by plating

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CPC
H05K3/384

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/384by plating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Surface-treated copper foil, copper-clad laminate and printed wirin...
- Patent number 12,063,747
- Issue date Aug 13, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a substrate with metal reflection layer
- Patent number 11,979,980
- Issue date May 7, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated copper foil and method for manufacturing same
- Patent number 11,952,675
- Issue date Apr 9, 2024
- NIPPON DENKAI, LTD.
- Toshio Kawasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Joined body of joining base material and metal layer
- Patent number 11,889,635
- Issue date Jan 30, 2024
- WORLD METAL CO., LTD
- Hidenori Hayashida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite copper foil
- Patent number 11,781,236
- Issue date Oct 10, 2023
- Namics Corporation
- Makiko Sato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treated copper foil, and copper-clad laminate plate, resin-...
- Patent number 11,770,904
- Issue date Sep 26, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,678,439
- Issue date Jun 13, 2023
- Macronix International Co., Ltd.
- Pei-Chi Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, manufacturing method thereof, copper f...
- Patent number 11,622,445
- Issue date Apr 4, 2023
- Iljin Materials Co., Ltd.
- Sang Hwa Yoon
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,382,217
- Issue date Jul 5, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,375,624
- Issue date Jun 28, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrodeposited copper foil and electrode, and lithium-ion seconda...
- Patent number 11,362,337
- Issue date Jun 14, 2022
- Chang Chun Petrochemical Co., Ltd.
- Huei-Fang Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,337,314
- Issue date May 17, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,337,315
- Issue date May 17, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of fabricating circuit board
- Patent number 11,304,310
- Issue date Apr 12, 2022
- Macronix International Co., Ltd.
- Pei-Chi Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodeposited copper foil, current collector, electrode, and lit...
- Patent number 11,283,080
- Issue date Mar 22, 2022
- Chang Chun Petrochemical Co., Ltd.
- Huei-Fang Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing the printed board
- Patent number 11,229,123
- Issue date Jan 18, 2022
- Nichia Corporation
- Masaaki Katsumata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated copper foil
- Patent number 11,145,867
- Issue date Oct 12, 2021
- Chang Chun Petrochemical Co., Ltd.
- Chien-Ming Lai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,993,331
- Issue date Apr 27, 2021
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,171
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,170
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated copper foil, copper foil with carrier, laminate, me...
- Patent number 10,820,414
- Issue date Oct 27, 2020
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-clad laminate, metal member with resin, and wiring board
- Patent number 10,820,413
- Issue date Oct 27, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Inoue
- B32 - LAYERED PRODUCTS
Information Patent Grant
Intermediate printed board for making multiple printed circuit boar...
- Patent number 10,785,876
- Issue date Sep 22, 2020
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for printed circuit
- Patent number 10,472,728
- Issue date Nov 12, 2019
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Surface-treated copper foil, copper foil with carrier, substrate, r...
- Patent number 10,257,938
- Issue date Apr 9, 2019
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,076,032
- Issue date Sep 11, 2018
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,051,746
- Issue date Aug 14, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having reduced loss of electric signal and me...
- Patent number 9,955,579
- Issue date Apr 24, 2018
- Nitto Denko Corporation
- Hiroyuki Tanabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Surface-treated copper foil, copper foil with carrier, substrate, r...
- Patent number 9,955,583
- Issue date Apr 24, 2018
- JX Nippon Mining & Metals Corporation
- Masafumi Ishii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin composite electrolytic copper foil, copper clad laminate and...
- Patent number 9,949,371
- Issue date Apr 17, 2018
- Mitsubishi Gas Chemical Company, Inc.
- Mitsuru Nozaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS
- Publication number 20240407105
- Publication date Dec 5, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preparing novel material layer structure of high-frequen...
- Publication number 20240244757
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...
- Publication number 20240215172
- Publication date Jun 27, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING B...
- Publication number 20230276579
- Publication date Aug 31, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD
- Publication number 20230276571
- Publication date Aug 31, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING PROCESS FOR EMBEDDED CHIPS
- Publication number 20230230929
- Publication date Jul 20, 2023
- Guangdong ZECHENG Technology Co., LTD
- CHIA-MING LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20230199945
- Publication date Jun 22, 2023
- LG ENERGY SOLUTION, LTD.
- Ga Young WOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE FILM AND ELECTRONIC DEVICE INCLUDING SAME
- Publication number 20230199947
- Publication date Jun 22, 2023
- TORAY ADVANCED MATERIALS KOREA INC.
- Jong Hun Cheon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE COPPER COMPONENTS
- Publication number 20230142375
- Publication date May 11, 2023
- Namics Corporation
- Naoki OBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Embedded Component on Stepped Metal Structur...
- Publication number 20230098587
- Publication date Mar 30, 2023
- AT&S (Chongqing) Company Limited
- Steve HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-TREATED COPPER FOIL AND METHOD FOR MANUFACTURING SAME
- Publication number 20230043755
- Publication date Feb 9, 2023
- NIPPON DENKAI, LTD.
- Toshio KAWASAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for preparing novel material layer structure of high-frequen...
- Publication number 20220304161
- Publication date Sep 22, 2022
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINED BODY OF JOINING BASE MATERIAL AND METAL LAYER
- Publication number 20220279661
- Publication date Sep 1, 2022
- WORLD METAL CO., LTD.
- Hidenori HAYASHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20220183162
- Publication date Jun 9, 2022
- Macronix International Co., Ltd.
- Pei-Chi HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20220117093
- Publication date Apr 14, 2022
- Macronix International Co., Ltd.
- Pei-Chi HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE PLATE, RESIN-...
- Publication number 20220087032
- Publication date Mar 17, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki KITAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE AND PRINT CIRCUIT BOARD COMPRISING THE SAME
- Publication number 20210368628
- Publication date Nov 25, 2021
- Circuit Foil Luxembourg, Sàrl
- Thomas DEVAHIF
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...
- Publication number 20210360785
- Publication date Nov 18, 2021
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...
- Publication number 20210337664
- Publication date Oct 28, 2021
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODEPOSITED COPPER FOIL AND ELECTRODE, AND LITHIUM-ION SECONDA...
- Publication number 20210305580
- Publication date Sep 30, 2021
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Huei-Fang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODEPOSITED COPPER FOIL, CURRENT COLLECTOR, ELECTRODE, AND LIT...
- Publication number 20210242467
- Publication date Aug 5, 2021
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Huei-Fang HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, MANUFACTURING METHOD THEREOF, COPPER F...
- Publication number 20210195737
- Publication date Jun 24, 2021
- ILJIN MATERIALS CO., LTD.
- Sang Hwa Yoon
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE TREATED COPPER FOIL
- Publication number 20200248330
- Publication date Aug 6, 2020
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Chien-Ming LAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS
- Publication number 20180332720
- Publication date Nov 15, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...
- Publication number 20180288884
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- Yuki Ori
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20180279482
- Publication date Sep 27, 2018
- JX NIPPON MINING & METALS CORPORATION
- Masafumi ISHII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal Foil, Metal Foil Having Release Layer, Laminated Material, Pr...
- Publication number 20180264783
- Publication date Sep 20, 2018
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURI...
- Publication number 20170280554
- Publication date Sep 28, 2017
- NIPPON MEKTRON, LTD.
- Ryoichi TOYOSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170127516
- Publication date May 4, 2017
- Sumitomo Electric Industries, Ltd.
- Takashi KASUGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Surface-treated copper foil, copper-clad laminate and printed wirin...

