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Gold (Au) as principal constituent

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  • H01L2224/45144
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45144Gold (Au) as principal constituent
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
    • Publication number 20250087546
    • Publication date Mar 13, 2025
    • Amkor Technology Singapore Holding Pte. Ltd
    • Joon Dong Kim
    • H01 - BASIC ELECTRIC ELEMENTS
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    SEMICONDUCTOR DEVICE
    • Publication number 20250079369
    • Publication date Mar 6, 2025
    • Rohm Co., Ltd.
    • Bungo TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
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    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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    • Publication date Mar 6, 2025
    • RENESAS ELECTRONICS CORPORATION
    • Yoshiharu SHIMIZU
    • H01 - BASIC ELECTRIC ELEMENTS
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    FUNCTIONAL COMPONENT, FORMING METHOD THEREOF AND ELECTRONIC DEVICE
    • Publication number 20250046699
    • Publication date Feb 6, 2025
    • Shanghai Avic Opto Electronics Co., Ltd.
    • Huijun JIN
    • H01 - BASIC ELECTRIC ELEMENTS
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    SEMICONDUCTOR PACKAGE
    • Publication number 20250046747
    • Publication date Feb 6, 2025
    • Samsung Electronics Co., Ltd.
    • Junyun KWEON
    • H01 - BASIC ELECTRIC ELEMENTS
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    SEMICONDUCTOR DEVICE
    • Publication number 20250029909
    • Publication date Jan 23, 2025
    • Mitsubishi Electric Corporation
    • Takuma NISHIMURA
    • H01 - BASIC ELECTRIC ELEMENTS
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    POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
    • Publication number 20250030386
    • Publication date Jan 23, 2025
    • Skyworks Solutions, Inc.
    • Weimin Sun
    • H01 - BASIC ELECTRIC ELEMENTS
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    SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
    • Publication number 20250006510
    • Publication date Jan 2, 2025
    • TEXAS INSTRUMENTS INCORPORATED
    • Yu Fu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240421048
    • Publication date Dec 19, 2024
    • ROHM CO., LTD.
    • Koki TANIZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240421123
    • Publication date Dec 19, 2024
    • Samsung Electronics Co., Ltd.
    • Chengtar Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTOELECTRONIC SYSTEM
    • Publication number 20240421266
    • Publication date Dec 19, 2024
    • EPISTAR CORPORATION
    • Min-Hsun HSIEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    NITRIDE SEMICONDUCTOR MODULE
    • Publication number 20240413235
    • Publication date Dec 12, 2024
    • Rohm Co., Ltd.
    • Hirotaka Otake
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
    • Publication number 20240404924
    • Publication date Dec 5, 2024
    • MEDIATEK INC.
    • Tsung-Ming Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
    • Publication number 20240404902
    • Publication date Dec 5, 2024
    • Amkor Technology Singapore Holding Pte. Ltd.
    • Won Bae BANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240395681
    • Publication date Nov 28, 2024
    • ROHM CO., LTD.
    • Bungo TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND INTERCONNECTION STRUCTURE
    • Publication number 20240395784
    • Publication date Nov 28, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Kuei-Hao TSENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240395691
    • Publication date Nov 28, 2024
    • Fuji Electric Co., Ltd.
    • Yuta EBUKURO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Fingerprint Sensor Device and Method
    • Publication number 20240386744
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yu-Chih Huang
    • G06 - COMPUTING CALCULATING COUNTING
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    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240387455
    • Publication date Nov 21, 2024
    • NHINC Co., Ltd.
    • Yun Hwa CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
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    CHIP PACKAGE
    • Publication number 20240379566
    • Publication date Nov 14, 2024
    • Ping-Jung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIGHT EMITTING DEVICE
    • Publication number 20240376380
    • Publication date Nov 14, 2024
    • Citizen Electronics Co., Ltd.
    • Byungchul HONG
    • H01 - BASIC ELECTRIC ELEMENTS
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    SEMICONDUCTOR MODULE
    • Publication number 20240379572
    • Publication date Nov 14, 2024
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Yuji MORINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
    • Publication number 20240371819
    • Publication date Nov 7, 2024
    • NANO-X IMAGING LTD.
    • Ukyo JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
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    IMAGE SENSOR MODULE
    • Publication number 20240363655
    • Publication date Oct 31, 2024
    • Reco BioTek Co., Ltd
    • Chang Cheng Fan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240363606
    • Publication date Oct 31, 2024
    • ROHM CO., LTD.
    • Yoshizo OSUMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Oscillator
    • Publication number 20240356490
    • Publication date Oct 24, 2024
    • SEIKO EPSON CORPORATION
    • Ryuto WADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240347499
    • Publication date Oct 17, 2024
    • Samsung Electronics Co., Ltd.
    • Hongjin KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND EQUIPMENT
    • Publication number 20240347565
    • Publication date Oct 17, 2024
    • Canon Kabushiki Kaisha
    • YU KATASE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
    • Publication number 20240339444
    • Publication date Oct 10, 2024
    • BOE TECHNOLOGY GROUP CO., LTD.
    • Xuan Liang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE FOR PRESS FIT ASSEMBLY
    • Publication number 20240332141
    • Publication date Oct 3, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Kwang-Soo Kim
    • H01 - BASIC ELECTRIC ELEMENTS