Controlled addition of electrolyte components

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CPC
C25D21/14

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D21/00Processes for servicing or operating cells for electrolytic coating

Current Industry

C25D21/14Controlled addition of electrolyte components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plating method and plating apparatus
- Patent number 12,221,714
- Issue date Feb 11, 2025
- Ebara Corporation
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Preparation method, product and application of composite membrane w...
- Patent number 12,209,324
- Issue date Jan 28, 2025
- CHINA JILIANG UNIVERSITY
- Guoying Wei
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition systems with enhanced crystallization pr...
- Patent number 12,195,867
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating device and electroplating system
- Patent number 12,188,143
- Issue date Jan 7, 2025
- Tyco Electronics (Suzhou) Ltd.
- Daiqiong (Diana) Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wetting method for substrate and plating apparatus
- Patent number 12,152,311
- Issue date Nov 26, 2024
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Gas-solid separation structure, feeding device and electrochemical...
- Patent number 12,121,873
- Issue date Oct 22, 2024
- BOE Technology Group Co., Ltd.
- Shaodong Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Powder supply apparatus and plating system
- Patent number 12,116,687
- Issue date Oct 15, 2024
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of electroplating a target electrode
- Patent number 12,104,270
- Issue date Oct 1, 2024
- FABRIC8LABS, INC.
- Kareemullah Shaik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for dissolving tin (II) oxide
- Patent number 12,043,914
- Issue date Jul 23, 2024
- JX Metals Corporation
- Koichi Takemoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Filling device and apparatus, electrochemical deposition system and...
- Patent number 12,024,787
- Issue date Jul 2, 2024
- BOE Technology Group Co., Ltd.
- Guocai Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for depositing a chromium or chromium alloy layer and platin...
- Patent number 12,006,585
- Issue date Jun 11, 2024
- Atotech Deutschland GmbH
- Michael Muigg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Hybrid electro-processing of a metal workpiece
- Patent number 11,965,265
- Issue date Apr 23, 2024
- The United States of America as represented by the Secretary of the Navy
- David Sapiro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and film thickness measuring method for substrate
- Patent number 11,906,299
- Issue date Feb 20, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 11,859,300
- Issue date Jan 2, 2024
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
- Patent number 11,781,233
- Issue date Oct 10, 2023
- Ebara Corporation
- Junitsu Yamakawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
- Patent number 11,767,606
- Issue date Sep 26, 2023
- Ebara Corporation
- Junitsu Yamakawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Removing bubbles from plating cells
- Patent number 11,746,435
- Issue date Sep 5, 2023
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and device for the galvanic application of a surface coating
- Patent number 11,732,373
- Issue date Aug 22, 2023
- TOPOCROM SYSTEMS AG
- Karl Müll
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating systems and methods with increased metal ion concent...
- Patent number 11,686,005
- Issue date Jun 27, 2023
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical-deposition apparatuses and associated methods of el...
- Patent number 11,680,330
- Issue date Jun 20, 2023
- FABRIC8LABS, INC.
- Kareemullah Shaik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 11,668,019
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film formation device and film formation method for metallic coating
- Patent number 11,643,745
- Issue date May 9, 2023
- Toyota Jidosha Kabushiki Kaisha
- Akira Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 11,566,339
- Issue date Jan 31, 2023
- Ebara Corporation
- Yusuke Tamari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Filling plating system and filling plating method
- Patent number 11,560,640
- Issue date Jan 24, 2023
- C. Uyemura & Co., Ltd.
- Takuya Okamachi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 11,401,623
- Issue date Aug 2, 2022
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Powder supply apparatus and plating system
- Patent number 11,359,304
- Issue date Jun 14, 2022
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for electrodepositing zinc and zinc alloy coatings from an a...
- Patent number 11,339,492
- Issue date May 24, 2022
- Dr.-Ing. Max Schlotter GmbH & Co. KG
- Volker Wohlfarth
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method and plating apparatus
- Patent number 11,286,577
- Issue date Mar 29, 2022
- Ebara Corporation
- Ryuya Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper oxide solid for use in plating of a substrate, method of pro...
- Patent number 11,230,780
- Issue date Jan 25, 2022
- Ebara Corporation
- Junitsu Yamakawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROCHEMICAL-DEPOSITION APPARATUSES UTILIZING MULTIPLE ELECTROLY...
- Publication number 20250059667
- Publication date Feb 20, 2025
- FABRIC8LABS, INC.
