Electrolytic solution supply and recovery facility and liquid component replenishment apparatus

Abstract

There is provided an electrolytic solution supply and recovery facility which, in response to an increase in the production amount of an associated electrolytic processing apparatus, can efficiently supply and recover an electrolytic solution while enhancing the productivity and lowering the production cost. An electrolytic solution supply and recovery facility for supplying and recovering an electrolytic solution to and from an electrolytic processing apparatus, includes: a fresh liquid supply section for storing a fresh electrolytic solution, said electrolytic solution having been transferred from a carry-in container that has been carried in from the outside, and for supplying the fresh electrolytic solution to the electrolytic processing apparatus; and a waste liquid recovery section for recovering the electrolytic solution from the electrolytic processing apparatus, storing the electrolytic solution and transferring the electrolytic solution to a carry-out container which is to be carried to the outside.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to an electrolytic solution supply and recovery facility and a liquid component replenishment apparatus, and more particularly to an electrolytic solution supply and recovery facility useful for supplying and recovering an electrolytic solution to and from an electrolytic processing apparatus, such as an electroplating apparatus for forming a film of an interconnect material, such as copper, on the surface of a substrate having fine interconnect patterns (recesses) or an electrolytic etching apparatus for etching and removing a metal film formed in a surface of a substrate, and a liquid component replenishment apparatus associated with the electrolytic solution supply and recovery facility.

[0003] 2. Description of the Related Art

[0004] FIG. 8 shows a conventional common construction of an electroplating system which includes an electroplating apparatus as an electrolytic processing apparatus, and a plating solution (electrolytic solution) supply and recovery facility, and which is used, for example, for the production of copper interconnects by plating. The electroplating system includes a rectangular electroplating apparatus (main apparatus) 12 and transport boxes 10 such as SMIF boxes, detachably mounted to the electroplating apparatus 12, each housing a number of substrates, such as semiconductor wafers. The electroplating apparatus 12 includes a stage 14, four electroplating units 16 and two cleaning units 18. The electroplating apparatus 12 is also provided with a first transport robot 20 as a transport device for transporting a substrate between one of the transport boxes 10 and the stage 14, and a second transport robot 22 as a transport device for transporting the substrate between the stage 14, one of the electroplating units 16 and one of the cleaning units 18.

[0005] In operation, one substrate is taken by the first transport robot 20 out of the transport box 10 housing substrates, and is placed on the stage 14. The substrate placed on the stage 14 is transported by the second transport robot 22 to one of the electroplating units 16, where electroplating, such as copper plating, of the substrate is carried out. The substrate after plating is transported by the second transport robot 22 to one of the cleaning units 18, where post-cleaning of the substrate and the subsequent spin-drying are carried out. The substrate after spin-drying is transported by the second transport robot 22 to the stage 14 and placed on the stage 14. The substrate placed on the stage 14 is then returned by the first transport robot 20 to the original position within the transport box 10.

[0006] In the electroplating apparatus 12 is installed a reservoir (intermediary plating solution tank) 24 for storing a plating solution and supplying the plating solution to each electroplating unit 16 in a circulatory manner, and a liquid component replenishment apparatus 26 for replenishing a deficient chemical component in the plating solution in the reservoir 24. Further, the electroplating apparatus 12 is equipped with a plating solution analyzer 28 for sampling and analyzing the plating solution in the reservoir 24. The plating solution in the reservoir 24 is sampled and analyzed by the plating solution analyzer 28. Based on the analytical results, a necessary chemical component is supplied (added) to the plating solution from the liquid component replenishment apparatus 26.

[0007] On the other hand, a plating solution supply and recovery facility 30 is provided adjacent to the electroplating apparatus 12. The plating solution supply and recovery facility 30 includes a carry-in container 32, such as a fresh liquid drum, which holds a fresh plating solution (fresh liquid) and is carried in from the outside, and a carry-out container 34, such as a waste liquid drum, which recovers and holds the used plating solution (waste liquid) and is carried to the outside. The carry-in container (fresh liquid drum) 32 and the reservoir 24 are connected by a plating solution supply line 36, and the carry-out container (waste liquid drum) 34 and the reservoir 24 are connected by a plating solution discharge line 38, so that the fresh plating solution held in the carry-in container 32, which has been carried in from the outside, is supplied to the reservoir 24 while the used plating solution (waste liquid) in the reservoir 24 is recovered and carried out to the outside by the carry-out container 34.

