The present invention relates generally to shielding enclosures for reducing the electromagnetic interference associated with electronic circuits housed in the enclosures. In particular, the present invention relates to a shielding arrangement for assembling components within such shielding enclosures.
It is well known that the operation of electronic circuits is associated with the emission of electromagnetic interference (EMI) in the form of electromagnetic waves. Such EMI may adversely affect the operation of other electronic circuits. To avoid such problems, circuits that are sensitive to EMI or that generate large amount of EMI are usually housed in enclosures with electro-conductive walls. The walls are connected to ground so that any EMI intercepted by the walls, regardless of whether it is coming from within or from outside the enclosure, is sent to ground.
One problem with such arrangements is sealing (in terms of EMI) the joined edges between the walls. Gaps along these joined edges allow external EMI to penetrate (and internally generated EMI to escape the respective enclosure), thus reducing the efficiency of the EMI shield provided by the walls.
Known solutions include the use of conductive EMI gaskets inserted in the joints. The inclusion of such gaskets, however, adds an extra level of complexity and cost. In addition, many gaskets may have an abrasive effect on the conductive surface of the walls to which they are applied.
Other solutions involve the formation of shielding flanges suitably arranged on the periphery of the engaging walls. The reported arrangements, however, appear to have only moderate shielding effect and/or are difficult to manufacture.
According to one aspect of the present invention, there is provided an electromagnetic interference shielding arrangement comprising a first and a second electro-conductive components that are arranged to be joined. The first electro-conductive component includes a first electro-conductive contact surface. The second electro-conductive component includes a second electro-conductive contact surface and a shielding member extending from the second electro-conductive component at a location adjacent the second electro-conductive surface. The arrangement is such that, in the joined configuration of the first and the second electro-conductive components the first and the second electro-conductive surfaces abut to create an electro-conductive engagement region that is adjacent the shielding member.
Preferably, in the joined configuration, the shielding member is disposed adjacently an entrance edge of the engagement region to shield the entrance edge of the engagement region from outgoing electromagnetic waves.
The shielding member may be spaced apart from a boundary edge of the second electro-conductive component.
The shielding member may comprise a shielding flange.
The first electro-conductive component may comprise a peripheral flange located at the periphery of the first electro-conductive component and comprising the first electro-conductive contact surface.
The shielding member, the peripheral flange, and the first and second contact surfaces may be planar.
The first electro-conductive component may comprise a first planar wall to which the peripheral flange projects perpendicularly and the second electro-conductive component may comprise a second planar wall to which the shielding flange may project perpendicularly.
The boundary edge of the second electro-conductive component may be aligned with the first planar wall of the first component.
The second electro-conductive component may comprise a bend forming a hem, the arrangement being such that a lip of the hem defines the second contact surface and the shielding flange extends from the lip. The bend may define the boundary edge of the second electro-conductive component.
The shielding flange may comprise a first extension portion extending towards the first planar wall of the first electro-conductive component.
The shielding flange may comprise a second extension portion extending from the first extension portion in a direction parallel to the first planar wall of the first electro-conductive component.
The second extension portion may comprise an electro-conductive formation arranged for electro-conductive engagement with an electro-conductive surface of the first planar wall of the first electro-conductive component. The electro-conductive formation may comprise a plurality of dimple fingers or a continuous conductive surface arranged to engage a respective continuous surface of the first component to form a continuous engagement region. The electro-conductive formation may comprise a slot.
Each one of the first electro-conductive component and the second electro-conductive component may comprise one of the following group; a chassis, a wall and a cover.
The arrangement may further comprise fastening means for fastening together the first and the second components, when in the joined configuration.
According to a second aspect of the present invention, there is provided an electromagnetic interference shielding enclosure comprising a plurality of components joined together to form the enclosure, wherein at least two of the components are joined together according to the arrangement of any one of the preceding claims.
