Patent Application
20240321544
This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2023-045871, filed on Mar. 22, 2023; the entire contents of which are incorporated herein by reference.
Embodiments described herein relate to an electronic device and a method for manufacturing the same.
There is an electronic device including a substrate that has a through hole, and an electrode provided in the through hole. In such an electronic device, high reliability is desired.
According to one embodiment, an electronic device includes a substrate, an electrode, and a facing portion. The substrate has a through hole. The electrode is provided in the through hole in the substrate and extends along an axial direction of the through hole. The facing portion is provided on the substrate, is disposed at a position closer to a center of the through hole in a width direction than is the electrode, and faces, in the width direction, a portion of the electrode on one end side in the axial direction.
According to another embodiment, a method is disclosed for manufacturing an electronic device. The method can include forming a first groove on a first surface side of a substrate including a first surface and a second surface opposite to the first surface. The method can include forming a conductive portion inside the first groove. The method can include forming a second groove on the first surface side of the substrate side by side with the conductive portion, exposing at least a portion of the conductive portion to a second groove side, and forming, on the second groove side of the conductive portion, a facing portion facing the portion of the conductive portion on the second surface side in a direction in which the conductive portion and the second groove are arranged side by side. The method can include adhering a support substrate, via an adhesive, to the first surface side of the substrate. The method can include forming a through hole penetrating the substrate by forming a third groove reaching the second groove on the second surface side of the substrate, and forming, from the conductive portion, an electrode provided in the through hole in the substrate and extending along an axial direction of the through hole. The method can include removing the support substrate and the adhesive.
Various embodiments will be described hereinafter with reference to the accompanying drawings.
The drawings are schematic or conceptual; and the relationships between the thicknesses and the widths of portions, the proportions of sizes between portions, etc., are not necessarily the same as the actual values thereof. Also, the dimensions and/or the proportions may be illustrated differently between the drawings, even for identical portions.
In the drawings and the specification of the application, components similar to those described in regard to a drawing thereinabove are marked with like reference numerals, and a detailed description is omitted as appropriate.
As shown in
The substrate 12 includes a substrate main body 14 and a through hole 16 provided in the substrate main body 14. The substrate main body 14 includes a first surface 14a and a second surface 14b. The first surface 14a is a surface on one end side of the through hole 16 in an axial direction. The second surface 14b is a surface on the other end side of the through hole 16 in the axial direction. In other words, the second surface 14b is a surface opposite to the first surface 14a. The through hole 16 penetrates the substrate main body 14 to allow a first surface 14a side and a second surface 14b side of the substrate main body 14 to communicate with each other.
The electrodes 21 and 22 are provided in the through hole 16 in the substrate main body 14 (substrate 12) and extend along the axial direction of the through hole 16. In other words, the axial direction of the through hole 16 is a direction in which the through hole 16 penetrates the substrate main body 14. In
The second surface 14b is, for example, substantially parallel to the first surface 14a. The through hole 16 extends, for example, in a direction orthogonal to the first surface 14a and the second surface 14b. In other words, the axial direction of the through hole 16 is a direction orthogonal to the first surface 14a and the second surface 14b. In other words, the electrodes 21 and 22 extend in a direction orthogonal to the first surface 14a and the second surface 14b.
However, the direction in which the through hole 16 extends is not limited to a direction strictly perpendicular to the first surface 14a and the second surface 14b, and may at least have a component extending perpendicularly to the first surface 14a and the second surface 14b. For example, the through hole 16 may extend in the direction orthogonal to the first surface 14a and the second surface 14b (up-down direction on paper in
For example, the electrodes 21 and 22 are disposed close to the first surface 14a side. For example, the electrodes 21 and 22 extend from the first surface 14a side toward the second surface 14b side. Ends of the electrodes 21 and 22 on the first surface 14a side are disposed, for example, close to the first surface 14a. A distance between the ends of the electrodes 21 and 22 on the first surface 14a side and the first surface 14a is, for example, shorter than a distance between ends of the electrodes 21 and 22 on the second surface 14b side and the second surface 14b.
