BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a cross-sectional view showing an exemplary structure of an electronic device 11, according to an embodiment of the present invention, including a surface acoustic wave element as a functional element packaged using a resin member;
FIG. 2A shows an exemplary configuration of a ladder-type circuit of a band-pass filter;
FIG. 2B shows an exemplary configuration of a lattice-type circuit of a band-pass filter;
FIG. 3 is a cross-sectional view showing an exemplary structure of an electronic device 12, according to an embodiment of the present invention, including a duplexer;
FIG. 4 is a functional block diagram of the electronic device 12 shown in FIG. 3;
FIG. 5 is a functional block diagram of a communication apparatus 41 including the electronic device 12 shown in FIG. 3;
FIG. 6 is a functional block diagram of a communication apparatus 41 including the electronic device 12 shown in FIG. 3 and band-pass filters 417 and 418 included in the electronic device 11 shown in FIG. 1;
FIG. 7 shows an exemplary structure of a measuring system for measuring intermodulation distortion characteristics;
FIG. 8 is a cross-sectional view showing an exemplary structure of an electronic device 13, according to an embodiment of the present invention, including a mechanical switch;
FIG. 9 is a functional block diagram of a communication apparatus 43 including the electronic device 13 shown in FIG. 8;
FIG. 10 is a cross-sectional view showing an exemplary structure of an electronic device 11a, according to an embodiment of the present invention, including a filter using a film bulk acoustic wave element;
FIG. 11 is a cross-sectional view showing an exemplary structure of an electronic device 12a, according to an embodiment of the present invention, including a duplexer using a film bulk acoustic wave element;
FIG. 12 is a cross-sectional view showing an exemplary structure of an electronic device 51, according to an embodiment of the present invention, including a film bulk acoustic wave element as a functional element packaged using a substrate;
FIG. 13 is a cross-sectional view showing an exemplary structure of an electronic device 52, according to an embodiment of the present invention, including a duplexer;
FIG. 14 is a cross-sectional view showing an exemplary structure of an electronic device 53, according to an embodiment of the present invention, including a mechanical switch;
FIG. 15 is a cross-sectional view showing an exemplary structure of an electronic device 51, according to an embodiment of the present invention, in which a magnetic layer 5031 is provided on a side wall of a via-hole 561vh;
FIG. 16 is a cross-sectional view showing an exemplary structure of an electronic device 52, according to an embodiment of the present invention, in which a wiring electrode 103 is entirely formed of a magnetic material;
FIG. 17 is a cross-sectional view showing an exemplary structure of an electronic device 51, according to an embodiment of the present invention, in which a via-hole is provided on a lid substrate 530;
FIG. 18 is a cross-sectional view showing an exemplary structure of an electronic device 51a, according to an embodiment of the present invention, including a filter using a surface acoustic wave element;
FIG. 19 is a cross-sectional view showing an exemplary structure of an electronic device 52a, according to an embodiment of the present invention, including a duplexer using a surface acoustic wave element;
FIG. 20 is a cross-sectional view showing a structure of an exemplary conventional electronic device 61;
FIG. 21 is a cross-sectional view showing a structure of another exemplary conventional electronic device 71;
FIG. 22 is a cross-sectional view showing a structure of a still another exemplary conventional electronic device 81; and
FIG. 23 is a cross-sectional view showing a structure of still another exemplary conventional electronic device 91.