According to a third aspect of the present invention, there is provided a method for forming at least a portion of a shielding enclosure, comprising;
providing a first electro-conductive component including a first electro-conductive contact surface;
providing a second electro-conductive component including a second electro-conductive contact surface and a shielding member extending from the second electro-conductive component at a location adjacent the second electro-conductive surface, and
configuring the first electro-conductive component and the second electro-conductive component so that, when the first electro-conductive component and the second electro-conductive component are joined to form at least a portion of the enclosure, the first and the second electro-conductive surfaces abut to create an electro-conductive engagement region that is adjacent the shielding member.
Preferably, the method also includes configuring the first electro-conductive component and the second electro-conductive component so that, in the joined configuration, the shielding member is disposed adjacently an entrance edge of the engagement region to shield the entrance edge of the engagement region from outgoing electromagnetic waves.
Some aspects of at least one embodiment of the present invention will now be described with reference to the drawings, in which:
Where reference is made in any one or more of the accompanying drawings to features which have the same reference numerals, those features have for the purposes of this description the same function(s) or operation(s), unless the contrary intention appears.
The electromagnetic interference (EMI) shielding arrangement described hereinafter forms a part of an EMI shielding enclosure. However, for the sake of a clear and succinct description of its main features, the EMI shielding arrangement has been described with reference to cut-away representations which do not show the entire enclosure.
Six configurations of the EMI shielding arrangement are described in the following text. Each of these six configurations is described with reference to a respective one of the six sets of enclosed
Most of the following description is based on the somewhat more detailed A-figures. The cut-away nature of all the figures and the perspective views of the B-figures are helpful in visualising the shielding arrangement within the context of an electromagnetic shielding enclosure, of which the described shielding arrangement is a part.
The first component 2 comprises a wall 14 and a peripheral flange 5 located at the periphery of the wall 14. The peripheral flange 5 includes a first contact surface 6.
The second component 3 comprises a wall 15 and a shielding member, in the form of a shielding flange 7. The reference to the flange 7 as a shielding flange is related to a shielding function performed by the flange 7, which will be explained later in the text. A boundary edge 8 is defined by the furthermost line of extension of the wall 15 in the direction of the wall 14. The shielding flange 7 and, in particular, the base 70 of the shielding flange 7, is spaced apart from the boundary edge 8. A second contact surface 9 is formed on the second component 3. The second contact surface 9 is adjacent the boundary edge 8 and extends towards the shielding flange 7 of the second component 3. Both the first contact surface 6 and the second contact surface 9 are electro-conductive.
The peripheral flange 5 and the shielding flange 7 are configured so that, when the first component 2 and the second component 3 are joined together in their joined configuration, the first electro-conductive contact surface 6 engages, by way of abutting, the second electro-conductive contact surface 9 to form the electro-conductive engagement region 4 therebetween.
The peripheral flange 5 is formed by way of a bend 16 formed in the wall 14. The angle of the bend 16 is such that the flange 5 is substantially or generally perpendicular to the wall 14. Similarly, the shielding flange 7 is manufactured to also be perpendicular to the wall 15. Such orthogonal arrangements are particularly suitable when the walls 14 and 15 are substantially or generally perpendicular to each other, as shown in
As each of the first component 2 or the second component 3 is a portion of a housing wall of an enclosure, the entire first and second components are made of electro-conductive materials and are arranged to be connected to ground. It is the electro-conductive nature of the walls 14 and 15, the shielding flange 7 and the engagement region 4 that allows the shielding arrangement 1 to reduce the propagation of outgoing or incoming electromagnetic waves.
To further improve the shielding effect of the shielding arrangement 1, the components 2 and 3 are so arranged that, in the joined configuration, the shielding flange 7 is disposed adjacently the entrance edge 17 of the engagement region 4. Because of that, the shielding flange 7 shields the entrance edge 17 of the engagement region 4 from outgoing electromagnetic waves 10, as shown in
Here it should be noted that the entrance area of the engagement region 4 is notionally referred to as the “entrance edge”, in order for the reference to correspond to the single line representation 17 in
As shown in
In the joined configuration of the component 2 and the component 3, the boundary edge 8 of the second component 3 is substantially or generally aligned with the planar surface of the wall 14 of the first component 2. Here it should be noted that the reference to the boundary edge 8 is based on the fact that the edge 8 is the furthermost line of extension of the wall 15 that defines the wall's boundary with respect to its width (or length).
