Claims
- 1. An electrode assembly for use with a microstimulator, comprising:
a conductive electrode with a core defining a hole through the center of the core of the electrode; a conductive wire electrically connected to the electrode through the core of the electrode; and a capacitor electrically connected to the wire.
- 2. The electrode assembly of claim 1, wherein the electrode is attached to a braze assembly, the braze assembly comprising:
a metal member including an exterior flange of the metal member, the exterior flange including an inner surface; a braze material including titanium and nickel; and a ceramic member including a formed end, wherein the formed end of the ceramic member adjoins the inner surface of the exterior flange and is brazed to metal member with the braze material.
- 3. The electrode assembly of claim 1, wherein at least one of the wire and the electrode is titanium.
- 4. The electrode assembly of claim 1, wherein the wire contains slack in between the electrode and the capacitor.
- 5. The electrode assembly of claim 1, wherein the wire is electrically connected to the electrode by laser spot welding.
- 6. The electrode assembly of claim 1, wherein the wire is electrically connected to the capacitor with conductive epoxy.
- 7. The electrode assembly of claim 1, wherein the wire is electrically connected to the capacitor using solder.
- 8. The electrode assembly of claim 1, wherein the wire forms a u-loop at the site of electrical connection between the wire and the capacitor.
- 9. An assembly carrier for housing the components of a microstimulator during assembly, comprising:
a groove in the assembly carrier, wherein the groove is capable of securing a microstimulator housing and a wire in the carrier; a wedge adjacent the groove, wherein the wedge is capable of pivoting and securing the wire within the groove; and an elevator in communication with the assembly carrier, wherein the elevator is capable of facilitating attachment of a capacitor to the wire; wherein a wire may exit the groove adjacent the capacitor.
- 10. The carrier of claim 9, wherein the elevator is a screw that is capable of elevating the capacitor in a substantially vertical direction until the capacitor is adjacent to the wire.
- 11. A method of electrically attaching a wire to a capacitor and an electrode of a microstimulator, comprising:
providing an electrode; forming a hole through the electrode; providing a wire; preparing the wire to prevent the wire from slipping through the hole in the electrode; threading the wire through the hole in the electrode; providing a capacitor; creating an electrical connection between the wire and the capacitor; and electrically connecting the wire to the electrode.
- 12. The method of claim 11, further comprising:
bending an end of the wire before creating an electrical connection between the wire and the capacitor; creating an electrical connection between the bent end of the wire and the capacitor; removing excess wire from the bent end of the wire after creating an electrical connection between the wire and the capacitor; removing excess wire from the wire where the wire electrically connects to the electrode after electrically connecting the wire to the electrode.
- 13. The method of claim 12, wherein electrically connecting the wire to the electrode includes laser spot welding and wherein removing excess wire includes laser spot welding.
- 14. The method of claim 12, further comprising:
securing the electrode, wire, and capacitor in an assembly carrier before creating an electrical connection between the wire and the capacitor; tightening an elevator screw on the assembly carrier to raise the capacitor until the capacitor touches the wire; and vertically housing the electrode, wire, and capacitor in an assembly carrier before electrically connecting the wire where it exits the electrode.
- 15. The method of claim 11, further comprising providing slack in the wire between the electrode and the capacitor.
- 16. The method of claim 11, wherein providing an electrode includes providing an electrode that is attached to a braze assembly.
- 17. The method of claim 11, wherein forming a hole through the electrode includes drilling a small diameter hole with a small diameter drill bit.
- 18. The method of claim 11, wherein preparing the wire includes at least one of: bending the wire, clipping another structure to the wire, and attaching at least one other structure to the wire.
- 19. The method of claim 11, wherein bending an end of the wire further includes bending the wire to a shape that permits maximum electrical contact with the capacitor.
- 20. The method of claim 11, wherein the electrode is attached to a braze assembly of a microstimulator.
Parent Case Info
[0001] The present application is a Divisional of U.S. application Ser. No. 10/609,457, filed Jun. 27, 2003; which claims the benefit of U.S. Provisional Patent Application Serial No. 60/392,475, filed Jun. 28, 2002, which applications are incorporated herein by reference in their entireties.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60392475 |
Jun 2002 |
US |
Divisions (1)
|
Number |
Date |
Country |
| Parent |
10609457 |
Jun 2003 |
US |
| Child |
10691201 |
Oct 2003 |
US |