Claims
- 1. Chip inductance comprising a solid core part having a perpendicular prismatic spatial shape; the core part having a hollow-cylindrical recess therein shaped for receiving a winding, said recess surrounding a pad being contiguous in one piece with the core part and canals connecting the lateral surfaces of the core part with the recess; the canals being open in direcion facing away from the core part; electrical contact surfaces being supported by said lateral surfaces; and at least one winding wound onto the pad; the ends of the winding being guided through the canals to the electric contact surfaces and connected therewith.
- 2. Electronic component according to claim 1, wherein said core part is a cube.
- 3. Electronic component according to claim 1, wherein said core part is a slab.
- 4. Electronic component according to claim 1, wherein said core part is formed of ferromagnetic material.
- 5. Electronic component according to claim 1, wherein said core part is formed of electrically non-conductive material.
- 6. Electronic component according to claim 1, wherein said core part is formed of a material from the group consisting of ferrite, ceramic and plastic.
- 7. Electronic component according to claim 1, wherein said lateral surfaces of said core part on which said contact layers are disposed have open-ended canals formed therein communicating with said recess.
- 8. Electronic component acording to claim 7, wherein said contact layers completely cover mutually opposite lateral surfaces of said core part.
- 9. Electronic component according to claim 8, wherein said lateral surfaces have edges, and said contact layers extend beyond said edges toward adjacent lateral surfaces.
- 10. Electronic component according to claim 7, wherein said contact layers extend at least partially into said canals.
- 11. Electronic component according to claim 1, including a solderable layer covering said contact layers.
- 12. Electronic component according to claim 1, wherein given corners of said core part are bevelled for indicating proper alignment.
- 13. Electronic component according to claim 1, wherein said core part has a pad integral therewith, and said recess has a hollow cylindrical shape enclosing said pad.
- 14. Electronic component according to claim 13, wherein said recess is formed in said lateral surfaces defining a corner of said core part, said pad has an end surface set back from said corner, and including a circular disc-shaped cover covering said end surface and closing off said recess.
- 15. Electronic component according to claim 14, wherein said cover is level with said lateral surfaces.
- 16. Electronic component according to claim 13, wherein said recess is formed in said lateral surfaces defining an edge of said lateral surfaces, said edge has an offset surface formed therein set back from said edge, said pad has an end surface set back from said edge, and including a cover covering said offset surface and said end surface.
- 17. Electronic component according to claim 14, wherein said cover is formed of a material selected from the group consisting of ferrite, ceramic and plastic.
- 18. Electronic component according to claim 16, wherein said cover is formed of a material selected from the group consisting of ferrite, ceramic and plastic.
- 19. Electronic component according to claim 7, wherein said core part has a pad integral therewith, said recess has a hollow cylindrical shape enclosing said pad, and including at least one winding disposed on said pad and having ends extended through said canals and being in contact with said contact layers.
- 20. Electronic component according to claim 19, including casting compound surrounding at least part of said winding.
- 21. Electronic component according to claim 20, wherein said casting compound includes a material selected from the group consisting of carbonyl iron and ferrite powder.
- 22. Chip inductance according to claim 1, wherein said pad consists of ferromagnetic material.
- 23. Chip inductance according to claim 1, wherein said core part and pad consist of electrically non-conductive material.
- 24. Chip inductance according to claim 1, wherein the electrical contact surfaces extend partially into the canals.
- 25. Chip inductance according to claim 1, wherein the electrical contact surfaces are covered with a solderable layer.
- 26. Chip inductance according to claim 1, wherein at least the winding is cast into a casting compound.
- 27. Chip inductance according to claim 26, wherein the casting compound includes carbonyl-iron.
- 28. Chip inductance according to claim 26, wherein the casting compound includes ferrite powder.
- 29. Chip inductance according to claim 26 wherein the winding ends are cast into a casting compound.
- 30. Chip inductance according to claim 26 wherein said casting compound includes epoxy resin.
- 31. Chip inductance according to claim 29 wherein said casting compound includes epoxy resin.
- 32. Chip inductance according to claim 30 wherein said casting compound includes carbonyl iron.
- 33. Chip inductance according to claim 31 wherein said casting compound includes carbonyl iron.
- 34. Chip inductance according to claim 29 wherein said casting compound includes ferrite powder.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3410811 |
Mar 1984 |
DEX |
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Parent Case Info
This application is a continuation of application Ser. No. 711,606, now abandoned, filed Mar. 14, 1985.
US Referenced Citations (9)
Foreign Referenced Citations (5)
Number |
Date |
Country |
2452252 |
May 1976 |
DEX |
114716 |
Sep 1979 |
JPX |
70507 |
Apr 1983 |
JPX |
694559 |
Jul 1953 |
GBX |
2102632 |
Feb 1983 |
GBX |
Continuations (1)
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Number |
Date |
Country |
Parent |
711606 |
Mar 1985 |
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