ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

Abstract

Embodiments of this application disclose an electronic component and an electronic device, to achieve a three-dimensional stacked structure, reduce an area, and improve heat dissipation. In embodiments of this application, the electronic component includes an upper cover plate, a lower cover plate, and an enclosure frame. The upper cover plate carries a first circuit. The lower cover plate carries a second circuit. The enclosure frame is separately connected to the upper cover plate and the lower cover plate. An interconnection circuit is disposed in the enclosure frame, and the interconnection circuit is configured to implement interconnection between the first circuit and the second circuit. The first circuit and the second circuit overlap in a vertical direction without interfering with each other.

Description

Claims

1. An electronic component, comprising: a first circuit, a second circuit, and an interconnection circuit, andan upper cover plate, a lower cover plate opposing the upper cover plate in a vertical direction, and an enclosure frame, wherein the upper cover plate carries the first circuit, the lower cover plate carries the second circuit, and the enclosure frame is separately connected to the upper cover plate and the lower cover plate;the interconnection circuit is disposed in the enclosure frame, the interconnection circuit is configured to implement interconnection between the first circuit and the second circuit, and the first circuit and the second circuit overlap in the vertical direction without interfering with each other; anda height of the enclosure frame is higher than a sum of a height of the first circuit and a height of the second circuit.

2. The electronic component according to claim 1, further comprising: an integrated passive circuit which is disposed in the enclosure frame, and is configured to transmit at least one of a direct current bias signal, a switch control signal, or a radio frequency signal between the first circuit and the second circuit.

3. The electronic component according to claim 2, wherein the integrated passive circuit comprises at least one of a power splitter or a coupling circuit.

4. The electronic component according to claim 1, wherein the enclosure framecomprises a printed circuit board (PCB) or a plastic article.

5. The electronic component according to claim 1, wherein the enclosure frame comprises a metalized structure configured to shield a signal.

6. The electronic component according to claim 5, wherein the metalized structure comprises an electroplated structure.

7. The electronic component according to claim 1, wherein the first circuit comprises an auxiliary circuit device, and the auxiliary circuit device comprises at least one of a control circuit or a bias circuit.

8. The electronic component according to claim 1, wherein the upper cover plate is a transceiver (TRX) board.

9. The electronic component according to claim 1,further comprising: a transceiver (TRX) board on which the upper cover plate is disposed.

10. The electronic component according to claim 9, further comprising: a land grid array (LGA);wherein the upper cover plate is a radio frequency board, and the upper cover plate is connected to the TRX board through the LGA.

11. The electronic component according to claim 1, wherein the second circuit comprises an electronic component matching circuit, a core radio frequency matching circuit, and an active chip.

12. The electronic component according to claim 1, wherein the second circuit is a discrete device or an unpackaged active chip.

13. The electronic component according to claim 1,further comprising: a radiator on which the lower cover plate is disposed.

14. The electronic component according to claim 13, further comprising: a sintered block disposed between the lower cover plate and the radiator.

15. An electronic device, comprising an electronic component, the electronic component comprising: a first circuit, a second circuit, and an interconnection circuit; andan upper cover plate, a lower cover plate opposing the upper cover plate in a vertical direction, and an enclosure frame, wherein the upper cover plate carries the first circuit, the lower cover plate carries the second circuit, and the enclosure frame is separately connected to the upper cover plate and the lower cover plate;the interconnection circuit is disposed in the enclosure frame, the interconnection circuit is configured to implement interconnection between the first circuit and the second circuit, and the first circuit and the second circuit overlap in the vertical direction without interfering with each other; anda height of the enclosure frame is higher than a sum of a height of the first circuit and a height of the second circuit.

16. The electronic device according to claim 15, wherein the electronic device is a power amplifier.

17. The electronic component according to claim 1, further comprising: an integrated passive circuit disposed on the upper cover plate.

18. The electronic component according to claim 17, wherein the enclosure frame comprises a plastic article.

19. The electronic component according to claim 17, wherein the integrated passive circuit comprises at least one of a power splitter or a coupling circuit.

20. The electronic component according to claim 1, wherein the second circuit on the lower cover plate comprises active circuits, and the electronic component includes no passive circuits on the lower cover plate.