As noted in the above text, the described EMI shielding arrangement 1 of
As is the case with
The first electro-conductive surface 6 is again defined by the periphery flange 5. However, the second electro-conductive contact surface is now defined by the electro-conductive surface 23 of the lip 21. Thus, it is the electro-conductive surface 23 that is engaged in an electro-conductive contact with the first conductive surface 6 of the peripheral flange 5, when the first component 2 and the second component 3 are in an joined configuration.
A further configuration of the described shielding arrangement 1 is shown in the cut-away cross-sectional view of
The inclusion of extension portions 24 and 25 formed by way of the 90°-bends 26 and 27 further limits the amount of electromagnetic waves 11 reaching the shielded area 12, in general, and the entrance edge 17, in particular. The sequence of arrows 29 indicates a sample tortuous path that an outgoing electromagnetic wave needs to undergo in order to access the engagement region 4. A number of arrows 29 are drawn in dotted line. The dotted arrows indicate the contribution to the tortuous path brought about by the inclusion of extension portions 24 and 25 in the structure of the second component 3.
The bends 26 and 27 comprise angles of 90°. As a result, the extension portion 24 extends substantially or generally perpendicularly to both the main body of the shielding flange 7 and the wall 14 of the first component 2, while extension portion 25 is substantially or generally parallel to the wall 14. Even though it is possible to use other angles, it should be noted that the particular angles of the bends 26, 27 and 28 and the lengths of the shielding flange 7 and extension portions 24 and 25, affect the efficiency of the shielding provided to the shielded area 12 and the available space for the rivet 13.
Whilst extension portions 24 and 25 are included in the configuration shown in
Every element shown in the hereinbefore described configurations is made of electro-conductive materials. While some of the surfaces of the walls 14 and 15 of the components 2 and 3 may be painted by a non-conductive paint, this is not the case with the surfaces 6 and 9, 32, 34 and 35. The conductivity of these surfaces is important for providing a good contact across the respective engagement regions in order to maintain the shielding efficiency of the discussed shielding arrangement.
It has to be noted that the configurations of the electromagnetic shielding arrangement shown in
The foregoing text describes only some embodiments of the present invention, and modifications and/or changes can be made thereto without departing from the scope and spirit of the invention, the embodiments being illustrative and not restrictive.
For example, the above description has been presented in terms of an EMI shielding arrangement between two components forming a part of an EMI shielding enclosure for housing one or more electronic elements. Accordingly, such an enclosure comprising at least two components joined together according to the above-described arrangement is also within the scope of the above description.
In addition, whilst the shielding arrangement has been described with respect to its affect on outgoing EMI originating from the respective enclosure, similar consideration are applicable to any incoming EMI. Such incoming EMI can enter the shielding enclosure through a gap in the engagement region 4 and by following a path opposite to the path marked by arrows 29.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/SG2010/000160 | 4/20/2010 | WO | 00 | 2/27/2012 |
Publishing Document | Publishing Date | Country | Kind |
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WO2011/133108 | 10/27/2011 | WO | A |
Number | Name | Date | Kind |
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5008487 | Shimmyo | Apr 1991 | A |
5170321 | Oslund et al. | Dec 1992 | A |
5557063 | Mottahed | Sep 1996 | A |
5981871 | Trumble et al. | Nov 1999 | A |
6424521 | Vega et al. | Jul 2002 | B1 |
6639145 | Nurmi | Oct 2003 | B1 |
6646892 | Hsu | Nov 2003 | B1 |
6714423 | Nurmi | Mar 2004 | B1 |
7202422 | Ogatsu | Apr 2007 | B2 |
20070284142 | Jonker | Dec 2007 | A1 |
Number | Date | Country |
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WO 0101742 | Jan 2001 | WO |
Entry |
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International Search Report and Written Opinion dated Jul. 20, 2010 in PCT/SG2010/000160. |
Number | Date | Country | |
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20130025928 A1 | Jan 2013 | US |