Number | Date | Country | Kind |
---|---|---|---|
8-160444 | Jun 1996 | JP |
Filing Document | Filing Date | Country | Kind | 102e Date | 371c Date |
---|---|---|---|---|---|
PCT/JP96/03829 | WO | 00 | 12/1/1998 | 12/1/1998 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO97/46731 | 12/11/1997 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
4297436 | Kubotera et al. | Oct 1981 | |
4563217 | Kikuchi et al. | Jan 1986 | |
4632852 | Akahoshi et al. | Dec 1986 | |
4818286 | Jagannathan et al. | Apr 1989 | |
4908242 | Hughes et al. | Mar 1990 | |
5338342 | Mallory, Jr. | Aug 1994 | |
5502893 | Endoh et al. | Apr 1996 |
Number | Date | Country |
---|---|---|
60-155683 | Aug 1985 | JP |
2-30768 | Feb 1990 | JP |
2-145771 | Jun 1990 | JP |
4-116176 | Apr 1992 | JP |
4-157167 | May 1992 | JP |
4-198486 | Jul 1992 | JP |
6-302940 | Oct 1994 | JP |
7-240579 | Sep 1995 | JP |
Entry |
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“Oils and Fats and a Surface Active Agent as Known Chemical Substances and Related Substances Thereof”, Tokyo: Japan Soap and Detergent Assoc., Japan Surface-Active Agents Assoc., pp. 90-91, Apr. 1974. |
Tomoyuki Fujinami, The Journal Of The Surface Finishing Society Of Japan, vol. 42, No. 11, pp. 1068-1076, “The Present and Future Trends in the Electroless Copper Plating”, 1991. |
M. Matsuoka, et al., J. Electrochem. Soc., vol. 139, No. 9, pp. 2466-2470, “Kinetics of Electroless Copper Plating and Mechanical Properties of deposits”, Sep., 1992. |