The electronic device 10 includes multiple electrodes 21 and 22 provided in the through hole 16. The electronic device 10 includes, for example, a pair of electrodes 21 and 22. For example, the pair of electrodes 21 and 22 face each other with the through hole 16 interposed therebetween. In other words, the pair of electrodes 21 and 22 are disposed, for example, on both sides of the through hole 16 in a width direction. The width direction of the through hole 16 is a direction orthogonal to the axial direction of the through hole 16. In
The pair of electrodes 21 and 22 are, for example, plate-shaped electrodes extending along the axial direction of the through hole 16 and extending in a circumferential direction of the through hole 16. The circumferential direction of the through hole 16 is, in other words, a direction around an axis along the axial direction. The circumferential direction of the through hole 16 is, for example, a direction orthogonal to paper in
The electronic device 10 is used to, for example, control an electron beam passing inside the through hole 16. The electronic device 10 controls a traveling direction of the electron beam passing inside the through hole 16 by, for example, controlling a magnitude of a voltage applied between the pair of electrodes 21 and 22. The electronic device 10 is applied to a device that controls an electron beam and emits the electron beam to an object to perform observation, processing, and the like, such as an electron microscope that performs surface observation with the electron beam, an electron beam lithography system that draws a fine pattern on a mask or a wafer, or an inspection device that scans a surface with the electron beam to detect a defect. The electronic device 10 is, for example, an electron beam control device such as an electrostatic lens or a deflector.
However, use of the electronic device 10 is not limited to those described above. The electronic device 10 is applicable to any device that requires the electrode provided in the through hole 16 of the substrate 12. In addition, the number of electrodes provided in the through hole 16 is not limited to two, and may be three or more. The number of electrodes provided in the through hole 16 may also be one. The number of electrodes provided in the through hole 16 may be appropriately set according to the use of the electronic device 10.
The electronic device 10 further includes a facing portion 18. The facing portion 18 is provided on the substrate main body 14 (substrate 12), is disposed at a position closer to a width direction center of the through hole 16 than are the electrodes 21 and 22, and faces, in the width direction, portions of the electrodes 21 and 22 on one end side in the axial direction. In other words, the substrate 12 includes the facing portion 18 provided on the substrate main body 14.
In other words, the facing portion 18 faces portions of the electrodes 21 and 22 on the second surface 14b side. An end of the facing portion 18 on the first surface 14a side is located, for example, between both ends of the electrodes 21 and 22 in the axial direction. The facing portion 18 does not face, in the width direction, portions of the electrodes 21 and 22 on the first surface 14a side. The portions of the electrodes 21 and 22 on the first surface 14a side face, in the width direction of the through hole 16, a space inside the through hole 16.
The electrodes 21 and 22 include faces facing a center side of the through hole 16. Portions, on the second surface 14b side, of the faces of the electrodes 21 and 22 facing the center side of the through hole 16 face the facing portion 18 in the width direction. Remaining portions of the surfaces of the electrodes 21 and 22 facing the center side of the through hole 16 face the space inside the through hole 16 in the width direction without being covered with another member.
The substrate main body 14 (substrate 12) includes a first portion 31 and a second portion 32. The first portion 31 sets the through hole 16 to a predetermined width between the first surface 14a and the second surface 14b. In the second portion 32, a width of the through hole 16 between the first portion 31 and the second surface 14b is smaller than the width of the through hole 16 in the first portion 31.
In the example, the substrate main body 14 further includes a third portion 33 that is located between the second portion 32 and the second surface 14b and where a width of the through hole 16 is larger than the width of the through hole 16 in the second portion 32.
For example, the electrodes 21 and 22 are provided inside the through hole 16 in the first portion 31. For example, the facing portion 18 is provided in the second portion 32 in a manner of extending from the position closer to the width direction center of the through hole 16 than are the electrodes 21 and 22 toward the one end side (first surface 14a side) of the through hole 16. Accordingly, as described above, the facing portion 18 can face the portions of the electrodes 21 and 22 on the one end side in the axial direction.
As shown in
As shown in
Thus, in the example, the one facing portion 18 faces the portion of each of the pair of electrodes 21 and 22 on the one end side in the axial direction. The invention is not limited thereto, and a pair of facing portions 18 each corresponding to a respective one of the pair of electrodes 21 and 22 may be provided on the substrate main body 14. In other words, the substrate 12 may include multiple facing portions 18 each corresponding to a respective one of the multiple electrodes 21 and 22.
