Electronic component package

Abstract

In an electronic component package in which an electronic component mounted through an external electrode disposed on a mounting board is covered with a molding resin, the electronic component has a structure in which IDT electrodes disposed on the lower surface of a component substrate made of a piezoelectric material are covered with a component cover, and an intermediate elastic layer having an elastic modulus smaller than that of the component substrate and greater than that of the molding resin is provided between the component substrate and the molding resin.

Description

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a sectional view of an electronic component package in a first exemplary embodiment.

FIG. 2 is an enlarged partially sectional view of the electronic component package in the first exemplary embodiment.

FIG. 3 is a bottom view of a component substrate in the first exemplary embodiment.

FIG. 4A is a manufacturing process diagram of a SAW duplexer in the first exemplary embodiment.

FIG. 4B is a manufacturing process diagram of a SAW duplexer in the first exemplary embodiment.

FIG. 4C is a manufacturing process diagram of a SAW duplexer in the first exemplary embodiment.

FIG. 4D is a manufacturing process diagram of a SAW duplexer in the first exemplary embodiment.

FIG. 4E is a manufacturing process diagram of a SAW duplexer in the first exemplary embodiment.

FIG. 4F is a manufacturing process diagram of a SAW duplexer in the first exemplary embodiment.

FIG. 5A is a manufacturing process diagram of a SAW duplexer in the first exemplary embodiment.

FIG. 5B is a manufacturing process diagram of a SAW duplexer in the first exemplary embodiment.

FIG. 6 is a sectional view of a SAW duplexer in the first exemplary embodiment.

FIG. 7 is a bottom view of a component cover in the first exemplary embodiment.

FIG. 8 is a schematic diagram showing transmission and attenuation of bulk waves that propagate inside an electronic component.

FIG. 9 is a bottom view of a component cover in a second exemplary embodiment.

FIG. 10 is a bottom view of a component cover in a third exemplary embodiment.

FIG. 11 is a sectional view of an electronic component package in another exemplary embodiment.

FIG. 12 is a sectional view of an electronic component package in still another exemplary embodiment.

FIG. 13 is a sectional view of a conventional electronic component package.

Claims

1. An electronic component package comprising: a mounting board;an external electrode disposed on said mounting board;an electronic component mounted on said mounting board through said external electrode, said electronic component including: a component substrate formed of a piezoelectric material;an IDT electrode disposed on a lower surface of said component substrate; anda component cover covering a lower part of said component substrate; andmolding resin covering said electronic component on said mounting board,wherein, an intermediate elastic layer having an elastic modulus smaller than that of said component substrate and greater than that of said molding resin is provided between said component substrate and said molding resin.

2. The electronic component package of claim 1, wherein a work-affected layer is formed by plastically deforming a side of said component substrate by cutting, and said work-affected layer is used as the intermediate elastic layer.

3. The electronic component package of claim 1, wherein a protection layer having an elastic modulus smaller than that of said component substrate and greater than that of said molding resin is disposed as said intermediate elastic layer between said component substrate and said molding resin.