the enclosure being defined by a foil covering the non-active sides of the SAW device

Industry

CPC
H03H9/1078

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Parent Industries

HELECTRICITY H03Electronic circuits H03HIMPEDANCE NETWORKS H03H9/00Networks comprising electromechanical or electro-acoustic devices Electromechanical resonators

Current Industry

H03H9/1078the enclosure being defined by a foil covering the non-active sides of the SAW device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of mounting structure, and laminate sheet ther...
- Patent number 11,799,442
- Issue date Oct 24, 2023
- Nagase Chemtex Corporation
- Takayuki Hashimoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device and electronic component
- Patent number 11,764,753
- Issue date Sep 19, 2023
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Component with a thin-layer covering and method for its production
- Patent number 11,296,673
- Issue date Apr 5, 2022
- Snaptrack, Inc.
- Thomas Metzger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Elastic wave device
- Patent number 10,862,450
- Issue date Dec 8, 2020
- Murata Manufacturing Co., Ltd.
- Masaharu Fujiya
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device and method of manufacturing the same
- Patent number 10,164,602
- Issue date Dec 25, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device
- Patent number 9,935,610
- Issue date Apr 3, 2018
- WISOL CO., LTD.
- Hunyong Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component and manufacturing method therefor
- Patent number 9,654,081
- Issue date May 16, 2017
- Murata Manufacturing Co., Ltd.
- Motoji Tsuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device and fabrication method of the same
- Patent number 9,484,883
- Issue date Nov 1, 2016
- Taiyo Yuden Co., Ltd.
- Toshio Nishizawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device
- Patent number 9,407,235
- Issue date Aug 2, 2016
- Taiyo Yuden Co., Ltd.
- Takashi Yamashita
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Module and production method
- Patent number 9,253,886
- Issue date Feb 2, 2016
- EPCOS AG
- Kim Choong Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device
- Patent number 9,165,849
- Issue date Oct 20, 2015
- Kyocera Corporation
- Hidefumi Hatanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface acoustic wave (SAW) device package and method for fabricati...
- Patent number 9,166,553
- Issue date Oct 20, 2015
- Mnemonics, Inc.
- Fred Johnson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing boundary acoustic wave device
- Patent number 8,677,604
- Issue date Mar 25, 2014
- Murata Manufacturing Co., Ltd.
- Hajime Kando
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing a boundary acoustic wave device
- Patent number 8,381,386
- Issue date Feb 26, 2013
- Murata Manufacturing Co., Ltd.
- Hajime Kando
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Acoustic wave device
- Patent number 8,120,230
- Issue date Feb 21, 2012
- Murata Manufacturing Co., Ltd.
- Tsutomu Takai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device and method of fabricating the same
- Patent number 8,093,101
- Issue date Jan 10, 2012
- Taiyo Yuden Co., Ltd.
- Kaoru Sakinada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Acoustic wave device and method for fabricating the same
- Patent number 8,076,827
- Issue date Dec 13, 2011
- Taiyo Yuden Co., Ltd.
- Yasuyuki Saitou
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stack type surface acoustic wave package, and method for manufactur...
- Patent number 7,820,468
- Issue date Oct 26, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hee Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device and method of fabricating the same
- Patent number 7,816,794
- Issue date Oct 19, 2010
- Fujitsu Media Devices Limited
- Kaoru Sakinada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device having gap between surface acoustic wa...
- Patent number 7,781,936
- Issue date Aug 24, 2010
- Panasonic Corporation
- Kazunori Nishimura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device, package for the device, and method of...
- Patent number 7,528,522
- Issue date May 5, 2009
- Fujitsu Media Devices Limited
- Shingo Masuko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for encapsulating an electrical component, and surface acous...
- Patent number 7,518,201
- Issue date Apr 14, 2009
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boundary acoustic wave device
- Patent number 7,486,001
- Issue date Feb 3, 2009
- Murata Manufacturing Co., Ltd.
- Hajime Kando
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Surface acoustic wave device
- Patent number 7,474,175
- Issue date Jan 6, 2009
- Panasonic Corporation
- Tetsuya Furihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for integrated circuit module packaging and integrated circ...
- Patent number 7,445,968
- Issue date Nov 4, 2008
- SiGe Semiconductor (U.S.), Corp.
- Jose Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave device and method for manufacturing the same
- Patent number 7,436,273
- Issue date Oct 14, 2008
- Epson Toyocom Corporation
- Yasuhide Onozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave filter and method of producing the same
- Patent number 7,397,327
- Issue date Jul 8, 2008
- Murata Manufacturing Co., Ltd.
- Yuichi Takamine
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Encapsulated electronic component and production method
- Patent number 7,388,281
- Issue date Jun 17, 2008
- EPCOS AG
- Hans Krueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package
- Patent number 7,382,081
- Issue date Jun 3, 2008
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stack type surface acoustic wave package, and method for manufactur...
- Patent number 7,336,017