Method of fabricating a substrate with metal reflection layer

Surface-treated copper foil and method for manufacturing same

Joined body of joining base material and metal layer

Composite copper foil

Surface-treated copper foil, and copper-clad laminate plate, resin-...

Circuit board

Surface-treated copper foil, manufacturing method thereof, copper f...

Surface treated copper foil, copper clad laminate, and printed circ...

Surface treated copper foil, copper clad laminate, and printed circ...

Electrodeposited copper foil and electrode, and lithium-ion seconda...

Surface treated copper foil, copper clad laminate, and printed circ...

Surface treated copper foil, copper clad laminate, and printed circ...

Method of fabricating circuit board

Electrodeposited copper foil, current collector, electrode, and lit...

Method of manufacturing the printed board

Surface treated copper foil

High-speed interconnects for printed circuit boards

Surface treated copper foil, surface treated copper foil with resin...

Surface treated copper foil, surface treated copper foil with resin...

Surface treated copper foil, copper foil with carrier, laminate, me...

Metal-clad laminate, metal member with resin, and wiring board

Intermediate printed board for making multiple printed circuit boar...

Copper foil for printed circuit

Surface-treated copper foil, copper foil with carrier, substrate, r...

Substrate for printed circuit board, printed circuit board, and met...

High-speed interconnects for printed circuit boards

Printed circuit board having reduced loss of electric signal and me...

Surface-treated copper foil, copper foil with carrier, substrate, r...

Resin composite electrolytic copper foil, copper clad laminate and...

Patents Applicationslast 30 patents

X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

Method for preparing novel material layer structure of high-frequen...

SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...

MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING B...

COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD

PACKAGING PROCESS FOR EMBEDDED CHIPS

METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

COPPER CLAD LAMINATE FILM AND ELECTRONIC DEVICE INCLUDING SAME

COMPOSITE COPPER COMPONENTS

Component Carrier With Embedded Component on Stepped Metal Structur...

SURFACE-TREATED COPPER FOIL AND METHOD FOR MANUFACTURING SAME

Method for preparing novel material layer structure of high-frequen...

JOINED BODY OF JOINING BASE MATERIAL AND METAL LAYER

CIRCUIT BOARD

METHOD OF FABRICATING CIRCUIT BOARD

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE PLATE, RESIN-...

COPPER CLAD LAMINATE AND PRINT CIRCUIT BOARD COMPRISING THE SAME

Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...

Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...

ELECTRODEPOSITED COPPER FOIL AND ELECTRODE, AND LITHIUM-ION SECONDA...

ELECTRODEPOSITED COPPER FOIL, CURRENT COLLECTOR, ELECTRODE, AND LIT...

SURFACE-TREATED COPPER FOIL, MANUFACTURING METHOD THEREOF, COPPER F...

SURFACE TREATED COPPER FOIL

HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS

Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...

Metal Foil, Metal Foil Having Release Layer, Laminated Material, Pr...

MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURI...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...