[0008] A so-called base bath (in the case of a copper sulfate plating solution, a mixture of inorganic components, such as copper sulfate, sulfuric acid, hydrochloric acid and water) is often used as the plating solution supplied as a fresh liquid. A chemical component(s), for example an additive (in the case of a copper sulfate plating solution, suppressor, accelerator and/or inhibitor), is supplied (added) from the liquid component replenishment apparatus 26 to the plating solution in the reservoir 24, according to necessity. Electrochemical analysis, chemical titration analysis, liquid chromatography, etc. are generally utilized for analysis by the plating solution analyzer 28.

[0009] When the number of the electroplating apparatuses 12 is relatively small, it is generally practiced to arrange the electroplating apparatuses 12, each provided with one plating solution supply and recovery facility 30, as shown in FIG. 8, in parallel. Further, because of a relatively small amount of liquid, a drum of a volume of about 200 L or a plastic container of about 20 L is commonly used as the carry-in container 32 for the supply of fresh liquid and as the carry-out container 34 for the discharge of waste liquid. A change of the drum or container is generally practiced by hand.

[0010] With such a conventional plating solution supply and recovery facility, however, supply and recovery of a plating solution cannot always be carried out efficiently, for example, when the production amount of e.g. a substrate is considerably increased. For example, a fresh liquid drum, when the fresh liquid in the drum is used up, needs to be promptly changed for a new one. When a signal requesting supply of the fresh liquid is outputted from the main plating apparatus during plating after a fresh liquid drum becomes empty, the apparatus must be stopped for a change of the drum in order to respond to the request. Likewise, when a discharge drum is filled up, the apparatus must be stopped for a change of the drum for an empty drum to respond to a waste liquid request signal. Such a stop of the apparatus for a change of drum lowers the operating rate of the apparatus, leading to an increase in the production cost.

[0011] Further, when the number of electroplating apparatuses is increased to meet an increased production amount, the number of drums to be changed also increases accordingly, necessitating frequent changes of drums. In addition, the worker must be engaged in the simple work of drum change for a longer time, which increases the labor cost and thus the production cost. Furthermore, moving such a heavy thing as a 200 L drum by hand is a dangerous work, and thus is undesirable in the light of safety.

[0012] While the conventional electroplating apparatus for performing electroplating using, as an electrolytic solution, a plating solution has been described hereinabove, the above situation is the same with etching apparatuses which perform the reverse process to plating, using as an electrolytic solution an etching liquid.

SUMMARY OF THE INVENTION

[0013] The present invention has been made in view of the above situation in the related art. It is therefore an object of the present invention to provide an electrolytic solution supply and recovery facility which, in response to an increase in the production amount of an associated electrolytic processing apparatus, can efficiently supply and recover an electrolytic solution while enhancing the productivity and lowering the production cost, and a liquid component replenishment apparatus associated with the electrolytic solution supply and recovery facility.

[0014] In order to achieve the above object, the present invention provides an electrolytic solution supply and recovery facility for supplying and recovering an electrolytic solution to and from an electrolytic processing apparatus, comprising: a fresh liquid supply section for storing a fresh electrolytic solution, said electrolytic solution having been transferred from a carry-in container that has been carried in from the outside, and for supplying the fresh electrolytic solution to the electrolytic processing apparatus; and a waste liquid recovery section for recovering the electrolytic solution from the electrolytic processing apparatus, storing the electrolytic solution and transferring the electrolytic solution to a carry-out container which is to be carried to the outside.

[0015] According to the electrolytic solution supply and recovery facility, even when the carry-in container, such as a fresh liquid drum, holding a fresh electrolytic solution becomes empty, or when the carry-out container, such as a waste liquid drum, is filled up, a fresh electrolytic solution (fresh liquid) can be supplied from the fresh liquid supply section to the electrolytic processing apparatus, or the used electrolytic solution (waste liquid) from the electrolytic processing apparatus can be recovered in the waste liquid recovery section. This enables a change of the carry-in container (fresh liquid drum) or the carry-out container (waste liquid drum) without a stop of the apparatus.

[0016] The electrolytic solution supply and recovery facility may further comprise a liquid component replenishment apparatus for replenishing the electrolytic solution in the fresh liquid supply section with a predetermined chemical component.

