery.
There may be provided systems, methods, and computer readable medium as illustrated in the specification.
The embodiments of the disclosure will be understood and appreciated more fully from the following detailed description, taken in conjunction with the drawings in which:
In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.
The subject matter regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. The invention, however, both as to organization and method of operation, together with objects, features, and advantages thereof, may best be understood by reference to the following detailed description when read with the accompanying drawings.
It will be appreciated that for simplicity and clarity of illustration, elements shown in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity. Further, where considered appropriate, reference numerals may be repeated among the figures to indicate corresponding or analogous elements.
Because the illustrated embodiments of the present invention may for the most part, be implemented using electronic components and circuits known to those skilled in the art, details will not be explained in any greater extent than that considered necessary as illustrated above, for the understanding and appreciation of the underlying concepts of the present invention and in order not to obfuscate or distract from the teachings of the present invention.
Any reference in the specification to a method should be applied mutatis mutandis to a device or system capable of executing the method.
Any reference in the specification to a system or device should be applied mutatis mutandis to a method that may be executed by the system,.
Any combination of any module or unit listed in any of the figures, any part of the specification and/or any claims may be provided.
Any combinations of systems, units, components, processors, sensors, illustrated in the specification and/or drawings may be provided.
There may be provided a method, and an electrochemical device that may include a thermal conductive path for cooling its interior.
An electrochemical device (“device”) may be an electrochemical cell (“cell”), may include one or more cells, may be an array of cells, may be or may include one or more electrochemical batteries (“batteries”), and may include one or more components in addition to any cell or battery.
The electrochemical device may be of any chemistries (i.e. supercapacitor, li-ion, sulphur, metal-based, etc).
The cell may be assembled in a manner that may include known steps-roll to roll, winding, jelly roll, stacked, z folded electrodes, etc as well as one of more additional steps such as forming the thermal conductive path, inserting elements such as one or more sensors with the thermal conductive path, and the like.
The cells may be of any size and shape-for example cylindrical, prismatic and the like.
The suggested device may exhibit
The cell form factor can be changed in both, linear (length) and radial (diameter) directions.
Placement and/or structure of the positive and negative terminals can be changed and/or optimized for the desired cell form factor, including the bolted connection design.
The thermal conductive path may be used for a flow of air, liquid, semi-solid and/or solid (or any combination thereof) cooling approach.
All mentioned cooling solutions can be applied by active and/or passive approach.
The thermal conductive path and case may include different materials, and have different thermal conductivity properties.
Cell electrodes are winded (jelly rolled, stacked, z folded electrodes, etc) around a hollow inner space. The sidewall of the inner space are defined by the innermost electrode. A thermal conductive path may be formed within the inner space—and may be made of thermal conductive material such as metal. The thermal conductive path may be exposed to the exterior of the cell and/or may be thermally coupled to a thermal conducting element that may be positioned between the thermal conductive path and the case or the exterior of case.
The thermal conductive path may include holes or openings or apertures (collectively referred to as opening) to enable electrode to flow from one opening to the other—and move within the cell—between different parts of the cell that do not belong to the thermal conductive path. Openings are denoted 47 in
The thermal path may be of any size (length, thickness, width, and the like may be of any value), may be of any shape, and there may be any relationship between one or more dimensions of thermal conductive path and one or more dimensions of the cell. The length of the thermal conductive path may be optimized for the desired cell form factor and design.
The thermal path may be through path—that pass through the entire cell—and can be seen from both sides of the path.
There may be more than a single thermal conductive path per cell or per battery. If there are more than a single path—they may be equal to each other, differ from each other, may be parallel to each other or oriented to each other, may be spaced apart from each other or may cross and/or join each other.
The thermal conductive path may be of any size, shape and orientation in relation to the cell.
A dimension (for example, length, width, radius) of the thermal conductive path may be changed (between one cell to another) and/or optimized for the desired cell form factor and design.
A dimension (for example, length, width, radius) of the thermal conductive path may be variable over the length of the path—for example for at least partially compensate for the “thermal” distance or resistance between different interior locations and the case.
The cell may include sensors that may be positioned (for example in a non-blocking manner or a blocking manner)-within the thermal conductive path.
The thermal conductive path may be partially filled with thermal conducting elements that are smaller than the path that also allow fluid to pass through the gaps between the thermal conducting elements.
Sensors may sense pressure, temperature and the like and may provide an indication of of heat, gas flow, stran, and etc generation.
One or more pressure sensor/s may be connected between or/and inside the fixation stand in order to measure the pressure inside the device and/or system in linear (length) and/or axial (radial) directions.
The thermal conductive path is applicable for any electrochemical devices and chemistries (i.e. supercapacitor, li-ion, sulphur, metal-based, etc).
Cell assembly process flow is in similar fashion to the standard one (i.e. roll to roll, winding, jelly roll, stacked, z folded electrodes, etc).
