Patent Application
20240096548
The field relates to an electronic device, and in particular, to a signal planar transformer including a core, a laminate substrate with conductive traces, and a base.
Various electronic devices (e.g., signal transformers), utilize a ring core wound with copper wire which may lead to a longer manufacturing process time and may be less reliable. These devices are typically assembled into a case, adding additional time in the assembly process. Further, these devices are typically buried into laminate substrates thus requiring longer manufacturing times. Accordingly, there remains a continued need for an improved signal transformer.
In one embodiment, an electronic device is disclosed. The electronic device can include a core having a top core section and a bottom core section, a laminate substrate, where the laminate substrate having a void through which the top and bottom core sections are connected, and the laminate substrate having conductive traces. Further, the electronic device can include a base having a first side including a recess and a second side opposite the first side, such that at least one of the core and the laminate substrate can be disposed in the recess of the base, and where the base has one or more terminals on the second side to electrically connect to an external device.
In another embodiment, an electronic device can include an electrical component and a base having a first side and a second side opposite the first side, such that the electrical component can be coupled to the first side of the base. The base can have one or more terminals on the second side to electrically connect to a substrate and can be configured for surface mounting on to the substrate.
In another embodiment, a method of manufacturing an electronic device is disclosed. The method can include fitting a top core section and a bottom core section through void of a laminate substrate and around the periphery of the laminate substrate, connecting the top and bottom core sections to each other, mounting at least one of the core and laminate substrate into a recess on a first side of a base, and connecting one or more terminals on a second side opposing the first side of the base to an external device.
These, as well as other components, steps, features, objects, benefits, and advantages, will now become clear from a review of the following detailed description of illustrative embodiments, the accompanying drawings, and the claims.
Conventional signal transformers have several disadvantages. Such disadvantages include long and complex manufacturing processes, low reliability, and that the signal transformer can be damaged, for example, when the wires are thermally shocked and/or mechanically scraped. Another problem is that conventional coils of signal transformers are typically assembled into a case which can cause the outside surfaces of the coil to be removed. Further, conventional signal transformers are also typically buried into the top surface of a substrate which can cause the removal of the top surface and a recess to be made into the substrate. Accordingly, there is a continued demand for an improved signal transformer that is simpler and more efficient to manufacture with higher reliability and durability.
The laminate substrate 108 can comprise a multi-layered substrate having insulating layers patterned with conductive traces 112 (see
The base 116 can comprise an insulating material, for example, but not limited to, a molded insulating material (e.g., a molded epoxy such as Diallyl Phthalate (DAP) Molding Compound). The base 116 can have one or more pins 117, for example L-type pins, comprising corresponding terminals 118 and vertical terminal leads 122. Terminal 118 can be disposed on an opposite side from the core 102 and laminate substrate 108 to electrically connect to an external device. In some embodiments, pins 117 can be disposed on a front side F1 and a back side B1 opposite of the front side F1 of the base 116. The core 102 and laminate substrate can then be coupled to both the pins 117 of the front side F1 and the pins 117 located on the back side B1 of the base 116. The external device can comprise any suitable type of device, e.g., a package substrate, such as a printed circuit board (PCB), ceramic substrate, lead frame substrate, etc.
In some embodiments, the core 102 and the laminate substrate 108 can be disposed into the recess 114 of the base 116 and attached by epoxy or another an adhesive to positioning columns 124 of the base 116. The positioning columns 124 may include an arc opening 136 for dispensing epoxy or another adhesive to attach the base 116, laminate substrate 108, and core 102. The arc opening 136 on the positioning columns 124 can allow the epoxy or adhesive to gather at the joint of the core 102,
The conductive traces 112 (see
Vertical terminal lead 122 can be configured to connect the base 116 to the laminate substrate 108. In some embodiments, the base 116 can have a plurality of vertical terminal leads 122, which can correspond with the amount of pins 117, with vertical terminal leads 122 on opposing sides of the base 116 and laminate substrate 108 to connect the base 116 to the laminate substrate 108. The pin 117 can comprise an L-shaped pin, including, e.g., a vertical lead 122 and horizontal terminal 118 extending from the vertical lead 122. Vertical lead 122 and terminal 118 can be integrally formed in a unitary body such that terminal 118 can extend non-parallel from vertical lead 122. The angle measured between the terminal 118 and vertical lead 122 can be in a range of 45 degrees to 135 degrees, in a range of 80 degrees to 100 degrees, in a range of 85 degrees to 95 degrees, or in a range of 87 degrees to 93 degrees. The vertical terminal lead 122 of the base 116 can connect to the laminate substrate 108 by solder or another conductive adhesive. The laminate substrate 108 can include a notch 126 for connecting the conductive traces 112 of the laminate substrate 108 to the vertical terminal lead 122 of the base 116, which in turn connects to the terminals 118 on bottom side of the base 116. The notch 126 can be any suitable shape to provide a contact between the conductive traces 112 and the vertical terminal lead 122. In some embodiments, the notch 128 can be a semi-circular cutout plated with conductive material. In some embodiments, the one or more terminals 118 of the base 116 can be configured for surface mounting on the external device. The positioning columns 124 can assist in aligning notch 126 of the laminate substrate 108 with the vertical terminal leads 122 of base 116.