[0017] When using a so-called base bath as a fresh electrolytic solution to be supplied from the carry-in container, an additive can be supplied (added) from the liquid component replenishment apparatus to the base bath in the fresh liquid supply section to prepare an electrolytic solution having a predetermined (desired) composition so that the desired electrolytic solution can be supplied to the electrolytic processing apparatus.

[0018] The present invention also provides an electrolytic solution supply and recovery facility for supplying and recovering an electrolytic solution to and from a plurality of electrolytic processing apparatuses, comprising: a fresh liquid storage section for storing a fresh electrolytic solution which has been carried in from the outside; a fresh liquid supply section for storing the fresh electrolytic solution which has been transferred from the fresh liquid storage section and supplying the fresh liquid to each of the plurality of electrolytic processing apparatuses; a waste liquid recovery section for recovering the electrolytic solution from each of the plurality of electrolytic processing apparatuses and storing the electrolytic solution, and a waste liquid storage section for storing the electrolytic solution which has been transferred from the waste liquid recovery section and is to be carried to the outside.

[0019] This electrolytic solution supply and recovery facility can respond to an increase in the production amount of e.g. a substrate by increasing the number of electrolytic processing apparatuses. Further, this facility can avoid the need to stop the apparatuses and enables mass carrying-in and mass carrying-out of an electrolytic solution by e.g. a tanker. This reduces the workload of the electrolytic solution which must be consumed in a larger amount due to the increased number of electrolytic processing apparatuses.

[0020] In a preferred embodiment of the present invention, the electrolytic solution circulates between the fresh liquid supply section and each of the plurality of electrolytic processing apparatuses.

[0021] This enables reuse of the electrolytic solution by recycling.

[0022] In a preferred embodiment of the present invention, the fresh liquid storage section and the fresh liquid supply section are connected by a line provided with a filter.

[0023] Particles contained in the electrolytic solution can be removed by the filter upon transfer of the electrolytic solution from the fresh liquid storage section to the fresh liquid supply section. The line may also be provided with a vacuum deaeration unit in order to remove a dissolved gas in an electrolytic solution. Particles and a gas can lead to the formation of a poor plated film, for example. Removal of particles and a gas is particularly effective for the production of an LSI.

[0024] In a preferred embodiment of the present invention, each of the plurality of electrolytic processing apparatuses is provided with an electrolytic solution analyzer for analyzing a the electrolytic solution which has been supplied to the electrolytic processing apparatus, and a liquid component replenishment apparatus for replenishing the electrolytic solution with a chemical component based on the results of analysis by the electrolytic solution analyzer.

[0025] The present invention also provides a liquid component replenishment apparatus for metering a predetermined chemical component and replenishing an electrolytic solution with the chemical component, comprising; a total amount metering device for metering the total amount of a supplementary chemical component stored in a storage container; and a dose metering device for metering a dose of the chemical component to be transferred and supplied from the storage container to the electrolytic solution.

[0026] A dose metering device may be used which has an appropriate measurement range that meets an amount (dose) of a chemical component to be replenished (added). By precisely metering a small amount of chemical component (replenisher) with such a dose metering device and adding the metered amount of replenisher to an electrolytic solution, it becomes possible to supply (add) the chemical component in such an amount that meets the concentration accuracy requirement of e.g. within 0.5%, even when the amount is very small, for example on the order of ppb to ppm.

[0027] The metering devices may employ a gravimetric method and/or a volumetric method.

BRIEF DESCRIPTION OF THE DRAWINGS

[0028] FIG. 1 is a schematic plan view of an electroplating system (electrolytic processing system) provided with a plating solution (electrolytic solution) supply and recovery facility according to an embodiment of the present invention;

[0029] FIG. 2 is a schematic plan view of an electroplating system (electrolytic processing system) provided with a plating solution (electrolytic solution) supply and recovery facility according to another embodiment of the present invention;

[0030] FIG. 3 is a schematic plan view of a plating solution (electrolytic solution) supply and recovery facility according to yet another embodiment of the present invention;

[0031] FIGS. 4A through 4C are schematic diagrams showing various examples of a liquid component replenishment section of a liquid component replenishment apparatus;

[0032] FIG. 5 is a schematic plan view of an electroplating system (electrolytic processing system) provided with a plating solution (electrolytic solution) supply and recovery facility according to yet another embodiment of the present invention;