The thermal conductive path may be used for the cell fixation and integration to the module/pack structure, providing:
Easy fixation and assembly of the cells.
The fixation stand may be assembled as a separated unit or connected (i.e. as a part of) to the any of the module or/and pack plates.
The fixation stand may include a single or multiple units from one or different materials.
The thermal conductive path may be used for air, liquid, semi-solid and/or solid (or any combination thereof) cooling approach in parallel (in conjugation with) to the fixation an/or assembly stands.
Temperature, pressure, optical and other relevant sensors (or any combination thereof) can be integrated within the thermal conductive path in parallel (in conjugation with) to the fixation an/or assembly stands.
The same approach can be also applicable for other, than cylindrical cell designs, such as prismatic, etc.
Cell 22 includes a thermal conductive path 40 that reaches the bottom of the cell does not reach the top of the cell and is cylindrical.
Cell 23 includes a thermal conductive path 40 that includes an inner part 41 and an outer part 42 that surrounds the inner part 41, whereas the thermal conductive path 40 does not reach the top of the cell and is cylindrical. The inner part may be connected in a non-blocking manner to the outer part. The top of the inner part may be lower than the top of the outer part to allow a flow of fluid between the top of the inner part to the top of the outer part.
Cell 24 includes a thermal conductive path 40 that passes through the top of the cell (through positive terminal 11) without reaching the bottom of the cell.
Cell 25 includes a thermal conductive path 40 that passes through the top of the cell (through positive terminal 11) without reaching the bottom of the cell. The thermal conductive path 40 includes an inner part 41 and an outer part 42 that surrounds the inner part 42.
Cells 26 and 27 include a thermal conductive path 40 that passes through the entire cell—from top to bottom (even through positive terminal 11 and negative terminal). In cell 27, the thermal conductive path 40 also extends outside the cell.
Cell 28 illustrates a thermal conductive path 40 that has a cross section that changes along the longitudinal axis of the cell. In this example the cross section increases with a distance from boundaries (top and bottom) of the cell—till reaching a maximal value at the center (height wise) of the cell. The change in the cross section may be stepped, continuous, non-continuous, and the like.
Cell 81 is fixed to a module pack/plate 53 located below the cell using a fixation stand 52 that enters the bottom of the thermal conductive path 40.
Cell 82 is (a) fixed to a module pack/plate 53 located below the cell using a fixation stand 52 that enters the bottom of the thermal conductive path 40, and (b) fixed to a module pack/plate 53 located above the cell using another fixation stand 52 that enters the top of the thermal conductive path 40, through the positive terminal 11. There is a gap between the fixation stands 52.
Any fixation stand may have any thermal conductivity value.
In cell 84, another fixation stand 55 closes a gap between the top and bottom fixation stands 52.
In cell 85, a sensor such as a temperature sensor (thermal sensor) 62 is located within the gap between the top and bottom fixation stands 52—leaving a gap between the temperature sensor and one of the top and bottom fixation stands 52.
In cell 86, a sensor such as a temperature sensor 62 is located within the gap between the top and bottom fixation stands 52—without leaving a gap between the temperature sensor and any one of the top and bottom fixation stands 52.
Cell 91 includes an internal thermal conductive path 40 that is internal—the cell does not have an opening that exposes the thermal conductive path 40. The thermal conductive path 40 is thermally coupled to a thermal conductive base 49—for better dissipation of heat to the case.
Cell 92 includes a thermal conductive path 40 that is exposed to the exterior of the cell.
There is provided a structural battery that consists essentially of:
According to an embodiment, the coupling element include tabs.
According to an embodiment, the type-one electrodes are anodes and the type-two electrodes are cathodes.
According to an embodiment, the type-one electrodes are cathodes and the type-two electrodes are anodes.
According to an embodiment, the one or more fluid conductive paths are a single fluid conductive path, the one or more inner space pairs are a single inner space pair, and the one or more core cell pairs are a single core cell pair. An example of such structured battery is illustrate din
According to an embodiment, the frame conductive elements of the frame consist essentially of vertical sidewalls and horizontal frame conductive elements.
According to an embodiment, the thermal conductive path is located between the horizontal conductive elements and between vertical frame insolating elements.
According to an embodiment, the thermal conductive path runs along a length of at least two sets of electrodes out of the first type-one electrodes, the first type-two electrodes, the second type-one electrodes, or the second type-two electrodes.
Especially, referring to
According to an embodiment, the coupling elements may serially couple the first cell core to the second cell core. This connectivity may be obtained when coupling the anodes of the first and second cell cores to each other—without coupling the anodes of the first and second cell cores to each other.
According to an embodiment, the first cell core and the second cell core may be coupled in parallel to each other. This connectivity may be obtained when coupling the anodes of the first and second cell cores to each other—and coupling the anodes of the first and second cell cores to each other.
