External configuration of printed circuit board adapted for heat dissipation

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CPC
H05K1/0209

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0209External configuration of printed circuit board adapted for heat dissipation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate module and power module for transformer
- Patent number 12,289,835
- Issue date Apr 29, 2025
- LG Innotek Co., Ltd
- Soo San Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with housed power semiconductors for controllable elec...
- Patent number 12,284,749
- Issue date Apr 22, 2025
- ZF Friedrichshafen AG
- Thomas Maier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly comprising a circuit carrier and a heat sink
- Patent number 12,279,361
- Issue date Apr 15, 2025
- HELLA GMBH & CO. KGAA
- Christopher Peron
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 12,273,995
- Issue date Apr 8, 2025
- AMOSENSE CO., LTD.
- Taejung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power arrangement and cooling system for electronic devices
- Patent number 12,245,360
- Issue date Mar 4, 2025
- NVIDIA Corporation
- David Mohr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 12,245,377
- Issue date Mar 4, 2025
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,224,226
- Issue date Feb 11, 2025
- Innolux Corporation
- Chin-Lung Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processor cartridge
- Patent number 12,218,447
- Issue date Feb 4, 2025
- AMULET HOTKEY LTD
- Sean Andrew Copeland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pin-fin cooling for printed circuit boards (PCBs)
- Patent number 12,213,240
- Issue date Jan 28, 2025
- Hamilton Sundstrand Corporation
- Yongduk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Managing unwanted heat, mechanical stresses and EMI in electrical c...
- Patent number 12,207,430
- Issue date Jan 21, 2025
- Samtec, Inc.
- Burrell G. Best
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid-cooled power electronics unit
- Patent number 12,200,916
- Issue date Jan 14, 2025
- Dr. Ing. h.c.F. Porsche Aktiengesellschaft
- Maximilian Barkow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated readout card
- Patent number 12,193,339
- Issue date Jan 7, 2025
- Google LLC
- Theodore Charles White
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,193,145
- Issue date Jan 7, 2025
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display module and display apparatus
- Patent number 12,185,465
- Issue date Dec 31, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Guangran Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating resin circuit substrate
- Patent number 12,177,962
- Issue date Dec 24, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-dissipating circuit board, heat-dissipating member, and produc...
- Patent number 12,177,972
- Issue date Dec 24, 2024
- NOF Corporation
- Toshinobu Fujimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing apparatus
- Patent number 12,145,382
- Issue date Nov 19, 2024
- Seiko Epson Corporation
- Dai Nozawa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electronic device including shielding member and heat radiating str...
- Patent number 12,150,238
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Wansang Ryu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Composite phase change material, application method of composite ph...
- Patent number 12,134,727
- Issue date Nov 5, 2024
- DONGGUAN NVT TECHNOLOGY LIMITED
- Hao Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic equipment
- Patent number 12,127,332
- Issue date Oct 22, 2024
- Sony Interactive Entertainment Inc.
- Yuta Tamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,114,417
- Issue date Oct 8, 2024
- Sumitomo Bakelite Co., Ltd.
- Nobuo Tagashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using thermocouple to dissipate generated heat and me...
- Patent number 12,101,871
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Huan-Yu He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip heat dissipation structure, chip structure, circuit board and...
- Patent number 12,100,639
- Issue date Sep 24, 2024
- BITMAIN TECHNOLOGIES INC.
- Dan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of bimetals in a heat sink to benefit heat transfer from high t...
- Patent number 12,074,081
- Issue date Aug 27, 2024
- Cisco Technology, Inc.
- Madeline Marie Roemer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Covering film, and circuit board and manufacturing method
- Patent number 12,048,084
- Issue date Jul 23, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics cooling assemblies and methods for making the same
- Patent number 12,048,085
- Issue date Jul 23, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and cooling device with fan blade and related method
- Patent number 12,031,553
- Issue date Jul 9, 2024
- L3HARRIS TECHNOLOGIES, INC.
- Charles Weirick
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Display device having a display panel including a member for induci...
- Patent number 12,032,404
- Issue date Jul 9, 2024
- Samsung Display Co., Ltd.
- So Young Yeo
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250140645
- Publication date May 1, 2025
- InnoLux Corporation
- Chin-Lung TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE ELEMENT ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20250133650
- Publication date Apr 24, 2025
- GETAC TECHNOLOGY CORPORATION
- HUNG-CHAN CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULES WITH ENCAPSULANT-EMBEDDED LEADFRAME TERMINALS, AND...
- Publication number 20250126716
- Publication date Apr 17, 2025
- NXP USA, Inc.
- Boon Yew Low
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANAGING UNWANTED HEAT, MECHANICAL STRESSES AND EMI IN ELECTRICAL C...
- Publication number 20250107029
- Publication date Mar 27, 2025
- SAMTEC, INC.
- Burrell G. BEST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE TRANSFORMER AND STACK-UP STRUCTURE OF PRINTED CIRCUIT B...
- Publication number 20250089153
- Publication date Mar 13, 2025
- Delta Electronics, Inc.
- Jui-Chien HUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20250081328
- Publication date Mar 6, 2025
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES
- Publication number 20250071883
- Publication date Feb 27, 2025
- Elbit Systems Ltd.
- Reut BEN ZAKEN (BITTON)
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct Contact Fluid Based Cooling Module
- Publication number 20250056759
- Publication date Feb 13, 2025
- Jetcool Technologies Inc.
- Jordan Mizerak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES
- Publication number 20250044536
- Publication date Feb 6, 2025
- Arista Networks, Inc.
- Andreas Bechtolsheim
- G02 - OPTICS
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250048552
- Publication date Feb 6, 2025
- Canon Kabushiki Kaisha
- SHUICHI NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20250024631
- Publication date Jan 16, 2025
- Nintendo Co., Ltd.
- Takafumi NISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER TOOLS WITH HIGH-EMISSIVITY HEAT SINKS
- Publication number 20240416497
- Publication date Dec 19, 2024
- Milwaukee Electric Tool Corporation
- Steven LCB Hartig
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS
- Publication number 20240414837
- Publication date Dec 12, 2024
- Bitmain Technologies Inc.
- Shitao TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
- Publication number 20240414841
- Publication date Dec 12, 2024
- MITSUBISHI MATERIALS CORPORATION
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240397606
- Publication date Nov 28, 2024
- Omron Corporation
- Junya MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-EMBEDDED CIRCUIT BOARD
- Publication number 20240397605
- Publication date Nov 28, 2024
- The Boeing Company
- Kyle Avery Woolrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FILM CIRCUIT BOARD
- Publication number 20240389224
- Publication date Nov 21, 2024
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...
- Publication number 20240373543
- Publication date Nov 7, 2024
- GUANGZHOU ON-BRIGHT ELECTRONICS CO., LTD.
- XIAOKUI CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES
- Publication number 20240314921
- Publication date Sep 19, 2024
- Intel Corporation
- Jeff Ku
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...
- Publication number 20240268022
- Publication date Aug 8, 2024
- NOF Corporation
- Toshinobu FUJIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...
- Publication number 20240260169
- Publication date Aug 1, 2024
- Eagle Technology, LLC
- JASON THOMPSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS
- Publication number 20240237319
- Publication date Jul 11, 2024
- Software Defined Technologies, Inc.
- Michael M. Salour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240237189
- Publication date Jul 11, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...
- Publication number 20240237222
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYEONJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR AND METHOD FOR MANUFACTURING SAME
- Publication number 20240215148
- Publication date Jun 27, 2024
- I-PEX Inc.
- Yoichi HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240215202
- Publication date Jun 27, 2024
- TMY Technology Inc.
- Pei-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING OF ULTRASOUND ENERGIZERS MOUNTED ON PRINTED CIRCUIT BOARDS
- Publication number 20240196514
- Publication date Jun 13, 2024
- Sofwave Medical Ltd.
- Ariel SVERDLIK
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
THERMALLY DISSIPATIVE ELECTROMAGNETIC INTERFERENCE SHIELD OR COVER...
- Publication number 20240196578
- Publication date Jun 13, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Sean P. Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR PHASED ARRAY ANTENNA TRANSCEIVER ASSEMBLY...
- Publication number 20240179852
- Publication date May 30, 2024
- SHENNAN CIRCUITS CO.,LTD.
- Li CHEN
- G01 - MEASURING TESTING

