Patent Grant
9598784
The present invention relates to an electroformed component and a method of producing the electroformed component.
Such contacts are sometimes used in such a manner as to be arranged at narrow pitches while maintaining electrical insulation from each other. For example, as disclosed in Patent Literature 1, the contacts may be used for a probe card that carries out electrical inspection of a highly dense microcircuit board. According to the probe card disclosed in Patent Literature 1, an insulator is sandwiched between a pair of substrates, and contacts such as those described above are contained in respective through-holes made through the insulator. Each of the substrates has supporting holes so as to face the corresponding through-holes of the insulator. Both ends of each of the contacts are inserted into respective supporting holes of corresponding substrates.
According to such a probe card, an end part of each of the contacts comes into contact with a corresponding electrode (inter-electrode pitch: 30 μm to 200 μm) of the microcircuit board to be measured. Therefore, narrow pitches between the electrodes of the microcircuit board to be measured make it necessary to provide the contacts to be arranged at narrow pitches as well.
According to the structure disclosed in Patent Literature 1, however, a thickness between adjacent through-holes and a thickness between adjacent supporting holes need to be thin in order to arrange the contacts at narrow pitches. This poses a problem in terms of strength of the probe card. In addition, even if pitches between adjacent through-holes and pitches between adjacent supporting holes can be made narrow, it is still difficult to insert the contacts, each of which is thin and extremely small, into corresponding through-holes and corresponding supporting holes, and then to arrange the contacts.
[Patent Literature 1]
Japanese Patent Application Publication, Tokukai, No. 2012-132685
It is an object of the present invention to provide (i) electroformed components which allow electroformed products, such as contact elements, to be arranged at narrow pitches while maintaining electrical insulation of the electroformed products from each other and (ii) an electroformed component production method of producing each of the electroformed components.
An electroformed component production method of the present invention includes: an electrodepositing step of fabricating an electroformed product by electrodepositing a metal on an exposed surface which is at least part of an electrically conductive base material and which is exposed within an opening of an insulating mold form; a mold form removing step of removing the insulating mold form from a surface of the electrically conductive base material; an insulating film forming step of covering a surface of the electroformed product with an insulating film; and an insulating film removing step of removing part of the insulating film while causing a remaining part of the insulating film to remain on at least part of the surface of the electroformed product.
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The following description will discuss suitable embodiments of the present invention with reference to the drawings. Note, however, that the present invention is not limited to the description of the embodiments below, but can be altered in many ways by a person skilled in the art within the scope of the claims.
An electroformed component production method according to Embodiment 1 of the present invention will be described below with reference to
According to an electroformed component production method of Embodiment 1, an electrically conductive base material 21 is first subjected to electrolytic degreasing. (A) of
Then, as illustrated in (A) of
In a case where the dry film resist 22 has been laminated on the top surface of the electrically conductive base material 21, the dry film resist 22 is irradiated with an ultraviolet laser beam with the use of a direct writing exposure device, so that an area inside a predetermined region is scanned. (A) of
The above description discussed, with reference to
Then, the dry film resist 22, which has been exposed to the light, is developed and rinsed. This causes the regions of the negative dry film resist 22, other than the exposed regions 22a, to be removed by a developing solution. A remaining part of the dry film resist 22 becomes a mold form 22b. This, as illustrated in (A) of
Then, the contact elements 25 are formed by electroforming (electroforming method) with the use of the electrically conductive base material 21 and the mold form 22b which serve as a matrix. Although not illustrated, an electrodepositing step is carried out such that (i) the matrix is provided in an electrolytic cell and then (ii) an electric current flows through an electrolytic solution by applying, with the use of a direct power supply, a voltage between the electrically conductive base material 21 and a counter electrode. When the electric current has started flowing, metal ions in the electrolytic solution are electrodeposited on the surfaces of the electrically conductive base material 21. This causes metal to be precipitated. Meanwhile, the mold form blocks the electric current. This prevents the metal from being electrodeposited directly on the mold form even in a case where a voltage is applied between the matrix and the counter electrode. Therefore, as illustrated in (A) of
In so doing, a thickness of each of the metals (contact elements 25) thus electrodeposited is determined by an accumulated electric current flowing amount of the electric current (i.e. a time-based accumulated amount of the flowing electric current). This is because of the following reason: Since an amount of metal precipitated per unit of time is proportional to an electric current value, a volume of the metal in each of the cavities 23 is determined by the accumulated electric current flowing amount of the electric current. Therefore, the thickness of the metal can be known by the accumulated electric current flowing amount of the electric current.