The shape of the through hole 16 as viewed in the axial direction is not limited to the quadrangular shape, and may be, for example, another polygonal shape, a circular shape, or an elliptical shape. The shape of the through hole 16 as viewed in the axial direction is not limited to that described above, and may be any shape. The shape of the facing portion 18 as viewed in the axial direction and the shapes of the electrodes 21 and 22 as viewed in the axial direction are not limited to those described above, and may be any shape corresponding to the shape of the through hole 16.
The substrate 12 includes insulating layers 41 and 42 provided between the first portion 31 of the substrate main body 14 and the electrodes 21 and 22. For example, the insulating layers 41 and 42 are in contact with the first portion 31 of the substrate main body 14. The electrodes 21 and 22 are in contact with the insulating layers 41 and 42. Accordingly, the electrodes 21 and 22 are provided in the first portion 31 via the insulating layers 41 and 42 in a state of being electrically insulated from the substrate main body 14 by the insulating layers 41 and 42. The insulating layer 41 between the first portion 31 and the electrode 21 and the insulating layer 42 between the first portion 31 and the electrode 22 may be implemented by one continuous insulating layer.
A material of the facing portion 18 is, for example, the same as a material of the substrate main body 14 (substrate 12). The substrate main body 14 contains, for example, silicon. In this case, the facing portion 18 also contains silicon similarly to the substrate main body 14. The substrate main body 14 is, for example, a silicon substrate. In other words, the substrate main body 14 is a semiconductor substrate.
For example, the facing portion 18 is provided integrally with the substrate main body 14. In other words, the facing portion 18 is a portion of the substrate main body 14. Accordingly, the material of the facing portion 18 is the same as the material of the substrate main body 14. The material of the substrate main body 14 is not limited to silicon and may be any material. The substrate main body 14 is not limited to the semiconductor substrate. The material of the substrate main body 14 may be appropriately selected according to the use of the electronic device 10 and the like.
The facing portion 18 is, for example, electrically connected to the substrate main body 14. The facing portion 18 is electrically connected to the substrate main body 14 by being provided integrally with the substrate main body 14 as described above. Accordingly, for example, a potential of the facing portion 18 can be substantially the same as a potential of the substrate main body 14.
The facing portion 18 is disposed at a predetermined interval from the electrodes 21 and 22 in the width direction of the through hole 16. Accordingly, it is possible to prevent the electrodes 21 and 22 from being conducted with the substrate main body 14 via the facing portion 18. In other words, the facing portion 18 can be electrically insulated from the electrodes 21 and 22. Accordingly, for example, when controlling an electron beam passing through the through hole 16 by applying a voltage between the electrodes 21 and 22, a voltage of an appropriate magnitude can be applied between the electrodes 21 and 22.
As shown in
The electronic device 10 further includes, for example, wiring layers 51 and 52 and connection electrodes 53 and 54. The wiring layers 51 and 52 are provided, for example, on the first surface 14a of the substrate main body 14. The wiring layer 51 is, for example, electrically connected to the electrode 21 by being in contact with the end of the electrode 21 on the first surface 14a side. The wiring layer 52 is, for example, electrically connected to the electrode 22 by being in contact with the end of the electrode 22 on the first surface 14a side. The connection electrode 53 is provided on the wiring layer 51 and electrically connected to the wiring layer 51. The connection electrode 54 is provided on the wiring layer 52 and electrically connected to the wiring layer 52.
The wiring layers 51 and 52 and the connection electrodes 53 and 54 are used for, for example, electrical connection between the electronic device 10 and another device. In other words, the connection electrodes 53 and 54 are electrode pads. For example, the voltage between the electrodes 21 and 22 is set via the wiring layers 51 and 52 and the connection electrodes 53 and 54. The voltage between the electrodes 21 and 22 is set by, for example, another device connected via the connection electrodes 53 and 54. In
However, the method for setting the voltage between the electrodes 21 and 22 is not limited to that described above. For example, a circuit for setting the voltage between the electrodes 21 and 22 may be provided on the substrate main body 14. For example, when the substrate main body 14 is a semiconductor substrate, a CMOS circuit or the like may be provided on the substrate main body 14 in advance. The wiring layer may be provided, for example, inside the substrate main body 14. The wiring layers 51 and 52 and the connection electrodes 53 and 54 are provided as necessary and can be omitted.