According to an embodiment the first cell core and the second cell core are not serially and not parallelly coupled to each other. This connectivity may be obtained without coupling the anodes of the first and second cell cores to each other—and without coupling the anodes of the first and second cell cores to each other
The tabs and/or any other coupling elements may be located in any location of the structured battery and/or may have any shape and/or size.
While in
In
While
In this case-the one or more fluid conductive paths are fluid conductive paths, the one or more inner space pairs are inner space pairs, and the one or more core cell pairs are core cell pairs.
According to an embodiment there is provided a method for charging any structured battery illustrated in the specification.
According to an embodiment there is provided a method for supplying power from any structured battery illustrated in the specification.
According to an embodiment there is provided a method for manufacturing any structured battery illustrated in the specification.
While the foregoing written description of the invention enables one of ordinary skill to make and use what is considered presently to be the best mode thereof, those of ordinary skill will understand and appreciate the existence of variations, combinations, and equivalents of the specific embodiment, method, and examples herein. The invention should therefore not be limited by the above described embodiment, method, and examples, but by all embodiments and methods within the scope and spirit of the invention as claimed.
In the foregoing specification, the invention has been described with reference to specific examples of embodiments of the invention. It will, however, be evident that various modifications and changes may be made therein without departing from the broader spirit and scope of the invention as set forth in the appended claims.
Those skilled in the art will recognize that the boundaries between logic blocks are merely illustrative and that alternative embodiments may merge logic blocks or circuit elements or impose an alternate decomposition of functionality upon various logic blocks or circuit elements. Thus, it is to be understood that the architectures depicted herein are merely exemplary, and that in fact many other architectures may be implemented which achieve the same functionality.
Any arrangement of components to achieve the same functionality is effectively “associated” such that the desired functionality is achieved. Hence, any two components herein combined to achieve a particular functionality may be seen as “associated with” each other such that the desired functionality is achieved, irrespective of architectures or intermedial components. Likewise, any two components so associated can also be viewed as being “operably connected,” or “operably coupled,” to each other to achieve the desired functionality.
Furthermore, those skilled in the art will recognize that boundaries between the above described operations merely illustrative. The multiple operations may be combined into a single operation, a single operation may be distributed in additional operations and operations may be executed at least partially overlapping in time. Moreover, alternative embodiments may include multiple instances of a particular operation, and the order of operations may be altered in various other embodiments.
Also for example, in one embodiment, the illustrated examples may be implemented as circuitry located on a single integrated circuit or within a same device. Alternatively, the examples may be implemented as any number of separate integrated circuits or separate devices interconnected with each other in a suitable manner.
However, other modifications, variations and alternatives are also possible. The specifications and drawings are, accordingly, to be regarded in an illustrative rather than in a restrictive sense.
In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word ‘comprising’ does not exclude the presence of other elements or steps then those listed in a claim. Furthermore, the terms “a” or “an,” as used herein, are defined as one or more than one. Also, the use of introductory phrases such as “at least one” and “one or more” in the claims should not be construed to imply that the introduction of another claim element by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim element to inventions containing only one such element, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an.” The same holds true for the use of definite articles. Unless stated otherwise, terms such as “first” and “second” are used to arbitrarily distinguish between the elements such terms describe. Thus, these terms are not necessarily intended to indicate temporal or other prioritization of such elements. The mere fact that certain measures are recited in mutually different claims does not indicate that a combination of these measures cannot be used to advantage.
While certain features of the invention have been illustrated and described herein, many modifications, substitutions, changes, and equivalents will now occur to those of ordinary skill in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
It is appreciated that various features of the embodiments of the disclosure which are, for clarity, described in the contexts of separate embodiments may also be provided in combination in a single embodiment. Conversely, various features of the embodiments of the disclosure which are, for brevity, described in the context of a single embodiment may also be provided separately or in any suitable sub-combination.
It will be appreciated by persons skilled in the art that the embodiments of the disclosure are not limited by what has been particularly shown and described hereinabove. Rather the scope of the embodiments of the disclosure is defined by the appended claims and equivalents thereof.
This application is a continuation-in-part (CIP) of U.S. patent application Ser. No. 17/454,617, filed Nov. 11, 2021 which in turn is a continuation-in-part (CIP) of U.S. patent application Ser. No. 17/304,647 filing date 6/23/2021 which claims priority from U.S. provisional patent 62/705,362, filing date 06/23/2020. application Ser. No. 17/454,617 also claims the benefit of U.S. provisional patent 63/199,744, filing date 01/21/2021; and U.S. provisional patent 63/198,786, filing date 11/12/2020.
Number | Date | Country | |
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62705362 | Jun 2020 | US | |
63199744 | Jan 2021 | US | |
63198786 | Nov 2020 | US |
Number | Date | Country | |
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Parent | 17454617 | Nov 2021 | US |
Child | 18450355 | US | |
Parent | 17304647 | Jun 2021 | US |
Child | 17454617 | US |