1. Field of the Invention
The invention relates to an electromagnetic shielding device.
2. Description of the Related Art
However, in order to attach fully the solder pad 103 to the component-mounting surface 101, a looped peripheral region 104 of the component-mounting surface 101 is preferably maintained between the solder pad 103 and a periphery of the circuit board 1 such that a distance (w1) is formed between a looped outer surface of the surrounding wall 202 of the metal cover 2 and the periphery of the circuit board 1. As a result, the circuit board 1 has a relatively large size, thereby impeding miniaturization of the electronic device.
Therefore, the object of the present invention is to provide an electromagnetic shielding device that can overcome the aforesaid drawbacks of the prior art.
According to one aspect of the present invention, there is provided an electromagnetic shielding device that comprises:
a base board having a top surface adapted to be mounted with an electronic component thereon, a bottom surface opposite to the top surface and having an area larger than that of the top surface, and a looped surrounding surface interconnecting peripheries of the top and bottom surfaces, the looped surrounding surface having an inclined upper surface portion extending outwardly and downwardly from the periphery of the top surface;
a looped solder pad attached to the inclined upper surface portion of the looped surrounding surface of the base board; and
a metal cover mounted on the base board, and having a top wall, and a looped surrounding wall extending downwardly from a periphery of the top wall, the looped surrounding wall having a bottom end connected electrically and fixedly to the looped solder pad such that the metal cover cooperates with the base board so as to define an inner receiving space therebetween for receiving the electronic component.
According to another aspect of the present invention, there is provided an electromagnetic shielding device that comprises:
a base board having a top surface adapted to be mounted with an electronic component thereon, a bottom surface opposite to the top surface and having an area larger than that of the top surface, and a looped surrounding surface interconnecting peripheries of the top and bottom surfaces, the looped surrounding surface having a vertical upper surface portion extending downwardly from the periphery of the top surface, a vertical lower surface portion extending upwardly from the periphery of the bottom surface, and a horizontal intermediate surface portion interconnecting a lower end of the vertical upper surface portion and an upper end of the vertical lower surface portion;
a looped solder pad attached to the vertical upper surface portion and the horizontal intermediate surface portion of the looped surrounding surface of the base board; and
a metal cover mounted on the base board, and having a top wall, and a looped surrounding wall extending downwardly from a periphery of the top wall and connected electrically and fixedly to the looped solder pad such that the metal cover cooperates with the base board so as to define an inner receiving space therebetween for receiving the electronic component.
Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings, of which:
a to 3c are perspective views illustrating how the electronic device is fabricated;
Before the present invention is described in greater detail, it should be noted that like elements are denoted by the same reference numerals throughout the disclosure.
Referring to
The base board 10, such as a rectangular circuit board, has a top surface 111 adapted to be mounted with a plurality of electronic components 13 of the electronic device thereon, a bottom surface 112 opposite to the top surface 111 and having an area larger than that of the top surface 111, and a looped surrounding surface 113 interconnecting peripheries of the top and bottom surfaces 111, 112. In this embodiment, the looped surrounding surface 113 has an inclined upper surface portion 114 extending outwardly and downwardly from the periphery of the top surface 111, and an upright lower surface portion 115 having an upper end connected to a lower end of the inclined upper surface portion 114.
The looped solder pad 12 is attached to the inclined upper surface portion 114 of the looped surrounding surface 113 of the base board 10 by plating techniques.
The metal cover 20 is mounted on the base board 10 using surface mounting techniques, and has a top wall 21, and a looped surrounding wall 22 extending downwardly from a periphery of the top wall 21. The looped surrounding wall 22 has a bottom end 221 connected electrically and fixedly to the looped solder pad 12 such that the metal cover 20 cooperates with the base board 10 so as to define an inner receiving space therebetween for receiving the electronic components 13.
a, 3b, 3c and 4 illustrate how the electronic device employing the electromagnetic shielding device of the first preferred embodiment is fabricated. Firstly, a rectangular substrate 100 is provided, wherein the substrate 100 has a top surface 110 formed with four open-ended slots 1100 having a V-shaped cross-section. The slots 1100 are respectively adjacent to and parallel to four sides of the substrate 100. Each slot 1100 is defined by first and second flat surfaces 1101, 1102 opposite to each other, as shown in
In such a configuration, the solder pad 12 is attached to the inclined upper surface portion 114 of the looped surrounding surface 113 of the base board 10 without requiring the looped peripheral region 104 present in the aforesaid conventional electromagnetic shielding device of
In addition, the looped solder pad 12′ has a vertical pad portion 121 attached to the vertical upper surface portion 116 of the looped surrounding surface 119 of the base board 10′, and a horizontal pad portion 122 connected to a lower end of the vertical pad portion 121 and attached to the horizontal intermediate surface portion 118 of the looped surrounding surface 119 of the base board 10′. As a result, the bottom end 221 of the looped surrounding wall 22 of the metal cover 20 is in electrical contact with the horizontal pad portion 122 of the looped solder pad 12′. The looped surrounding wall 22 of the metal cover 20 further has a looped inner surface 222 in electrical contact with the vertical pad portion 121 of the looped solder pad 12′.
In such a configuration, the solder pad 12′ is attached to the vertical upper surface portion 116 and the horizontal intermediate surface portion 118 of the looped surrounding surface 119 of the base board 10′ without requiring the looped peripheral region 104 present in the aforesaid conventional electromagnetic shielding device of
While the present invention has been described in connection with what are considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.