Claims
- 1. A process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:
- A. 0.005 gram per liter to 10.0 grams per liter of quaternized aryl and aralkyl amines selected from those exhibiting the formulae: ##STR29## wherein R', R", R'" and R"" are each independently selected from the group consisting of substituted and unsubstituted monovalent alkyl, aryl, aralkyl and cycloalkyl radicals provided that at least one aryl or aralkyl radical is present on each quaternary nitrogen atom; wherein Z is a bivalent hydrocarbon radical which may be substituted and/or interrupted by heteroatoms; wherein n=3 or 4; wherein the Anion may be absent if one of the radicals R' to R"" carries an anionic substituents and
- B. sulfoalkyl sulfide compounds containing the grouping --S--Alk--SO.sub.3 M where M is one gram-equivalent of a cation and -- Alk-- is a divalent radical selected from a group consisting of unsubstituted and substituted aliphatic hydrocarbon radicals containing 2 to 8 carbon atoms which may be interrupted by heteroatoms in an amount of 0.01 milligrams per liter to 1000 milligrams per liter.
- 2. The process as claimed in claim 1 where the cooperating amine is of the formula: ##STR30##
- 3. The process as claimed in claim 1 where the cooperating amine is of the formula:
- [ C.sub.6 H.sub.5 CH.sub.2 N.sup.+ (CH.sub.2 CHOHCH.sub.3).sub.3 ] Cl.sup.-
- 4. The process as claimed in claim 1 where the cooperating amine is of the formula: [(C.sub.6 H.sub.5 CH.sub.2).sub.2 N.sup.+ (CH.sub.3).sub.2 ] Cl.sup.-
- 5. The process as claimed in claim 1 where the cooperating amine is of the formula: ##STR31##
- 6. The process as claimed in claim 1 where the cooperating amine is of the formula: ##STR32##
- 7. The process as claimed in claim 1 where the cooperating amine is of the formula: ##STR33##
- 8. The process as claimed in claim 1 where the cooperating amine is of the formula: ##STR34##
- 9. The process as claimed in claim 1 where the cooperating amine is of the formula: ##STR35##
- 10. The process as claimed in claim 1 where the cooperating amine is of the formula: ##STR36##
- 11. The process as claimed in claim 1 where the cooperating amine is of the formula: ##STR37##
- 12. An aqueous acidic copper electroplating bath containing at least one member independently selected from each of the following two groups:
- A. 0.005 gram per liter to 10.0 grams per liter of quaternized aryl and aralkyl amines selected from those exhibiting the formulae: ##STR38## wherein R', R", R'" and R"" are each independently selected from the group consisting of substituted and unsubstituted monovalent alkyl, aryl, aralkyl and cycloalkyl radicals provided that at least one aryl or aralkyl radical is present on each quaternary nitrogen atom; wherein Z is a bivalent hydrocarbon radical which may be substituted and/or interrupted by heteroatoms; wherein n=3 or 4; and wherein the Anion may be absent if one of the radicals R' to R"" carries an anionic substituent and
- B. sulfoalkyl sulfide compounds containing the grouping --S--Alk---SO.sub.3 M where M is one gram-equivalent of a cation and -- Alk-- is a divalent radical selected from a group consisting of unsubstituted and substituted aliphatic hydrocarbon radicals containing 2 to 8 carbon atoms which may be interrupted by heteroatoms in an amount of 0.01 milligrams per liter to 1000 milligrams per liter.
- 13. An aqueous acidic copper electroplating bath as claimed in claim 12 wherein the cooperating amine exhibits the formula: ##STR39##
- 14. An aqueous acidic copper electroplating bath as claimed in claim 12 wherein the cooperating amine exhibits the formula:
- [ C.sub.6 H.sub.5 CH.sub.2 N.sup.+ (CH.sub.2 CHOHCH.sub.3).sub.3 ] Cl.sup.-
- 15. An aqueous acidic copper electroplating bath as claimed in claim 12 wherein the cooperating amine exhibits the formula:
- [(C.sub.6 H.sub.5 CH.sub.2).sub.2 N.sup.+ (CH.sub.3).sub.2 ] Cl
- 16. An aqueous acidic copper electroplating bath as claimed in claim 12 wherein the cooperating amine exhibits the formula: ##STR40##
- 17. An aqueous acidic copper electroplating bath as claimed in claim 12 wherein the cooperating amine exhibits the formiula: ##STR41##
- 18. An aqueous acidic copper electroplating bath as claimed in claim 12 wherein the cooperating amine exhibits the formula: ##STR42##
- 19. An aqueous acidic copper electroplating bath as claimed in claim 12 wherein the cooperating amine exhibits the formula: ##STR43##
- 20. An aqueous acidic copper electroplating bath as claimed in claim 12 wherein the cooperating amine exhibits the formula: ##STR44##
- 21. An aqueous acidic copper electroplating bath as claimed in claim 12 wherein the cooperating amine exhibits the formula: ##STR45##
- 22. An aqueous acidic copper electroplating bath as claimed in claim 12 wherein the cooperating amine exhibits the formula: ##STR46##
Parent Case Info
This application is a continuation in part of U.S. patent application Ser. No 641,965 filed Dec. 18, 1975 which in turn was a continuation of U.S. patent application Ser. No. 525,716 filed Nov. 21, 1974 which was a continuation in part of U.S. patent application Ser. No. 315,112 filed Dec. 14, 1972, all now abandoned.
US Referenced Citations (11)
Continuations (1)
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Number |
Date |
Country |
Parent |
525716 |
Nov 1974 |
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Continuation in Parts (2)
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Number |
Date |
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Parent |
641965 |
Dec 1975 |
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Parent |
315112 |
Dec 1972 |
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