- Issue date Feb 26, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF MOUNTING STRUCTURE, AND LAMINATE SHEET THER...
- Publication number 20200287518
- Publication date Sep 10, 2020
- Nagase Chemtex Corporation
- Takayuki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN OPTICAL CHIP AND METHOD OF FABRICATION
- Publication number 20200096720
- Publication date Mar 26, 2020
- STMicroelectronics (Grenoble 2) SAS
- Nicolas MASTROMAURO
- G02 - OPTICS
Information Patent Application
COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION
- Publication number 20190229703
- Publication date Jul 25, 2019
- SnapTrack, Inc.
- Thomas METZGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELASTIC WAVE DEVICE
- Publication number 20190140615
- Publication date May 9, 2019
- Murata Manufacturing Co., Ltd.
- Masaharu FUJIYA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELASTIC WAVE DEVICE AND ELECTRONIC COMPONENT
- Publication number 20190081610
- Publication date Mar 14, 2019
- Murata Manufacturing Co., Ltd.
- Takashi IWAMOTO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE
- Publication number 20140368299
- Publication date Dec 18, 2014
- Taiyo Yuden Co., Ltd.
- Takashi YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Acoustic Wave (SAW) Device Package and Method for Fabricati...
- Publication number 20140103465
- Publication date Apr 17, 2014
- Mnemonics, Inc.
- Fred Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130250527
- Publication date Sep 26, 2013
- KYOCERA CORPORATION
- Hidefumi Hatanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC WAVE DEVICE AND FABRICATION METHOD OF THE SAME
- Publication number 20130187730
- Publication date Jul 25, 2013
- Taiyo Yuden Co., Ltd.
- Toshio NISHIZAWA
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
MODULE AND PRODUCTION METHOD
- Publication number 20130176686
- Publication date Jul 11, 2013
- EPCOS AG
- Kim Choong Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING BOUNDARY ACOUSTIC WAVE DEVICE
- Publication number 20130133179
- Publication date May 30, 2013
- Murata Manufacturing Co., Ltd.
- Hajime KANDO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ACOUSTIC WAVE DEVICE
- Publication number 20120181898
- Publication date Jul 19, 2012
- Taiyo Yuden Co., Ltd.
- Kazushige HATAKEYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE
- Publication number 20100219717
- Publication date Sep 2, 2010
- Murata Manufacturing Co., Ltd.
- Tsutomu TAKAI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100066209
- Publication date Mar 18, 2010
- FUJITSU MEDIA DEVICES LIMITED
- Yasuyuki SAITOU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACK TYPE SURFACE ACOUSTIC WAVE PACKAGE, AND METHOD FOR MANUFACTUR...
- Publication number 20100047949
- Publication date Feb 25, 2010
- SAMSUNG ELECTRO-MECHANICS CO.,LTD.
- Seung Hee Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BOUNDARY ACOUSTIC WAVE DEVICE
- Publication number 20090102318
- Publication date Apr 23, 2009
- Murata Manufacturing Co., Ltd.
- Hajime KANDO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE
- Publication number 20090096319
- Publication date Apr 16, 2009
- Kazunori Nishimura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Surface Acoustic Wave Device
- Publication number 20080272858
- Publication date Nov 6, 2008
- Tetsuya Furihata
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Electronic device and method of fabricating the same
- Publication number 20080111247
- Publication date May 15, 2008
- FUJITSU MEDIA DEVICES LIMITED
- Kaoru Sakinada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device, method for producing the same, and communication...
- Publication number 20070200146
- Publication date Aug 30, 2007
- Keiji Onishi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Electronic component package
- Publication number 20070200462
- Publication date Aug 30, 2007
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACK TYPE SURFACE ACOUSTIC WAVE PACKAGE, AND METHOD FOR MANUFACTUR...
- Publication number 20070145541
- Publication date Jun 28, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hee LEE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Methods for integrated circuit module packaging and integrated circ...
- Publication number 20070138614
- Publication date Jun 21, 2007
- SiGe Semiconductor (U.S.), Corp.
- Jose Harrison
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Piezoelectric device
- Publication number 20070018539
- Publication date Jan 25, 2007
- Ryota Nagashima
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Electronic part having high sealing performance and method of manuf...
- Publication number 20060290238
- Publication date Dec 28, 2006
- Alps Electric Co., Ltd.
- Kyosuke Ozaki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Manufacturing method capable of simultaneously sealing a plurality...
- Publication number 20060286718
- Publication date Dec 21, 2006
- Alps Electric Co., Ltd.
- Kyosuke Ozaki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Stack type surface acoustic wave package, and method for manufactur...
- Publication number 20060249824
- Publication date Nov 9, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hee Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for encapsulating an electrical component, and surface acous...
- Publication number 20060249802
- Publication date Nov 9, 2006
- EPCOS AG
- Alois Stelzl
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Surface acoustic wave filter and manufacturing method thereof
- Publication number 20060202780
- Publication date Sep 14, 2006
- Yuichi Takamine
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Radio frequency module and fabrication method thereof
- Publication number 20060194370
- Publication date Aug 31, 2006
- Samsung Electro-Mechanics CO., LTD.
- Young Jin Lee
- H03 - BASIC ELECTRONIC CIRCUITRY