[0033] FIG. 6 is a schematic plan view of an electroplating system (electrolytic processing system) provided with a plating solution (electrolytic solution) supply and recovery facility according to yet another embodiment of the present invention;

[0034] FIG. 7 is a schematic plan view of an electroplating system (electrolytic processing system) provided with a plating solution (electrolytic solution) supply and recovery facility according to yet another embodiment of the present invention; and

[0035] FIG. 8 is a schematic plan view of an electroplating system provided with a conventional plating solution supply and recovery facility.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0036] Preferred embodiments of the present invention will now be described with reference to the drawings. Though the following description is made of electroplating systems which, as with the conventional system shown in FIG. 8, use as an electrolytic solution a plating solution, the description holds true with electrolytic etching systems which use as an electrolytic solution an electrolytic etching liquid. The same reference numerals as used for the conventional system shown in FIG. 8 refer to the same or corresponding elements, and a duplication description thereof will be omitted.

[0037] FIG. 1 shows an electroplating system provided with a plating solution supply and recovery facility according to an embodiment of the present invention. This electroplating system differs from the conventional system shown in FIG. 8 in the following respects.

[0038] The plating solution supply and recovery facility 40 of this embodiment includes a fresh liquid supply section 42, for example comprised of a drum, connected via the plating solution supply line 36 to the reservoir 24 disposed in the electroplating apparatus 12, and a waste liquid recovery section 44, for example comprised of a drum, connected via the plating solution discharge line 38 to the reservoir 24 therein. The carry-in container 32, such as a fresh liquid drum, which holds a fresh plating solution (fresh liquid) therein and has been carried in from the outside, is connected via a plating solution introduction line 46 to the fresh liquid supply section 42 and set in the plating solution supply and recovery facility 40. The carry-out container 34, such as a waste liquid drum, which recovers and holds the used plating solution (waste liquid) therein and is to be carried to the outside, is connected via a waste liquid introduction line 48 to the waste liquid recovery section 44 and set in the plating solution supply and recovery facility 40. The other construction is the same as the conventional system shown in FIG. 8.

[0039] According to this embodiment, the plating solution which has been supplied to the reservoir 24 disposed in the electroplating apparatus (main apparatus) 12, is circulated between the reservoir 24 and each of the electroplating units 16 disposed in the electroplating apparatus 12. The plating solution is thus reused while recycling. The plating solution supply and recovery facility 40 of this embodiment can prevent a lowering of the operating rate of the apparatus due to changes of the carry-in container 32 and the carry-out container 34, such as drums.

[0040] In particular, in regard to a fresh liquid (fresh plating solution), the provision of the fresh liquid supply section 42, for example comprised of a drum, separately from the carry-in container (fresh liquid drum) 32 makes it possible to supply a fresh liquid from the fresh liquid supply section 42 to the reservoir 24 even during the work of carrying in the carry-in container 32. Also with the waste liquid, the provision of the waste liquid recovery section 44, for example comprised of a drum, separately from the carry-out container (waste liquid drum) 34 makes it possible to recover the waste liquid from the reservoir 24 in the waste liquid recovery section 44 even during the work of carrying the carry-out container 34 out. Thus, the plating operation can be continued without a stop of the apparatus.

[0041] FIG. 2 shows an electroplating system provided with a plating solution supply and recovery facility 40a according to another embodiment of the present invention, which uses a plating solution without replenishment of a component. The electroplating system of this embodiment differs from the system shown in FIG. 1 in that the former system employs, as a fresh plating solution (fresh liquid) held in the carry-in container (fresh liquid drum) 32, a plating solution comprising a base bath premixed with a supplementary components, such as an additive, thereby omitting the liquid component replenishment apparatus 26 shown in FIG. 1. Instead of the liquid component replenishment apparatus 26, a waste liquid relay section 50 for storing the used plating solution (waste liquid) discharged from the electroplating unit 16 is provided, and the waste liquid relay section 50 and the waste liquid recovery section 44 are connected by the waste liquid discharge line 38.

[0042] If the premixed plating solution held in the carry-in container 32 is one which has undergone a reliable assay of the composition, there is then no need for a check of the composition of the plating solution by the plating solution analyzer 28. This, in addition to the omission of the liquid component replenishment apparatus 26, contributes to cost reduction.

[0043] The reservoir 24 and the waste liquid relay section 50 are generally comprised of a tank. They are, however, not limited to a container type. For example, it is possible to use a facility having a relay function, comprised of a pipeline and a value.