As shown in
The electrode 21 includes, for example, a first conductive portion 21a and a second conductive portion 21b. The first conductive portion 21a is, for example, provided on a substrate main body 14 side. The second conductive portion 21b is, for example, provided at a position closer to the width direction center of the through hole 16 than is the first conductive portion 21a. In other words, the first conductive portion 21a is provided between the substrate main body 14 (first portion 31) and the second conductive portion 21b in the width direction.
The first conductive portion 21a and the second conductive portion 21b extend along the axial direction of the through hole 16. In addition, the first conductive portion 21a and the second conductive portion 21b extend in the circumferential direction of the through hole 16. The first conductive portion 21a and the second conductive portion 21b are, for example, plate-shaped.
One end of the second conductive portion 21b in the axial direction is connected to one end of the first conductive portion 21a in the axial direction. The other end of the second conductive portion 21b in the axial direction is connected to the other end of the first conductive portion 21a in the axial direction. The second conductive portion 21b is separated from the first conductive portion 21a at an intermediate portion in the axial direction. In other words, a gap is provided between the first conductive portion 21a and the second conductive portion 21b in the intermediate portion of the electrode 21 in the axial direction.
Thus, the shape of the hollow electrode 21 is, more specifically, a shape in which a gap is provided between the first conductive portion 21a and the second conductive portion 21b in the intermediate portion in the axial direction. Ends of the first conductive portion 21a and the second conductive portion 21b in the circumferential direction may or may not be in contact with each other. The gap between the first conductive portion 21a and the second conductive portion 21b may, for example, communicate with the outside at the ends of the first conductive portion 21a and the second conductive portion 21b in the circumferential direction. The hollow electrode 21 is not limited to a shape including an internally closed space, and may be a shape including an internal space communicating with the outside. In addition, the electrode 21 is not necessarily hollow. The electrode 21 may have a shape including substantially no space therein.
As shown in
As shown in
As shown in
As shown in
Thus, when the metal layer 66 is formed, a speed of formation of the metal layer 66 proceeding from both sides of the grooves 61 and 62 tends to be faster on an upper side of the grooves 61 and 62 than on a bottom side of the grooves 61 and 62. Therefore, there is a possibility that the metal layer 66 on the upper side of the grooves 61 and 62 is closed first before the metal layer 66 sufficiently fills the bottom side of the grooves 61 and 62. That is, there is a possibility that a hollow shape like the electrode 21 shown in
As shown in
As shown in
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As shown in
At this time, the insulating layers 41 and 42 formed on side surfaces of the grooves 61 and 62 are exposed by performing etching with a strong (long) isotropy such that a width of the groove 70 is larger than the width of the opening of the resist 68. In this case, a shape of the groove 70 is determined by the insulating layers 41 and 42 based on a selection ratio between the substrate 60 and the insulating layers 41 and 42.
As shown in
Thus, the substrate 60 is etched while changing the condition, and a portion of the substrate 60 is intentionally left on portions of the conductive portions 66a and 66b on the bottom side of the grooves 61 and 62. Accordingly, the facing portion 18 is formed by the portion of the substrate 60 left on the bottom side of the grooves 61 and 62, disposed at a position closer to a width direction center of the groove 72 (through hole 16) than are the conductive portions 66a and 66b, and faces portions of the conductive portions 66a and 66b on one end side in the axial direction.