When the contact elements 25 have been formed, the mold form 22b is peeled by etching or the like. When the mold form 22b has been peeled, as illustrated in (A) of
Note that the position determining marks can be post-like protrusion parts which are formed by electroforming on the surface of the electrically conductive base material.
After the contact elements 25 and the frame parts 26 have been thus formed, the electrically conductive base material 21 is then covered, from above, with an insulating film 28 which is photosensitive (see (A) of
Alternatively, there is no problem in using a positive resist or a negative permanent resist as an insulating film 28.
Then, the insulating film 28 is irradiated with an ultraviolet laser beam with the use of a direct writing exposure device, so that an area inside a predetermined region is scanned. (A) of
Then, the insulating film 28, which has been exposed to the light, is developed and rinsed. This causes regions of the negative insulating film 28, other than the exposed regions 28a, to be removed by a developing solution. This, as illustrated in (A) of
Then, the contact elements 25 (i.e. contacts 29 (electroformed components)), which have the respective top surfaces on which the corresponding insulating films 28 are provided, are peeled from the electrically conductive base material 21 (see (A) of
With a method such as that described above, it is possible to (i) form, by a simple step on top surfaces (main surfaces) of extremely small contact elements 25, insulating films 28 having a uniform thickness and (ii) precisely form insulating films 28 all over surfaces of or on partial regions of contact elements 25 each having a complex shape.
Next, the following description will discuss, with reference to
According to the electroformed component production method of Embodiment 2, a plurality of position determining marks, that is, position determining holes 31, are first made at respective predetermined positions of an electrically conductive base material 21 (see (A) of
Note that in the example shown, position determining marks are the position determining holes 31 made through the electrically conductive base material 21. Alternatively, the position determining marks can be circular engraved marks, cross engraved marks or the like, or can be recess parts or the like.
Then, as illustrated in (A) of
Then, the dry film resist 22, which has been exposed to the light, is developed and rinsed. This causes the regions of the negative dry film resist 22, other than the exposed regions 22a, to be removed by a developing solution. Therefore, as illustrated in (A) of
Then, as illustrated in (A) of
When the contact elements 25 have been formed, the mold form 22b is peeled by etching or the like. This, as illustrated in (A) of
After the contact elements 25 have been formed, the electrically conductive base material 21 is then covered, from above, with an insulating film 28 (dry film resist) which is photosensitive (see (A) of
The position determining holes 31 are thus used as the same references for controlling the exposed region both when the dry film resist 22 is subjected to direct writing light exposure and when the insulating film 28 is subjected to direct writing light exposure. This allows an ultraviolet laser beam to be precisely scanned, for light exposure, along the predetermined regions located directly above the respective contact elements 25. Therefore, it is possible to reduce an amount by which the respective positions of the contact elements 25 and of the insulating film 28 are shifted from each other.
Then, the insulating film 28, which has been exposed to the light, is developed and rinsed. This, as illustrated in (A) of
Then, the contact elements 25 (i.e. contacts 29), which have the respective top surfaces on which the corresponding insulating films 28 are provided, are peeled from the electrically conductive base material 21 (see (A) of
With a method such as that described above also, it is possible to (i) form, by a simple step on top surfaces of extremely small contact elements 25, insulating films 28 having a uniform thickness and (ii) precisely form insulating films 28 all over surfaces of or on partial regions of contact elements 25 each having a complex shape.
(A) of
The contacts 41 are to be used, as described later, while being arranged at narrow pitches while maintaining electrical insulation of the contact elements 25 from each other. The contacts 41 are contained in a casing (not illustrated). The fixed parts 42 are fixed to the casing. The terminal parts 45 protrude from the casing. In such a state, the terminal parts come in contact with corresponding terminals of an integrated circuit, and the movable parts 43 are pressed down. This causes the terminal parts 45 to be pressed, by elasticity of the spring parts 44, against the corresponding terminals of the integrated circuit. Then, for example, electrical conduction failure or the like of each of the terminals of the integrated circuit is inspected.
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The contacts illustrated in each of
Note that in any of the above embodiments, an insulating film was provided only on a main surface on one side of a contact element. Alternatively, an insulating film can be provided on both main surfaces of a contact element (not illustrated).