External configuration of printed circuit board adapted for heat dissipation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate module and power module for transformer

Power module with housed power semiconductors for controllable elec...

Assembly comprising a circuit carrier and a heat sink

Power module

Power arrangement and cooling system for electronic devices

Component carrier with embedded semiconductor component and embedde...

Electronic device

Data processor cartridge

Pin-fin cooling for printed circuit boards (PCBs)

Managing unwanted heat, mechanical stresses and EMI in electrical c...

Liquid-cooled power electronics unit

Integrated readout card

Substrate for mounting electronic element, electronic device, and e...

Display module and display apparatus

Insulating resin circuit substrate

Heat-dissipating circuit board, heat-dissipating member, and produc...

High speed network device with orthogonal pluggable optics modules

Printing apparatus

Electronic device including shielding member and heat radiating str...

Composite phase change material, application method of composite ph...

Electronic equipment

Circuit board

Circuit board using thermocouple to dissipate generated heat and me...

Chip heat dissipation structure, chip structure, circuit board and...

Manufacturing method of insulated metal substrate

Use of bimetals in a heat sink to benefit heat transfer from high t...

Covering film, and circuit board and manufacturing method

Power electronics cooling assemblies and methods for making the same

Electronic device and cooling device with fan blade and related method

Display device having a display panel including a member for induci...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

STORAGE ELEMENT ASSEMBLY AND ELECTRONIC DEVICE

CIRCUIT MODULES WITH ENCAPSULANT-EMBEDDED LEADFRAME TERMINALS, AND...

MANAGING UNWANTED HEAT, MECHANICAL STRESSES AND EMI IN ELECTRICAL C...

SOLID STATE TRANSFORMER AND STACK-UP STRUCTURE OF PRINTED CIRCUIT B...

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES

Direct Contact Fluid Based Cooling Module

HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

ELECTRONIC APPARATUS

POWER TOOLS WITH HIGH-EMISSIVITY HEAT SINKS

COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS

COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

MULTI-EMBEDDED CIRCUIT BOARD

THIN FILM CIRCUIT BOARD

PRINTED CIRCUIT BOARD ASSEMBLIES WITH ALUMINUM PCB SUBSTRATES IN HO...

THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES

Printed Circuit Board And Method For Soldering A Chip Housing In A...

HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUC...

ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...

BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...

CONNECTOR AND METHOD FOR MANUFACTURING SAME

PACKAGE STRUCTURE

COOLING OF ULTRASOUND ENERGIZERS MOUNTED ON PRINTED CIRCUIT BOARDS

THERMALLY DISSIPATIVE ELECTROMAGNETIC INTERFERENCE SHIELD OR COVER...

PRINTED CIRCUIT BOARD FOR PHASED ARRAY ANTENNA TRANSCEIVER ASSEMBLY...