As shown in
As shown in
As shown in
When the substrate 60 is a semiconductor substrate, the thickness of the substrate 60 is, for example, 700 μm or more. In this case, it is difficult to form the through hole 16 in the substrate 60 by processing once. Therefore, as described above, back grinding is performed to reduce the thickness of the entire substrate 60. For example, the second surface 60b side is etched such that the thickness of the substrate 60 is about 100 μm to 500 μm. In
As shown in
As shown in
As shown in
Thus, the method for manufacturing the electronic device 10 includes a process of forming the grooves 61 and 62 (first grooves) on the first surface 60a side of the substrate 60 including the first surface 60a and the second surface 60b opposite to the first surface 60a (for example, the process shown in
The method for manufacturing the electronic device 10 includes a process of forming the conductive portions 66a and 66b inside the grooves 61 and 62 (for example, the process shown in
The method for manufacturing the electronic device 10 includes a process of forming the grooves 70 and 72 (second grooves) side by side with the conductive portions 66a and 66b on the first surface 60a side of the substrate 60, exposing at least a portion of the conductive portions 66a and 66b to grooves 70 and 72 side, and forming, on the grooves 70 and 72 side of the conductive portions 66a and 66b, the facing portion 18 facing a portion of the conductive portions 66a and 66b on the second surface 60b side in the direction in which the conductive portions 66a and 66b and the grooves 70 and 72 are arranged side by side (for example, the process shown in
The method for manufacturing the electronic device 10 includes a process of adhering the support substrate 76 to the first surface 60a side of the substrate 60 via the adhesive 74 (for example, the process shown in
The method for manufacturing the electronic device 10 includes a process of forming the through hole 16 penetrating the substrate 60 by forming the groove 80 (third groove) reaching the groove 72 on the second surface 60b side of the substrate 60, and forming, from the conductive portions 66a and 66b, the electrodes 21 and 22 provided in the through hole 16 in the substrate 60 and extending along the axial direction of the through hole 16 (for example, the process shown in
The method for manufacturing the electronic device 10 includes a process of removing the support substrate 76 and the adhesive 74 (for example, the process shown in
The process of forming the through hole 16 includes leaving at least a portion of the facing portion 18. In other words, the process of forming the through hole 16 includes forming the facing portion 18 that is disposed at a position closer to the width direction center of the through hole 16 than are the conductive portions 66a and 66b and faces, in the width direction, a portion of the conductive portions 66a and 66b on the one end side in the axial direction based on the facing portion 18 that faces, in the direction in which the conductive portions 66a and 66b and the grooves 70 and 72 are arranged side by side, portions of the conductive portions 66a and 66b on the second surface 60b side.
The process of forming the grooves 70 and 72 (second grooves) and the facing portion 18 includes forming the groove 70 (first recess) whose depth is smaller than the depths of the grooves 61 and 62 (first grooves), forming, in the groove 70, the groove 72 (second recess) whose width is smaller than the width of the groove 70 and whose depth is larger than the depths of the grooves 61 and 62, and forming a portion of the substrate 60 left between the conductive portions 66a and 66b and the groove 72 as the facing portion 18.
The process of forming the through hole 16 includes making a width of the groove 80 (third groove) larger than the width of the groove 72.
As shown in
When the substrate 60 adheres to the support substrate 76 by the adhesive 74, the adhesive 74 shrinks due to the heat treatment or the like. At this time, since surfaces of the electrodes 21 and 22 facing the groove 70 side are in direct contact with the adhesive 74, stress or strain due to the shrinkage of the adhesive 74 are applied to the electrodes 21 and 22. An influence of the stress or strain due to the shrinkage of the adhesive 74 is more obvious on the bottom side (second surface 60b side) of the grooves 61 and 62 than on the upper side (first surface 60a side) of the grooves 61 and 62.
As in the reference example shown in
In this regard, in the electronic device 10 and the method for manufacturing the same according to the embodiment, the facing portion 18 is disposed at the position closer to the width direction center of the groove 72 (through hole 16) than are the electrodes 21 and 22 (conductive portions 66a and 66b) and faces the portions of the electrodes 21 and 22 (conductive portions 66a and 66b) on the one end side in the axial direction. Accordingly, for example, a thickness of the adhesive 74 in contact with the ends of the electrodes 21 and 22 (conductive portions 66a and 66b) on the bottom side of the grooves 61 and 62 can be reduced to the thicknesses of the insulating layers 41 and 42.
The strain caused by the shrinkage of the adhesive 74 depends on the thickness (length) of the adhesive 74. As the thickness of the adhesive 74 decreases, the strain caused by the shrinkage of the adhesive 74 decreases. In the embodiment, central portions of the electrodes 21 and 22 (conductive portions 66a and 66b) in the axial direction are in contact with the adhesive 74 embedded with the width of the groove 70, whereas the thickness of the adhesive 74 in contact with the electrodes 21 and 22 (conductive portions 66a and 66b) can be the thicknesses of the insulating layers 41 and 42 on bottoms of the grooves 61 and 62. Therefore, in the electrodes 21 and 22 (conductive portions 66a and 66b), it is possible to reduce the strain applied to the portion, on which stress is likely to be concentrated and which is likely to be broken, on the bottom side of the grooves 61 and 62.