As described above, an electroformed component production method of the present invention includes: an electrodepositing step of fabricating an electroformed product by electrodepositing a metal on an exposed surface which is at least part of an electrically conductive base material and which is exposed within an opening of an insulating mold form; a mold form removing step of removing the insulating mold form from a surface of the electrically conductive base material; an insulating film forming step of covering a surface of the electroformed product with an insulating film; and an insulating film removing step of removing part of the insulating film while causing a remaining part of the insulating film to remain on at least part of the surface of the electroformed product.
With the electroformed component production method of the present invention, it is possible to provide an insulating film on a surface of an electroformed product during a step of producing the electroformed product. This allows a thin insulating film to be provided on at least part of the surface of the electroformed product. Therefore, in a case where (i) the electroformed product includes a plurality of electroformed products, (ii) the insulating film includes a plurality of insulating films, and (iii) the plurality of electroformed products and the plurality of insulating films are alternately stacked, it is possible to arrange the plurality of electroformed products at narrow pitches while maintaining electrical insulation of the electroformed products from each other. In addition, the insulating film is thus provided on the surface of the electroformed product during the step of producing the electroformed product. Therefore, in a case where the electroformed product includes a plurality of electroformed products, the plurality of electroformed products can be stacked together during a step of producing the electroformed products. This allows the electroformed products to be precisely stacked together with an excellent production yield.
In the insulating film forming step, the insulating film covering the surface of the electroformed product can be a dry film resist or a liquid resist which has been applied to the surface of the electroformed product. In a case where the insulating film is a dry film resist, it is possible to facilitate the film forming step.
In order to fabricate the insulating mold form, it is only necessary to cause the part of the electrically conductive base material to be exposed in the opening by making the opening through part of an insulating mold form material which is provided on the surface of the electrically conductive base material (mold form fabricating step). After the insulating film removing step, it is only necessary to peel, from the electrically conductive base material, the electroformed product having the surface on which the remaining part of the insulating film is provided.
According to an aspect of the electroformed component production method in accordance with the present invention, the insulating film is a photosensitive film; and the insulating film removing step includes (i) an exposing step of irradiating, after the insulating film forming step, the insulating film with light while the electroformed product serves as a positional reference, so that a partial region, which corresponds to the at least part of the surface of the electroformed product, is made insoluble in a developing solution and (ii) a developing step of subjecting the insulating film to a development process, so as to remove a region of the insulating film, the region not having been made insoluble in the developing solution. With the aspect, it is possible to precisely pattern an insulating film by use of, for example, a negative resist and a photolithography technique.
According to another aspect of the electroformed component production method in accordance with the present invention, the insulating film is a photosensitive film; and the insulating film removing step includes (i) an exposing step of irradiating, after the insulating film forming step, the insulating film with light while the electroformed product serves as a positional reference, so that a region of the insulating film, which region is other than a partial region corresponding to the at least part of the surface of the electroformed product, is made soluble and (ii) a developing step of subjecting the insulating film to a development process, so as to remove the region of the insulating film. With the aspect, it is possible to precisely pattern an insulating film by use of, for example, a positive resist and a photolithography technique.
According to yet another aspect of the electroformed component production method in accordance with the present invention, the electroformed component production method further includes: a mold form fabricating step of (i) fabricating the insulating mold form by making the opening through an insulating mold form material which is provided on the surface of the electrically conductive base material and (ii) forming, with use of the insulating mold form material, a recess part or a protrusion part any of which is intended for fabricating a position determining mark, in the electrodepositing step, (i) the electroformed product being fabricated in the opening and (ii) the recess part or the protrusion part fabricating the position determining mark having a protruding form or a recessed form, respectively, and in the exposing step, light irradiation being carried out while the position determining mark serves as a positional reference. With the aspect, it is possible pattern the insulating film while the position determining mark, which is fabricated during the fabrication of the electroformed product, serves as a reference. This allows the insulating film to be precisely positioned with respect to the electroformed product.
According to a further aspect of the electroformed component production method in accordance with the present invention, the electroformed component production method further includes: a mold form material providing step of providing an insulating mold form material on a surface of the electrically conductive base material, which surface has a position determining mark; and a mold form fabricating step of fabricating the insulating mold form by making the opening through part of the insulating mold form material while the position determining mark serves as a positional reference, in the exposing step, light irradiation being carried out while the position determining mark serves as a positional reference. With the aspect, it is possible to (i) fabricate the electroformed product while a position determining hole, which is provided on the electrically conductive base material, serves as a reference and (ii) pattern the insulating film while the position determining hole serves as a reference. This allows the insulating film to be precisely positioned with respect to the electroformed product.
