The present invention aims to provide an electronic component capable of reducing the occurrence of cracks at the joining portion with a board etc. A capacitor 1 (laminated ceramic capacitor) being one example of the electronic component of the present invention is provided with an element assembly 10 (ceramic) and a pair of external electrodes 20 formed on both side surfaces of the element assembly. In the element assembly 10, a dielectric layer 12 and an internal electrode 14 are laminated alternately. The external electrode 14 has such constitution that a first electrode layer connected with the internal electrode 14, a second electrode layer (electroconductive resin layer) including a hardened product of epoxy resin containing an epoxy compound having a molecular weight of 2000 or more and plural epoxy groups as the base compound, a third electrode layer composed of Ni and a fourth electrode layer composed of Sn are formed in this order from the element assembly side.
Description
BRIEF DESCRIPTION OF THE DRAWING
FIG. 1 is a drawing that schematically illustrates a cross-sectional constitution of the laminated ceramic capacitor according to a suitable embodiment.
Claims
1. An electronic component comprising:
a ceramic element assembly;an internal electrode provided inside the ceramic element assembly; andan external electrode provided on the surface of the ceramic element assembly and electrically connected with the internal electrode, wherein:the external electrode has an electroconductive resin layer including a hardened product of epoxy resin containing an epoxy compound having a molecular weight of 2000 or more and plural epoxy groups as a base compound.
2. The electronic component according to claim 1, wherein the epoxy resin further includes phenol resin as a hardening agent.
3. The electronic component according to claim 1, wherein the epoxy compound is a linear bifunctional epoxy compound having an epoxy group at the both ends thereof.