By mounting the core and a laminate substrate to a base, the electrical device can be surface mountable to an external device which facilitates easier electrical connection to external devices as compared to conventional devices. Using base 116 as a mounting surface for the core 102 and laminate substrate 108 to connect to the pins 117 on the second side of the base can provide a versatile and interchangeable device that can lessen manufacturing process time and increase reliability. The mounting surface of base 116 can provide a platform for a number of electrical components such as transformers, inductors, or any other suitable type of electronic device such that the discussed configuration allows for connectivity to the bottom of the base where pins or other leads can be located. The pins or leads can be configured and selected based on the type of application of connection to an external device.
Reference throughout this specification to “some embodiments” or “an embodiment” means that a particular feature, structure, element, act, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases “in some embodiments” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment and may refer to one or more of the same or different embodiments. Furthermore, the particular features, structures, elements, acts, or characteristics may be combined in any suitable manner (including differently than shown or described) in other embodiments. Further, in various embodiments, features, structures, elements, acts, or characteristics can be combined, merged, rearranged, reordered, or left out altogether. Thus, no single feature, structure, element, act, or characteristic or group of features, structures, elements, acts, or characteristics is necessary or required for each embodiment. All possible combinations and subcombinations are intended to fall within the scope of this disclosure.
As used in this application, the terms “comprising,” “including,” “having,” and the like are synonymous and are used inclusively, in an open-ended fashion, and do not exclude additional elements, features, acts, operations, and so forth. Also, the term “or” is used in its inclusive sense (and not in its exclusive sense) so that when used, for example, to connect a list of elements, the term “or” means one, some, or all of the elements in the list.
Similarly, it should be appreciated that in the above description of embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. This method of disclosure, however, is not to be interpreted as reflecting an intention that any claim require more features than are expressly recited in that claim. Rather, inventive aspects lie in a combination of fewer than all features of any single foregoing disclosed embodiment.
Language of degree used herein, such as the terms “approximately,” “about,” “generally,” and “substantially” as used herein represent a value, amount, or characteristic close to the stated value, amount, or characteristic that still performs a desired function or achieves a desired result. For example, the terms “approximately”, “about”, “generally,” and “substantially” may refer to an amount that is within less than 10% of, within less than 5% of, within less than 1% of, within less than 0.1% of, and within less than 0.01% of the stated amount. As another example, in certain embodiments, the terms “generally parallel” and “substantially parallel” refer to a value, amount, or characteristic that departs from exactly parallel by less than or equal to 10 degrees, 5 degrees, 3 degrees, or 1 degree. As another example, in certain embodiments, the terms “generally perpendicular” and “substantially perpendicular” refer to a value, amount, or characteristic that departs from exactly perpendicular by less than or equal to 10 degrees, 5 degrees, 3 degrees, or 1 degree.
The foregoing description sets forth various example embodiments and other illustrative, but non-limiting, embodiments of the inventions disclosed herein. The description provides details regarding combinations, modes, and uses of the disclosed inventions. Other variations, combinations, modifications, equivalents, modes, uses, implementations, and/or applications of the disclosed features and aspects of the embodiments are also within the scope of this disclosure, including those that become apparent to those of skill in the art upon reading this specification. Additionally, certain objects and advantages of the inventions are described herein. It is to be understood that not necessarily all such objects or advantages may be achieved in any particular embodiment. Thus, for example, those skilled in the art will recognize that the inventions may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught herein without necessarily achieving other objects or advantages as may be taught or suggested herein. Also, in any method or process disclosed herein, the acts or operations making up the method or process may be performed in any suitable sequence and are not necessarily limited to any particular disclosed sequence.