- Kareemullah Shaik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20250034745
- Publication date Jan 30, 2025
- EBARA CORPORATION
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POWDER SUPPLY APPARATUS AND PLATING SYSTEM
- Publication number 20250003108
- Publication date Jan 2, 2025
- EBARA CORPORATION
- Shao Hua CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF LIQUID MANAGEMENT IN ANODE CHAMBER AND APPARATUS FOR PLATING
- Publication number 20240318347
- Publication date Sep 26, 2024
- EBARA CORPORATION
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION APPARATUS AND METHOD FOR ELECTRODEPOSITION
- Publication number 20240301583
- Publication date Sep 12, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jinyang ZHAO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LOW alpha-RAY EMISSION STANNOUS OXIDE AND METHOD OF PRODUCING THE SAME
- Publication number 20240294391
- Publication date Sep 5, 2024
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka Hirano
- C01 - INORGANIC CHEMISTRY
Information Patent Application
ADDITIVE FOR COMPOSITE PLATING SOLUTIONS
- Publication number 20240279834
- Publication date Aug 22, 2024
- JCU CORPORATION
- Kana SHIBATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS D...
- Publication number 20240279839
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Steven T. MAYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR ADJUSTING THE BRIGHTNESS L* OF AN ELECTROPLATED CHROMIUM...
- Publication number 20240271308
- Publication date Aug 15, 2024
- Atotech Deutschland GmbH & Co. KG
- Berkem ÖZKAYA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Coating a Component in a Dipping Bath
- Publication number 20240183055
- Publication date Jun 6, 2024
- Bayerische Motoren Werke Aktiengesellschaft
- Elmar STEGMAYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20240141540
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Improving Copper Alloy Electroplating Filling Process
- Publication number 20240060205
- Publication date Feb 22, 2024
- Shanghai Huali Integrated Circuit Corporation
- Yu Bao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING DEVICE
- Publication number 20240003040
- Publication date Jan 4, 2024
- MITOMO SEMICON ENGINEERING CO., LTD.
- YUJI UCHIUMI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PREPARATION METHOD, PRODUCT AND APPLICATION OF COMPOSITE MEMBRANE W...
- Publication number 20230407515
- Publication date Dec 21, 2023
- China Jiliang University
- Guoying WEI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...
- Publication number 20230272546
- Publication date Aug 31, 2023
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF ELECTROPLATING A TARGET ELECTRODE
- Publication number 20230272545
- Publication date Aug 31, 2023
- FABRIC8LABS, INC.
- Kareemullah Shaik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE
- Publication number 20230265578
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chang HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURGING FLOW FOR BUBBLE CLEARING IN ELECTROPLATING SYSTEMS
- Publication number 20230235474
- Publication date Jul 27, 2023
- Applied Materials, Inc.
- Joel L. Cannone
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WETTING METHOD FOR SUBSTRATE AND PLATING APPARATUS
- Publication number 20230167572
- Publication date Jun 1, 2023
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...
- Publication number 20230167575
- Publication date Jun 1, 2023
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND FILM THICKNESS MEASURING METHOD FOR SUBSTRATE
- Publication number 20230152077
- Publication date May 18, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELING COMPOUND CONTROL
- Publication number 20230144437
- Publication date May 11, 2023
- LAM RESEARCH CORPORATION
- Matthew A. Rigsby
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL-DEPOSITION APPARATUSES AND ASSOCIATED METHODS OF EL...
- Publication number 20230029051
- Publication date Jan 26, 2023
- FABRIC8LABS, INC.
- Kareemullah Shaik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE
- Publication number 20230002926
- Publication date Jan 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chang HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20220333267
- Publication date Oct 20, 2022
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR SUPPRESSING INCREASE IN ZINC CONCENTRATION OF PLATING SO...
- Publication number 20220298668
- Publication date Sep 22, 2022
- YUKEN INDUSTRY CO., LTD.
- Toshihiro SUGIURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANODIZATION APPARATUS AND ANODIZATION METHOD
- Publication number 20220251722
- Publication date Aug 11, 2022
- KIOXIA Corporation
- Mie MATSUO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR DISSOLVING TIN (II) OXIDE
- Publication number 20220243349
- Publication date Aug 4, 2022
- JX NIPPON MINING & METALS CORPORATION
- Koichi Takemoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTACT DEVICE AND METHOD FOR PRODUCING THE CONTACT DEVICE
- Publication number 20220243355
- Publication date Aug 4, 2022
- Tyco Electronics (Shanghai) Co., Ltd.
- Daiqiong (Diana) Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POWDER SUPPLY APPARATUS AND PLATING SYSTEM
- Publication number 20220243356
- Publication date Aug 4, 2022
- EBARA CORPORATION
- Shao Hua CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Controlled addition of electrolyte components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plating method and plating apparatus

