The present application claims priority under 35 U.S.C. ยง119 to Japanese Patent Application No. 2010-065078, filed Mar. 19, 2010 and Japanese Patent Application No. 2010-097334, filed Apr. 20, 2010. The contents of these applications are incorporated herein by reference in their entirety.
1. Field of the Invention
The present invention relates to an electronic apparatus.
2. Discussion of the Background
Electronic apparatuses, such as inverter devices, include a housing that serves as a base or a case, a printed circuit board that is fixed to the housing, and a terminal block that is mounted on the printed circuit board (see, for example, Japanese Unexamined Patent Application Publication No. 6-169578 disclosed on Jun. 14, 1994). To be specific, the terminal block is mounted on the printed circuit board by flow soldering, and the printed circuit board, on which the terminal block has been mounted, is fixed to the housing.
According to an aspect of the present invention, an electronic apparatus includes a housing; a terminal block fixed to the housing at both ends thereof in a width direction; and a printed circuit board extending in a depth direction of the terminal block, one end of the printed circuit board in the depth direction being fixed to the housing, and the other end of the printed circuit board in the depth direction being fixed to the terminal block at a position below the terminal block.
A more complete appreciation of the invention and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:
Embodiments will now be described with reference to the accompanying drawings, wherein like reference numerals designate corresponding or identical elements throughout the various drawings, and redundant description will be omitted.
Referring to
As illustrated in
The printed circuit board 3 is attached to the terminal block 4 by mounting the terminal block 4 onto the printed circuit board 3. First, leads 5 for soldering that extend from the terminal block 4 are connected to the printed circuit board 3 by soldering. Then, one end of the printed circuit board 3 (an end at which the terminal block is not mounted) is placed on the circuit board mounting bases 2a of the housing 2, and fixed with fixing screws 6. The other end of the printed circuit board 3 (an end at which the terminal block is mounted) is not directly fixed to the housing 2. Instead, the other end is connected and fixed to the terminal block 4, and the terminal block 4 is fixed to the housing 2.
The length of the terminal block 4 in the width direction is larger than the length of the printed circuit board 3 in the width direction. Parts of the terminal block 4 that extend beyond the edges of the printed circuit board 3 in the width direction are used to fix the terminal block 4 to the housing 2. That is, the parts serve as fastening bases 4a that contact the terminal block mounting bases 2b. As illustrated in
Thus, the terminal block 4 is supported not by the printed circuit board 3 but by the housing 2, and the terminal block 4 supports the other end of the printed circuit board 3. Therefore, an excessive stress is not applied to the printed circuit board 3 when a thick electric wire is connected to a terminal screw 8 of the terminal block 4. Therefore, even if the terminal block 4 has a large current-carrying capacity and has a large size, the terminal block 4 can be mounted on the printed circuit board 3 by soldering. Moreover, the strength with which the terminal block 4 is fixed is not dependent on soldering. Therefore, even if the terminal block 4 has a large current-carrying capacity and has a large size, the terminal block 4 can be mounted on the printed circuit board 3 at the same time as other electric components by flow soldering. Furthermore, the other end of the printed circuit board 3 (the end at which the terminal block is mounted) is not directly fixed to the housing 2. Therefore, when fixing the terminal block 4, which has been mounted on the printed circuit board 3, to the housing 2, the printed circuit board 3 does not become warped due to displacement caused by an assembly operation. Accordingly, stress does not concentrate on a soldered portion of the leads 5 for soldering, and a solder crack does not occur.
With existing technologies, the terminal block 4 is mounted on the printed circuit board 3, and thereby the terminal block 4 is electrically connected to the printed circuit board 3 and the terminal block 4 is fixed to the printed circuit board 3. In contrast, with the present invention, the terminal block 4 is connected to the printed circuit board 3 so that the terminal block 4 is electrically connected to the printed circuit board 3 and so that the printed circuit board 3 is fixed to the terminal block 4 without being influenced by how the terminal block 4 is fixed.
As illustrated in
Heretofore, the electronic apparatus 1 according to the first embodiment of the present invention has been described. Next, referring to
Thus, the terminal block is supported not by the printed circuit board but by the housing, and the terminal block supports the other end of the printed circuit board. Therefore, even if a thick electric wire is connected to the terminal block, an excessive stress is not applied to the printed circuit board. Accordingly, a terminal block having a large current-carrying capacity and a large size can be mounted on the printed circuit board by soldering.
Obviously, numerous modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims, the invention may be practiced otherwise than as specifically described herein.
Number | Date | Country | Kind |
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2010-065078 | Mar 2010 | JP | national |
2010-097334 | Apr 2010 | JP | national |
Number | Name | Date | Kind |
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4047242 | Jakob et al. | Sep 1977 | A |
4231629 | Kirby | Nov 1980 | A |
5497289 | Sugishima et al. | Mar 1996 | A |
6341063 | Kinoshita et al. | Jan 2002 | B2 |
6769932 | Daoud | Aug 2004 | B1 |
7369413 | Caines et al. | May 2008 | B2 |
7445468 | Chen et al. | Nov 2008 | B2 |
7452213 | Herdendorf et al. | Nov 2008 | B2 |
7458823 | Sugimoto et al. | Dec 2008 | B2 |
Number | Date | Country |
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06-169578 | Jun 1994 | JP |
Number | Date | Country | |
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20110230062 A1 | Sep 2011 | US |