Accordingly, in the electronic device 10 and the method for manufacturing the same according to the embodiment, the deformation of the electrodes 21 and 22 (conductive portions 66a and 66b) can be prevented, and high reliability can be attained. The yield of the electronic device 10 can be improved.
In the configuration of the reference example in which the facing portion 18 is not provided, the ends of the electrodes 21 and 22 on the second surface 14b side are exposed to the through hole 16. Therefore, for example, when applied to an electron beam control device, a component that is not perpendicular to the electrodes 21 and 22 may be generated in an electromagnetic field that controls an electron beam. There is a concern that the component not perpendicular to the electrodes 21 and 22 in the electromagnetic field may influence controllability of the electron beam.
In the electronic device 10 according to the embodiment, the potential of the facing portion 18 can be substantially equal to the potential of the substrate main body 14. For example, the substrate main body 14 and the facing portion 18 can be set to a ground potential. Accordingly, for example, places substantially perpendicular to the electrodes 21 and 22 are set as a start point and an end point in the electromagnetic field, and it is possible to prevent generation of a component not perpendicular to the electrodes 21 and 22 in the electromagnetic field that controls the electron beam. Accordingly, for example, when the electronic device 10 is applied to the electron beam control device, the electron beam can be controlled more easily.
In the embodiment, the substrate main body 14 further includes the third portion 33 that is located between the second portion 32 and the second surface 14b and where the width of the through hole 16 is larger than the width of the through hole 16 in the second portion 32. The third portion 33 is formed by forming the groove 80 whose width is larger than the width of the groove 72 from the second surface 60b side of the substrate 60. Thus, by forming the groove 80, for example, when the groove 80 is formed from the second surface 60b side of the substrate 60, misalignment between the groove 80 and the groove 72 can be prevented, and the through hole 16 can be more appropriately formed.
In the embodiment, the axial direction length D1 of the portion of the facing portion 18 facing the portions of the electrodes 21 and 22 is larger than the distance D2 between the facing portion 18 and the substrate main body 14 in the width direction. Accordingly, it is possible to more appropriately prevent the influence of the stress or strain applied to the ends of the electrodes 21 and 22 and to more appropriately prevent deformation of the electrodes 21 and 22.
Functions and configurations substantially the same as those in the above-described embodiment are denoted by the same reference signs, and detailed description thereof is omitted.
As shown in
Thus, the shape of each of the electrodes 21 and 22 as viewed in the axial direction is not limited to a linear shape, and may be, for example, a bent shape or a curved shape. The shape of each of the electrodes 21 and 22 as viewed in the axial direction may be any shape depending on, for example, the shape of the through hole 16 as viewed in the axial direction and use of the electronic device 10a.
As shown in
The number of electrodes provided in the electronic device is not limited to one pair, and may be two or more pairs. The number of multiple electrodes provided in one through hole 16 of the electronic device is not limited to that described above, and may be any number. The number of the multiple electrodes provided in one through hole 16 of the electronic device may be appropriately set according to, for example, use of the electronic device.
As shown in
As shown in
Thus, the electronic device 10d may have multiple through holes 16. The number of through holes 16 provided in the electronic device 10d may be any number. The number of the through holes 16 provided in the electronic device 10d may be appropriately set according to, for example, use of the electronic device 10d.
As shown in
For example, as shown in
Thus, by extending the insulating layers 41 and 42 between the facing portion 18 and the electrodes 21 and 22, it is possible to prevent entry of the adhesive 74 between the facing portion 18 and the electrodes 21 and 22. Accordingly, it is possible to more appropriately reduce the influence of the stress or strain applied to the ends of the electrodes 21 and 22 and to more appropriately prevent the deformation of the electrodes 21 and 22.
For example, the insulating layers 41 and 42 are in contact with the facing portion 18 while being in contact with the electrodes 21 and 22. Accordingly, it is possible to further prevent the entry of the adhesive 74 between the facing portion 18 and the electrodes 21 and 22, and to more appropriately prevent the deformation of the electrodes 21 and 22.