[0044] FIG. 3 shows a plating solution supply and recovery facility 40b according to yet another embodiment of the present invention. The plating solution supply and recovery facility 40b of this embodiment differs from the facility shown in FIG. 2 in that a so-called base bath is used as a fresh plating solution (fresh liquid) held in the carry-in container (fresh liquid drum) 32, and a chemical component, for example an additive, is supplied (added) from a liquid component replenishment apparatus 52, which is installed in the plating solution supply and recovery facility 40b, to the plating solution (fresh liquid) in the fresh liquid supply section 42, thereby preparing a plating solution having a predetermined (desired) composition.

[0045] According to this embodiment, taking a copper sulfate plating solution as an example, chemical components, such as a suppressor, an accelerator and an inhibitor, are supplied from the liquid component replenishment apparatus 52 to a fresh liquid (base bath) in the fresh liquid supply section 42 to thereby mix the chemical components into the base bath, thereby preparing a plating solution having a predetermined (desired) composition. The concentration of a chemical component in the plating solution to be supplied to the reservoir 24 can thus be adjusted as desired. This makes it possible to respond flexibly to a component adjustment or a change of chemical component in a plating solution, for example, when the composition of the plating solution must be changed with a change in the specifications of a substrate to be produced. The liquid component replenishment apparatus 52 includes a plurality of liquid component replenishment sections 54 corresponding to chemicals to be added to a fresh plating solution (base bath).

[0046] A particular component, such as an additive, contained in a plating solution (electrolytic solution) is usually a chemical agent, such as an inhibitor, and is generally used in a minute amount on the order of ppb to ppm. In the production of embedded interconnects in the LSI manufacturing field, it is necessary to embed an interconnect material, such as copper, by plating in interconnect trenches having a width of e.g. not more than 0.10 μm. The requirement for the concentration accuracy of a chemical component in a plating solution for use in such interconnect embedding is becoming strict. For example, an accuracy of about ±3% relative to a predetermined concentration is permitted for a chemical component in a plating solution for use in conventional electrolytic apparatuses, whereas an accuracy of not more than 0.5% is required in the field of ultrafine LSI. This is because even such a small change in the concentration of a chemical component can produce a significant difference in the metal processing accuracy upon processing of fine interconnects. In the case of forming embedded interconnects by copper plating, for example, the copper embedding properties of a plating solution for interconnects of less than 0.1 μm become unstable when the concentration accuracy of a chemical component in the plating solution is over 0.5%, leading to the formation of voids in the interconnects.

[0047] Metering means widely used for metering a liquid include a flow meter, a metering pump, a mass flowmeter, a load cell (gravimetric method), etc. With such an existing means (device), however, it is generally difficult to meet the above-described concentration accuracy requirement for a chemical compound. According to this embodiment, therefore, the liquid component replenishment sections 54 of the liquid component replenishment apparatus 52 have the below-described construction.

[0048] FIG. 4A shows an example of the liquid component replenishment section 54. The liquid component replenishment section 54 according to this example includes a level meter 60 for metering the level of a supplementary chemical component 56, for example an inhibitor, stored in a storage container 58 such as a replenisher bottle, a total amount metering device 62, for example composed of a load cell, for metering the total amount of the chemical component 56 in the storage container (replenisher bottle) 58, and a dose metering device 68, for example composed of a load cell, for metering the amount (dose) of the chemical component 56 which has been transferred from the storage container 58 into a dose metering container 66 by a pump 64 and is to be supplied to a plating solution.

[0049] By thus providing the dose metering device 68 which has an appropriate measurement range that meets an amount (dose) of a chemical component to be replenished (added), accurately metering a small amount of the chemical component (replenisher) 56 in the dose metering container 66 with the dose metering device 68 and adding (supplying) the metered amount of replenisher to the plating solution in the fresh liquid supply section 42, it becomes possible to supply (add) the chemical component 56 in such an amount that meets he concentration accuracy requirement of e.g. within 0.5%, even when the amount is very small, for example on the order of ppb to ppm.

[0050] After supplying the chemical component 56 from the dose metering container 66 to the plating solution in the fresh liquid supply section 42, the plating solution may be recycled into the dose metering container 66 for cleaning so that the chemical remaining on the inner side surface or the bottom of the dose metering container 66 or in a connecting pipe or the like can be fully supplied to the fresh liquid supply section 42. To make assurance of double sure, it is possible to further clean the dose metering container 66 with e.g. pure water so that the chemical still adhering to e.g. the inner surface of the dose metering container 66 is caused to flow into the fresh liquid supply section 42.

