Claims
- 1. An electronic component comprising an inorganic substrate having an electronic device mounting thereon which is coated by a polymeric film formed by applying thereto a coating of a composition comprising an homogeneous liquid solution of:
- (a) polyimide, polyamic acid or polyamide ester;
- (b) silane compound corresponding to the structural formula: ##STR8## R.sub.1 is independently selected from C.sub.1-3 alkyl groups; A is either phenylene or (CH.sub.2)w in which w is an integer of from 1 to 6:
- R.sub.2 is independently selected from --H and C.sub.1-3 alkyl groups;
- Z is independently selected from --H, C.sub.1-8 alkyl, C.sub.7-12 alkaryl, C.sub.7-12 aralkyl, glycidyl, romantic carboxyl, ##STR9## in which R.sub.3 is phenyl or C.sub.1-8 alkyl; x is zero or 1;
- y is zero or an integer of from 1 to 3; and
- z is zero or an integer of from 1 to 3; the sum of the carbon atoms in moieties R.sub.2 and Z being at least 3; and
- (c) aprotic solvent, the weight ratio of (b) to (a) being from 0.01 to 02
- and heating the applied coating to remove solvent therefrom.
- 2. The electronic component of claim 1, in which the polymer component (a) of the coating is a polyamic acid which is dehydrated during he heating step to form the corresponding polyimide.
Parent Case Info
This application is a continuation of application Ser. No. 07/088,142 filed Aug. 21, 1987 now abandoned.
US Referenced Citations (13)
Foreign Referenced Citations (1)
Number |
Date |
Country |
58-168624 |
Oct 1983 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Hackh's Chemical Dictionary, pp. 35 and 36, 4th ed. (New York, McGraw-Hill Book Co., 1972). |
Continuations (1)
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Number |
Date |
Country |
Parent |
88142 |
Aug 1987 |
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