1. Technical Field
The present invention relates to an electronic device with a heat sink assembly mounted thereon.
2. Description of Related Art
Computers usually have a plurality of different operating components mounted therein. In recent years, the heat generated from these operating components has risen dramatically as the operating components have become more sophisticated. Each operating component often requires its own dedicated heat sink to dissipate heat. Thus, these heat sinks occupy a large amount of space. In addition, smaller personal computers, which have limited interior space have become popular, making heat sinks a burden in the design process.
Therefore, a small and efficient heat sink assembly is desired to overcome the above-described deficiency.
Referring to
A first heat source 11 and a second heat source 12 are mounted adjacent to each other on the circuit board 10. In this embodiment, the heat generated by the first heat source 11 is greater than that generated by the second heat source 12. For example, the first heat source 11 may be a CPU and the second heat source 12 may be a north bridge chipset. The circuit board 10 defines a pair of screw holes 17 in the circuit board 10 at opposite sides of the first heat source 11. The circuit board 10 is equipped with four posts 13 near four corners of the second heat source 12. Each post 13 defines a screw hole 131 therein.
Referring also to
The heat sink 14 includes a base 141 and a plurality of fins 143 extending from a top surface of the base 141. The fins of the plurality of fins 143 are substantially parallel and aligned in the second direction. The heat sink 14 defines a pair of mounting holes 145 corresponding to the screw holes 17 of the circuit board 10.
Referring to
When the computer is operating, the first and second heat sources 11, 12 generate heat. The heat generated by the first heat source 11 is transferred to the heat sink 14. When the fan 15 is operating, air is drawn from the second heat source 12 into the air inlet 151 out through the air outlet 152, and flows through the fins 143 of the heat sink 14. Therefore, the heat from the second heat source 12 and the fins 143 is dissipated by the air flowing therethrough. Since the fins 143 are aligned in the same direction as the air outlet 152, the heat on the fins 14 is dissipated very quickly.
In another embodiment, the fan 15 can be mounted above the heat sink 14 so that the air inlet 151 faces the heat sink 14 and the air outlet 152 faces the second heat source 12.
It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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200820301398.2 | Jul 2008 | CN | national |