[0051] The total amount metering device 62 and the level meter 60 are necessary to detect the timing for a change of the storage container 58. The storage container 58 and the dose metering container 66 may not necessarily be provided one for one. Thus, a liquid may be transferred from one storage container 58 to a plurality of dose metering containers 66, or adversely, a liquid may be transferred from a plurality of storage containers 58 to one dose metering container 66.

[0052] FIG. 4B shows another example of the liquid component replenishment section 54 which employs a volumetric method to enhance the metering accuracy. A liquid can be metered with high accuracy by using a measuring cylinder or flask. There is, however, a difficulty in the automation of such a method. According to this example, a measuring flash 70 having a narrow cylinder portion 70a is used in combination with an optical sensor 72 which detects the surface the chemical component 56 in the narrow cylinder portion 70a, to make up a dose metering device for metering a dose of the chemical component 56 which has been transferred into the measuring flask 70 and is to be supplied (added) to the plating solution.

[0053] FIG. 4C shows yet another example of the liquid component replenishment section 54. According to this example, a high-accuracy volumetric pump 74 of a pulse-count type is employed as a dose metering device. Thus, the chemical component 56 stored in the storage container 58 is supplied (added) directly to the plating solution in the fresh liquid supply section 42 by the pump 74 as the dose metering device. Hicera pump manufactured by IWAKI Co., Ltd., for example, may be used as the pump (dose metering device) 74.

[0054] FIG. 5 shows an electroplating system provided with a plating solution supply and recovery facility 40c according to yet another embodiment of the present invention. The electroplating system of this embodiment includes three electroplating apparatuses 12, each being the same as shown in FIG. 1 except for not having the liquid component replenishment apparatus 26 nor the plating solution analyzer 28, arranged in parallel, and a single plating solution supply and recovery facility 40c for supplying a plating solution to the reservoir 24 of each electroplating apparatus 12 and recovering the used plating solution from the reservoir 24. The electroplating apparatus 12 may of course be provided in any desired numbers.

[0055] By providing a plurality of electroplating apparatuses 12, an increase in the production amount of e.g. a substrate can be dealt with. The increase in the number of electroplating apparatuses 12 entails an increase in the amount of the plating solution supplied to and recovered from the electroplating apparatuses 12. For example, in an electroplating system which uses a plating solution without replenishment of a component, provision of ten electroplating apparatuses 12 necessitates carrying-in and carrying-out of a plating solution in an amount of about 10 to 20 m3 per month. When using a 200 L drum, it is necessary to move at least five drums every day, for example, by using a drum carrier. This increases the cost and the workload of the workers. A cost reduction by the increase in the amount of plating solution used will therefore be offset.

[0056] The plating solution supply and recovery facility 40c of this embodiment is so constructed that mass carrying-in and mass carrying-out of a plating solution using a mass transport means, for example a tanker, is possible. In particular, according to this embodiment, the plating solution supply and recovery facility 40c includes a fresh liquid storage section 82, for example comprised of a tank, for storing a fresh plating solution (fresh liquid) which has been carried in by e.g. a tanker 80, and the above-described fresh liquid supply section 42, for example comprised of a tank, connected to the fresh liquid storage section 82 via a fresh liquid introduction line 84 therein. The fresh liquid introduction line 84 is provided with a filter 86. The fresh liquid supply section 42 and the reservoir 24 of each electroplating apparatus 12 are connected by the plating solution supply line 36. The plating solution supply and recovery facility 40c also includes the above-described waste liquid recovery section 44, for example comprised of a tank, for recovering the used plating solution (waste liquid) from the reservoir 24 of each electroplating apparatus 12 and storing the plating solution, and a waste liquid storage section 90, for example comprised of a tank, which is connected to the waste liquid recovery section 44 via a waste liquid introduction line 88, and stores the waste liquid which has been transferred from the waste liquid recovery section 44 and is to be carried to the outside. The plating solution discharge line 38 and the fresh liquid supply section 42 are connected by a plating solution recycling line 94 having a shut-off valve 92a interposed therein. A shut-off valve 92b is interposed in the plating solution discharge line 38 downstream of the junction between the plating solution discharge line 38 and the plating solution recycling line 94.