As shown in
Thus, the material of the facing portion 18 may be different from the material of the substrate main body 14. For example, as shown in
When the material of the facing portion 18 is insulating, the facing portion 18 can be provided in contact with the electrodes 21 and 22. In this case, it is possible to prevent the entry of the adhesive 74 between the facing portion 18 and the electrodes 21 and 22, and to more appropriately prevent the deformation of the electrodes 21 and 22.
As in an electronic device 10g shown in
As shown in
Therefore, in the electronic device 100, the width of the through hole 16 on the one end side in the axial direction is different from the width of the through hole 16 on the other end side in the axial direction. In the electronic device 100, the width of the through hole 16 on the first surface 14a side is larger than the width of the through hole 16 on the second surface 14b side.
As shown in
As shown in
As shown in
Thus, the substrate main body 14 may not necessarily include the third portion 33. For example, when the depth of the groove 80 formed from the second surface 60b side is excessively large and it is difficult to form the groove 80, as shown in the first embodiment, it is desired to form the groove 72 in the groove 70 and reduce the depth of the groove 80 etched from the second surface 60b side.
In the electronic device 100, by forming the facing portion 60t, as in the first embodiment, it is still possible to reduce the influence of the stress or strain applied to the ends of the electrodes 21 and 22 and prevent the deformation of the electrodes 21 and 22. The highly reliable electronic device 100 can be provided.
As shown in
For example, as shown in
Thus, for example, misalignment between the groove 80 and the groove 70 can be prevented more easily by gradually decreasing the width of the groove 80 when etching is performed from the second surface 60b side. For example, the through hole 16 can be formed more easily.
As shown in
The facing portion 60t may be provided at least when the substrate 60 adheres to the support substrate 76 by the adhesive 74. Therefore, after the substrate 60 adheres to the support substrate 76, the facing portion 60t may be removed in the process of etching the substrate 60 from the second surface 60b side. In other words, the manufactured electronic device does not necessarily include the facing portion 18. Thus, the process of forming the through hole 16 may include removing the facing portion 60t by forming the groove 80.
According to the embodiment, an electronic device with a high reliability and a method for manufacturing the same can be provided.
In the specification of the application, “electrically connected” includes not only direct contact connection but also connection via another conductive member or the like.
Embodiments may include the following configurations.
An electronic device comprising:
The device according to Appendix 1, wherein
The device according to any one of Appendixes 1 and 2, further comprising:
The device according to any one of Appendixes 1 to 3, further comprising:
The device according to any one of Appendixes 1 to 4, wherein
The device according to any one of Appendixes 1 to 4,
The device according to any one of Appendixes 1 to 6,
The device according to any one of Appendixes 1 to 7, wherein
The device according to any one of Appendixes 1 to 8, wherein
The device according to Appendix 9, wherein
The device according to any one of Appendixes 9 and 10, wherein
The device according to Appendix 11, wherein
The device according to Appendix 9, wherein
The device according to any one of Appendixes 1 to 13, wherein
A method for manufacturing an electronic device, the method comprising:
The method according to Appendix 15, wherein
The method according to Appendix 15, wherein
The method according to any one of Appendixes 15 to 17, wherein
The method according to Appendix 18, wherein
The method according to any one of Appendixes 15 to 17, wherein
Hereinabove, embodiments of the invention are described with reference to specific examples. However, the embodiments of the invention are not limited to these specific examples. For example, the specific configurations of the components included in the electronic device are incorporated in the scope of the invention as long as a person skilled in the art appropriately selects components from the publicly known range to similarly implement the invention for obtaining the similar effect.
Further, any two or more components of the specific examples may be combined within the extent of technical feasibility and are included in the scope of the invention to the extent that the purport of the invention is included.
Moreover, all electronic devices practicable by an appropriate design modification by one skilled in the art based on the electronic devices described above as embodiments of the invention also are within the scope of the invention to the extent that the spirit of the invention is included.
Various other variations and modifications can be conceived by those skilled in the art within the spirit of the invention, and it is understood that such variations and modifications are also encompassed within the scope of the invention.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2023-045871 | Mar 2023 | JP | national |