The electroformed component production method of the present invention can be used for, for example, a method of producing a contact which is an electroformed product.
A contact of the present invention includes: an electroformed product including (i) a spring part which is elastically deformable in a direction perpendicular to a voltage application direction in which a voltage is applied during formation of the contact by electroforming and (ii) a terminal part provided so as to be able to be pressed, by the spring part, against an external conductor; and an insulating film provided on at least part of a main surface of the electroformed product, which main surface is perpendicular to the voltage application direction.
The contact of the present invention is configured so that the insulating film is provided on at least part of a main surface of the electroformed product. Therefore, in a case where (i) the electroformed product includes a plurality of electroformed products, (ii) the insulating film includes a plurality of insulating films, and (iii) the plurality of electroformed products and the plurality of insulating films are alternately stacked, it is possible to arrange the plurality of electroformed products at narrow pitches while maintaining electrical insulation of the plurality of electroformed products from each other. Note that the main surface herein refers to a surface of the electroformed product, which surface is perpendicular to a voltage application direction in which a voltage is applied during electroforming. Note also that the insulating film herein does not include an oxide film or the like of the electroformed product.
According to an aspect of the contact in accordance with the present invention, the insulating film can be provided on at least part of a main surface on one side of the electroformed product or can be provided on at least part of each of both main surfaces of the electroformed product.
According to another aspect of the contact in accordance with the present invention, the insulating film can be provided on only part of the electroformed product. For example, a region, which protrudes from the insulating film on the electroformed product, can be plated with, for example, Au.
The insulating film can be provided on a region other than the spring part of the electroformed product. Alternatively, the insulating film can be provided on a region other than a part on which stress is concentrated when the electroformed product is elastically deformed. By providing the insulating film only on the spring part or on the region, it is possible to prevent the insulating film from being peeled by elastically deformation of the electroformed product or from breaking.
An electroformed component of the present invention includes: an insulating film provided on at least part of a main surface of the electroformed component, the main surface being perpendicular to a voltage application direction in which a voltage is applied during formation of the electroformed component by electroforming. The electroformed component of the present invention is configured so that the insulating film is thus provided on at least part of a main surface of the electroformed component. Therefore, in a case where (i) the electroformed product includes a plurality of electroformed products, (ii) the insulating film includes a plurality of insulating films, and (iii) the plurality of electroformed products and the plurality of insulating films are alternately stacked, it is possible to arrange the plurality of electroformed products at narrow pitches while maintaining electrical insulation of the plurality of electroformed products from each other. Note that the main surface herein refers to a surface perpendicular to a voltage application direction in which a voltage is applied during electroforming. Note also that the insulating film herein does not include an oxide film or the like of the electroformed product.
Note that according to the present invention, the technical means to solve the problem encompass a proper combination of the constituent elements disclosed above. The present invention can be altered in many ways by the proper combination of the constituent elements.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2013-161824 | Aug 2013 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2014/069339 | 7/22/2014 | WO | 00 |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2015/016099 | 2/5/2015 | WO | A |
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| Entry |
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| Notification of Transmittal of Translation of the International Preliminary Report on Patentability for corresponding International Application No. # PCT/JP2014/069339, mailed Feb. 11, 2016 (1 page). |
| International Preliminary Report on Patentability for corresponding International Application No. # PCT/JP2014/069339, mailed Feb. 2, 2016 (8 page). |
| International Search Report issued in PCT/JP2014/069339 mailed on Oct. 28, 2014 (3 pages). |
| Written Opinion of the International Searching Authority issued in PCT/JP2014/069339 mailed on Oct. 28, 2014 (5 pages). |
| Decision to Grant a Patent for corresponding Japanese Application No. 2013-161824 mailed on Jun. 30, 2015 (6 pages). |
| Notification of Reasons for Refusal for corresponding Japanese Application No. 2013-161824 mailed on Oct. 21, 2014 (9 pages). |
| Decision to Grant a Patent for corresponding Korean Application No. 10-2015-7030616 issued on Nov. 4, 2015 (2 pages). |
| Number | Date | Country | |
|---|---|---|---|
| 20160115610 A1 | Apr 2016 | US |
