Patent Application
20110222228
The present invention relates generally to the field of smart cards. Smart cards or integrated circuit cards are pocket-sized cards (e.g., credit cards, gift cards, identification cards, etc.) that includes an embedded integrated circuit. Such cards may be used for a wide range of applications, including identification, data storage, and authentication.
One embodiment of the invention relates to an electronic card containing a clear display window. The electronic card includes a printed circuit board, having a top surface and a bottom surface and a plurality of circuit components including a display disposed on the top surface of the printed circuit board. The electronic card further includes a bottom overlay disposed on the bottom surface of the printed circuit board, a top overlay disposed above the top surface of the printed circuit board, and a core layer positioned between the top surface of the bottom overlay and the bottom surface of the top overlay. The top overlay comprises a display window aligned with the display.
Another embodiment relates to a method for manufacturing an overlay for an electronic card. The method includes providing an opaque web material, rotary die cutting a predetermined window configuration in the web material, and laminating a clear material to the web material.
Still another embodiment relates to a method for manufacturing an embedded electronic device. The method includes providing a printed circuit board having a top surface and a bottom surface, the bottom surface includes a plurality of standoffs. The method further includes affixing a plurality of circuit components onto the top surface of the printed circuit board and affixing the bottom surface of the printed circuit board to a bottom overlay using a pressure sensitive adhesive tape or a spray-on adhesive. The method further includes loading the printed circuit board and bottom overlay into an injection molding apparatus and loading a top overlay positioned above a top surface of the printed circuit board into the injection molding apparatus. The method further includes injecting thermosetting polymeric material between the top surface of the printed circuit board, the plurality of circuit components and the top overlay; and injecting thermosetting polymeric material between the bottom surface of the printed circuit board and the bottom overlay.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only, and are not restrictive of the invention as claimed.
These and other features, aspects and advantages of the present invention will become apparent from the following description, appended claims, and the accompanying exemplary embodiments shown in the drawings, which are briefly described below.
Referring to
The opaque web material 42 is fed into the mechanism 10 from a first input or feed roll 12. The opaque web material 42 is fed into a rotary die 14 where a cuts an opening 44 of a predetermined size and shape (see
After being cut, a laminate adhesive 46 (see
A clear or transparent overlay material 48 is fed into the mechanism 10 from a second input or feed roll 18. The clear overlay material 48 is coupled to the opaque web material 42 with the adhesive 46. The stacked layers may pass through one or more devices such as paired rollers 20 to further adhere the clear overlay material 48 to the opaque web material 42 and form a laminated overlay 40.
The laminated overlay 40 can then be sheet cut with a cutting device 22 into discreet segments or sheets 24. The sheets 24 may then be stacked and stored or transported for later processing. With reference to
The printed circuit board 50 has a top surface 52 and a bottom surface 54. According to an exemplary embodiment, the printed circuit 50 is formed of a flame retardant laminate with woven glass reinforced epoxy resin (FR-4). However, the printed circuit 50 may be any other suitable dielectric material. One or more circuit components 56 are disposed on the top surface 52 of the printed circuit board 50. According to an exemplary embodiment, the circuit component is a display. In other embodiments, a wide variety of circuit components 56 may be disposed on the top surface 52 including, but not limited to a push button, a battery, a microprocessor chip, or a speaker. Circuit components 56 may also be disposed on the bottom surface 54. The bottom surface 54 of the printed circuit board 50 may further include standoffs 58 or other non-circuit components (e.g., supports, spacers, etc.).
The top surface 52 of the printed circuit board 50 further includes a plurality of circuit traces configured to operably connect to the circuit components 56. The bottom surface 54 may also include a plurality of circuit traces on the bottom surface configured to operably connect the circuit components 56 on the bottom surface 54 of the printed circuit board 50. The circuit traces may be formed with conductive ink. The circuit traces may be etched onto the printed circuit board 50. According to one exemplary embodiment, a plurality of embedded electronic devices 56 are formed on one printed circuit board 50. According to other exemplary embodiments, the card 30 may include multiple printed circuit boards 50.
A top overlay 40 and a bottom overlay 60 are coupled to the top surface 52 and the bottom surface 54 of the printed circuit board 50, respectively. The top overlay 40 and the bottom overlay 60 may be formed, at least partially, from a thermoplastic material such as polyvinyl chloride (PVC). According to an exemplary embodiment, the top overlay 40 includes an opaque web material 42 that is coupled to a clear overlay layer 48 with an adhesive 46. The adhesive layer 46 may be applied across the entire surface of the transparent overlay material 48, as shown in
A core layer 62 is positioned between the top surface of the bottom overlay 60 and the bottom surface of the top overlay 40 (e.g., around the printed circuit board 50). The core layer 62 is approximately the same thickness as the printed circuit board 50 such that the finished card 30 has a generally constant thickness. According to an exemplary embodiment, the core layer 62 is comprised of thermosetting polyurea that is injected around the printed circuit board 50 into the space between the top overlay 40 and the bottom overlay 60.
Referring now to
Referring now to
This application claims priority from U.S. Provisional Application Ser. No. 61/282,677, filed Mar. 15, 2010.
| Number | Date | Country | |
|---|---|---|---|
| 61282677 | Mar 2010 | US |