Preparation method, product and application of composite membrane w...

Electrochemical deposition systems with enhanced crystallization pr...

Electroplating device and electroplating system

Method of controlling chemical concentration in electrolyte

Wetting method for substrate and plating apparatus

Gas-solid separation structure, feeding device and electrochemical...

Powder supply apparatus and plating system

Methods of electroplating a target electrode

Method for dissolving tin (II) oxide

Filling device and apparatus, electrochemical deposition system and...

Method for depositing a chromium or chromium alloy layer and platin...

Hybrid electro-processing of a metal workpiece

Plating apparatus and film thickness measuring method for substrate

Controlling plating electrolyte concentration on an electrochemical...

Copper oxide solid for use in plating of a substrate, method of pro...

Copper oxide solid for use in plating of a substrate, method of pro...

Removing bubbles from plating cells

Method and device for the galvanic application of a surface coating

Electroplating systems and methods with increased metal ion concent...

Electrochemical-deposition apparatuses and associated methods of el...

Method of controlling chemical concentration in electrolyte

Film formation device and film formation method for metallic coating

Plating method and plating apparatus

Filling plating system and filling plating method

Controlling plating electrolyte concentration on an electrochemical...

Powder supply apparatus and plating system

Method for electrodepositing zinc and zinc alloy coatings from an a...

Plating method and plating apparatus

Copper oxide solid for use in plating of a substrate, method of pro...

Patents Applicationslast 30 patents

ELECTROCHEMICAL-DEPOSITION APPARATUSES UTILIZING MULTIPLE ELECTROLY...

PLATING APPARATUS AND PLATING METHOD

POWDER SUPPLY APPARATUS AND PLATING SYSTEM

METHOD OF LIQUID MANAGEMENT IN ANODE CHAMBER AND APPARATUS FOR PLATING

ELECTRODEPOSITION APPARATUS AND METHOD FOR ELECTRODEPOSITION

LOW alpha-RAY EMISSION STANNOUS OXIDE AND METHOD OF PRODUCING THE SAME

ADDITIVE FOR COMPOSITE PLATING SOLUTIONS

MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS D...

METHOD FOR ADJUSTING THE BRIGHTNESS L* OF AN ELECTROPLATED CHROMIUM...

Method for Coating a Component in a Dipping Bath

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

Method for Improving Copper Alloy Electroplating Filling Process

PLATING DEVICE

PREPARATION METHOD, PRODUCT AND APPLICATION OF COMPOSITE MEMBRANE W...

ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...

METHODS OF ELECTROPLATING A TARGET ELECTRODE

METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE

SURGING FLOW FOR BUBBLE CLEARING IN ELECTROPLATING SYSTEMS

WETTING METHOD FOR SUBSTRATE AND PLATING APPARATUS

ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...

PLATING APPARATUS AND FILM THICKNESS MEASURING METHOD FOR SUBSTRATE

LEVELING COMPOUND CONTROL

ELECTROCHEMICAL-DEPOSITION APPARATUSES AND ASSOCIATED METHODS OF EL...

METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

METHOD FOR SUPPRESSING INCREASE IN ZINC CONCENTRATION OF PLATING SO...

ANODIZATION APPARATUS AND ANODIZATION METHOD

METHOD FOR DISSOLVING TIN (II) OXIDE

CONTACT DEVICE AND METHOD FOR PRODUCING THE CONTACT DEVICE

POWDER SUPPLY APPARATUS AND PLATING SYSTEM