[0057] The electroplating system of this embodiment, as with the above-described system shown in FIG. 2, uses a plating solution without replenishment of a component. The electroplating system of this embodiment employs, as a fresh plating solution (fresh liquid) that is carried in the fresh liquid storage section 82 e.g. by a tanker 80, a plating solution comprising a base bath premixed with a supplementary component (s), such as an additive, thereby omitting the liquid component replenishment apparatus 26 shown in FIG. 1 and also the plating solution analyzer 28 shown in FIGS. 1 and 2. The plating solution (waste liquid) after use in plating is recovered in the waste liquid recovery section 44, and then flows into the waste liquid storage section 90, and is finally carried out in a mass e.g. by a tanker 80.

[0058] With the provision of the filter 86 in the fresh liquid introduction line 84, particles contained in the plating solution can be removed by the filter 86 upon transfer of the plating solution from the fresh liquid storage section 82 to the fresh liquid supply section 42. The removal of particles is particularly effective for the production of an LSI.

[0059] Further, the provision of the plating solution recycling line 94, through the operation of the shut-off valves 92a, 92b, enables switch between discharge of the plating solution and circulation of the plating solution between the reservoir 24 of each electroplating apparatus 12 and the fresh liquid supply section 42, i.e., switch between recycling and one-pass use of the plating solution, selectively.

[0060] The electroplating system of this embodiment can respond to an increase in the production amount of e.g. a substrate by increasing the number of electrolytic processing apparatuses 12. Further, the electroplating system can avoid the need to stop the apparatuses and enables mass carrying of a plating solution in and out of the plating solution supply and recovery facility 40c by e.g. a tanker 80. This reduces the workload of the plating solution which must be consumed in a larger amount due to the increased number of electroplating apparatuses 12.

[0061] FIG. 6 shows an electroplating system provided with a plating solution supply and recovery facility 40d according to yet another embodiment of the present invention. The plating solution supply and recovery facility 40d of this embodiment differs from the facility shown in FIG. 5 in the following respects: According to this embodiment, as with the facility shown in FIG. 3, a so-called base bath is used as a fresh plating solution (fresh liquid) which is carried in the fresh liquid storage section 82 by e.g. a tanker 80. The plating solution supply and recovery facility 40d of this embodiment is provided with the plating solution analyzer 28 for sampling and analyzing the plating solution in the fresh liquid supply section 42. Further, a chemical component, for example an additive, is supplied (added) from the liquid component replenishment apparatus 26 (or the liquid component replenishment apparatus 52 shown in FIG. 3), which is installed in the plating solution supply and recovery facility 40d, to the plating solution (fresh liquid) in the fresh liquid supply section 42, thereby preparing a plating solution having a predetermined (desired) composition.

[0062] According to this embodiment, as with the facility shown in FIG. 3, chemical components, such as a suppressor, an accelerator and an inhibitor, are supplied from the liquid component replenishment apparatus 52 (26) to the fresh liquid (base bath) in the fresh liquid supply section 42 to thereby mix the chemical components into the base bath, thereby preparing a plating solution having a predetermined (desired) composition.

[0063] FIG. 7 shows an electroplating system provided with a plating solution supply and recovery facility 40e according to yet another embodiment of the present invention. The electroplating system of this embodiment differs from the system shown in FIG. 5 in that in the former system, as in the system shown in FIG. 1, each electroplating apparatus 12 is provided with the plating solution analyzer 28 and the liquid component replenishment apparatus 26 (or the liquid component replenishment apparatus 52 shown in FIG. 3) so that the system can use plating solutions having various compositions. Using plating solutions with varied or adjusted compositions according to the specifications of e.g. substrates is necessary to satisfy the diversifying performance requirements of users. The system of this embodiment, despite the need for the plurality of plating solution analyzers, can achieve a cost reduction by the centered supply of base bath, and can also satisfy the requirement for diversification of liquid composition.

[0064] A plating solution (electrolytic solution) supply and recovery facility according to the present invention is not necessarily an integrated supply and recovery facility, but may be a combination of separate facilities.

[0065] As described hereinabove, the present invention enables a change of a carry-in container (fresh liquid drum) or a carry-out container (waste liquid drum) without a stop of an associated electrolytic processing apparatus, i.e. without a time-lag due to the stop of the apparatus. Further, the present invention, in response to an increase in the production amount of an associated electrolytic processing apparatus, can achieve an efficient supply and recovery of an electrolytic solution while enhancing the productivity and lowering the production cost.

