BACKGROUND
1. Technical Field
The present disclosure relates to electromagnetic shielding enclosure, and particularly, to an electromagnetic shielding enclosure having a plurality of contact protrusions and a related electronic apparatus.
2. Description of Related Art
It is thought that exposure to acute electromagnetic radiation may have undesirable effects on human health. For purpose of decreasing people's exposure to electromagnetic radiation, electronic apparatus, such as cell phones, computers, and digital cameras, generally employ electromagnetic shielding enclosures for enclosing electronic components packaged on a printed circuit board (PCB). The electromagnetic shielding enclosure is usually mounted on the PCB and electrically connected with grounding regions of the PCB. However, grounding regions of PCBs may not smooth enough to form a good seal with the electromagnetic shielding enclosure. As a result, the electromagnetic shielding enclosure cannot be properly grounded, which decreases electromagnetic shield efficacy. Therefore, an electromagnetic shielding enclosure and a related electronic apparatus are desired for overcoming the shortcomings as aforementioned.
BRIEF DESCRIPTION OF THE DRAWINGS
Many aspects of the present enclosure and the electronic apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the presentment enclosure and the apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the views.
FIG. 1 is an isometric, cutaway view of an electronic apparatus in accordance with an exemplary embodiment, the electronic apparatus includes an electronic module having a PCB and an electromagnetic shielding enclosure.
FIG. 2 is an isometric, exploded view of the electronic module of FIG. 1.
FIG. 3 is an isometric, assembled view of the electronic module.
FIG. 4 is an isometric view of a circled portion IV of the electronic module of FIG. 1.
DETAILED DESCRIPTION
Referring to FIGS. 1 and 2, an exemplary electronic apparatus 100 includes a housing 10, a PCB 20 and an electromagnetic shielding enclosure 30 both accommodated in the housing 10. The PCB 20 is rectangular, and includes a mounting region 204 having a plurality of electronic components 201 mounted thereon, and a grounding region 203. Additionally, the PCB 20 defines a plurality of blind screw holes 205 along a longitudinal edge thereof. Each of the grounding regions 203 is arranged between neighboring screw holes 205. The electromagnetic shielding enclosure 30 is mounted on the PCB 20 and encloses the electronic components 201. The electronic apparatus 100 can be a cell phone, an electronic game device, a portal computer, a digital camera and so on.
Referring to FIG. 2, the electromagnetic shielding enclosure 30 includes a main body 31 consisted of top panel 301, a side panel 302 perpendicularly extending from edges of the top panel 301. In addition, the electromagnetic shielding enclosure 30 includes a plurality of fixing fins 303 and a plurality of resilient fins 304. The fixing fins 303 and resilient fins 304 are arranged in an alternate fashion and perpendicularly extend out from a longitudinal edge 3011 of the side panel 302. The fixing fins 303 and the resilient fins 304 are spaced from but coplanar with each other and parallel to the top panel 301. The two extreme and the intermediate fixing fins 303 each defines a through hole 306 aligned with a corresponding screw hole 205. Protrusions 305 are respectively formed on distal end of the resilient fins 304, and configured to mechanically and electrically contact the electrically conductive region 203.
Referring to FIGS. 2-4, the electromagnetic shielding enclosure 30 is mounted on the PCB 20 with a plurality of screws 40 extending through the through hole 306 and screwed in the screwed holes 205. Once in place, the screws 40 apply a pressure onto the two extreme and intermediate fixing fins 303. Therefore, the resilient fins 304 slightly deform, such that the protrusions 305 directly contact with the electrically conductive regions 203. Hence, the electronic shielding enclosure 30 is properly grounded.
The above-described embodiments are intended to illustrate rather than limit the disclosure. Variations may be made to the embodiments and methods without departing from the spirit of the disclosure. Accordingly, it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the disclosure.
Patent Application
20110255262