the enclosure being defined by a foil covering the non-active sides of the SAW device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of mounting structure, and laminate sheet ther...

Elastic wave device and electronic component

Component with a thin-layer covering and method for its production

Elastic wave device

Acoustic wave device and method of manufacturing the same

Acoustic wave device

Electronic component and manufacturing method therefor

Acoustic wave device and fabrication method of the same

Acoustic wave device

Module and production method

Electronic device

Surface acoustic wave (SAW) device package and method for fabricati...

Method of manufacturing boundary acoustic wave device

Method of manufacturing a boundary acoustic wave device

Acoustic wave device

Electronic device and method of fabricating the same

Acoustic wave device and method for fabricating the same

Stack type surface acoustic wave package, and method for manufactur...

Electronic device and method of fabricating the same

Surface acoustic wave device having gap between surface acoustic wa...

Surface acoustic wave device, package for the device, and method of...

Method for encapsulating an electrical component, and surface acous...

Boundary acoustic wave device

Surface acoustic wave device

Methods for integrated circuit module packaging and integrated circ...

Surface acoustic wave device and method for manufacturing the same

Surface acoustic wave filter and method of producing the same

Encapsulated electronic component and production method

Electronic component package

Stack type surface acoustic wave package, and method for manufactur...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF MOUNTING STRUCTURE, AND LAMINATE SHEET THER...

ELECTRONIC DEVICE COMPRISING AN OPTICAL CHIP AND METHOD OF FABRICATION

COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION

ELASTIC WAVE DEVICE

ELASTIC WAVE DEVICE AND ELECTRONIC COMPONENT

ACOUSTIC WAVE DEVICE

Surface Acoustic Wave (SAW) Device Package and Method for Fabricati...

ELECTRONIC DEVICE

ACOUSTIC WAVE DEVICE AND FABRICATION METHOD OF THE SAME

MODULE AND PRODUCTION METHOD

METHOD OF MANUFACTURING BOUNDARY ACOUSTIC WAVE DEVICE

ACOUSTIC WAVE DEVICE

ACOUSTIC WAVE DEVICE

ACOUSTIC WAVE DEVICE AND METHOD FOR FABRICATING THE SAME

STACK TYPE SURFACE ACOUSTIC WAVE PACKAGE, AND METHOD FOR MANUFACTUR...

BOUNDARY ACOUSTIC WAVE DEVICE

SURFACE ACOUSTIC WAVE DEVICE

Surface Acoustic Wave Device

Electronic device and method of fabricating the same

Electronic device, method for producing the same, and communication...

Electronic component package

STACK TYPE SURFACE ACOUSTIC WAVE PACKAGE, AND METHOD FOR MANUFACTUR...

Methods for integrated circuit module packaging and integrated circ...

Piezoelectric device

Electronic part having high sealing performance and method of manuf...

Manufacturing method capable of simultaneously sealing a plurality...

Stack type surface acoustic wave package, and method for manufactur...

Method for encapsulating an electrical component, and surface acous...

Surface acoustic wave filter and manufacturing method thereof

Radio frequency module and fabrication method thereof