[0066] Although certain preferred embodiments of the present invention have been shown and described in detail, it should be understood that various changes and modifications may be made therein without departing from the scope of the appended claims.

Claims

1. An electrolytic solution supply and recovery facility for supplying and recovering an electrolytic solution to and from an electrolytic processing apparatus, comprising: a fresh liquid supply section for storing a fresh electrolytic solution, said electrolytic solution having been transferred from a carry-in container that has been carried in from the outside, and for supplying the fresh electrolytic solution to the electrolytic processing apparatus; and a waste liquid recovery section for recovering the electrolytic solution from the electrolytic processing apparatus, storing the electrolytic solution and transferring the electrolytic solution to a carry-out container which is to be carried to the outside.

2. The electrolytic solution supply and recovery facility according to claim 1, further comprising: a liquid component replenishment apparatus for replenishing the electrolytic solution in the fresh liquid supply section with a predetermined chemical component.

3. An electrolytic solution supply and recovery facility for supplying and recovering an electrolytic solution to and from a plurality of electrolytic processing apparatuses, comprising: a fresh liquid storage section for storing a fresh electrolytic solution which has been carried in from the outside; a fresh liquid supply section for storing the fresh electrolytic solution which has been transferred from the fresh liquid storage section and supplying the fresh electrolytic solution to each of the plurality of electrolytic processing apparatuses; a waste liquid recovery section for recovering the electrolytic solution from each of the plurality of electrolytic processing apparatuses and storing the electrolytic solution; and a waste liquid storage section for storing the electrolytic solution which has been transferred from the waste liquid recovery section and is to be carried to the outside.

4. The electrolytic solution supply and recovery facility according to claim 3, wherein each of the plurality of electrolytic processing apparatuses is provided with an electrolytic solution analyzer for analyzing the electrolytic solution which has been supplied to the electrolytic processing apparatus, and a liquid component replenishment apparatus for replenishing the electrolytic solution with a chemical component based on the results of analysis by the electrolytic solution analyzer.

5. The electrolytic solution supply and recovery facility according to claim 3, wherein the fresh liquid storage section and the fresh liquid supply section are connected by a line provided with a filter.

6. The electrolytic solution supply and recovery facility according to claim 5, wherein each of the plurality of electrolytic processing apparatuses is provided with an electrolytic solution analyzer for analyzing the electrolytic solution which has been supplied to the electrolytic processing apparatus, and a liquid component replenishment apparatus for replenishing the electrolytic solution with a chemical component based on the results of analysis by the electrolytic solution analyzer.

7. The electrolytic solution supply and recovery facility according to claim 3, wherein the electrolytic solution circulates between the fresh liquid supply section and each of the plurality of electrolytic processing apparatuses.

8. The electrolytic solution supply and recovery facility according to claim 7, wherein each of the plurality of electrolytic processing apparatuses is provided with an electrolytic solution analyzer for analyzing the electrolytic solution which has been supplied to the electrolytic processing apparatus, and a liquid component replenishment apparatus for replenishing the electrolytic solution with a chemical component based on the results of analysis by the electrolytic solution analyzer.

9. The electrolytic solution supply and recovery facility according to claim 7, wherein the fresh liquid storage section and the fresh liquid supply section are connected by a line provided with a filter.

10. The electrolytic solution supply and recovery facility according to claim 9, wherein each of the plurality of electrolytic processing apparatuses is provided with an electrolytic solution analyzer for analyzing the electrolytic solution which has been supplied to the electrolytic processing apparatus, and a liquid component replenishment apparatus for replenishing the electrolytic solution with a chemical component based on the results of analysis by the electrolytic solution analyzer.

11. A liquid component replenishment apparatus for metering a predetermined chemical component and replenishing an electrolytic solution with the chemical component, comprising: a total amount metering device for metering the total amount of a supplementary chemical component stored in a storage container; and a dose metering device for metering a dose of the chemical component to be transferred and supplied from the storage container to the electrolytic solution.

12. The liquid component replenishment apparatus according to claim 11, wherein the metering devices employ a gravimetric method.

13. The liquid component replenishment apparatus according to claim 11, wherein the metering devices employ a volumetric method.