Patent Application
20200052032
This application claims priority to and benefit of Chinese Patent Application Serial No. 201810889130.3, filed on Aug. 7, 2018. The entire content of the before-mentioned patent application is incorporated herein by reference.
The present disclosure relates to a field of communication devices, and more particularly to an electronic device.
In the realization of a full screen, the placement of a front camera has always been a pain of the full-screen industrial design so far and results in an occurrence of a notch screen and a special-shaped screen. For the placement of the front camera, solutions like liftable and lowerable cameras are also proposed, but such solutions require additional stepper motors or similar mechanisms, which greatly increases the complexity of industrial design and circuit design, and hence significantly increases the cost. For a rear camera, most products will have a certain protrusion due to a height of a CMOS camera module, which affects an overall appearance of a mobile phone.
An electronic device according to a first aspect of embodiments of the present disclosure includes a thin film camera. The thin film camera includes an image processor arranged in the electronic device and a film structure disposed to an outer surface of the electronic device. The film structure is configured for processing incident lights by a photosensitive array to capture an image. The image processor is in communication with the film structure.
An electronic device according to a second aspect of embodiments of the present disclosure includes a housing assembly, an image processor arranged in the housing assembly, and a film structure disposed to an outer surface of the housing assembly. The film structure is configured to capture an image. The image processor is communicated with the film structure and configured to process the image captured by the film structure.
An electronic device according to a third aspect of embodiments of the present disclosure includes a display assembly embedded in the electronic device, an image processor arranged in the electronic device and shielded by the display assembly, and a film structure disposed to an outer surface of the display assembly. The film structure is configured to capture an image. The image processor is communicated with the film structure and configured to process the image captured by the film structure.
The foregoing and/or additional aspects and advantages of the present disclosure will become obvious and easily understood in descriptions of embodiments with reference to the following accompanying drawings.
Embodiments of the present disclosure will be further described with reference to the drawings. The same or similar elements and the elements having the same or similar functions are denoted by like reference numerals throughout the descriptions. Embodiments described herein with reference to the drawings are explanatory, serve to explain the present disclosure, and are not construed to limit embodiments of the present disclosure.
An electronic device 100 according to an embodiment of the present disclosure will be described below with reference to
As illustrated in
In some embodiments, the display assembly 120 is used to present images and text information, and the display assembly 120 is embedded in the housing assembly 110. The thin film camera 130 includes an image processor 131 and a film structure 132 configured to capture an image. The film structure 132 includes a photosensitive array and captures the image via processing incident lights by the photosensitive array. The film structure 132 is disposed on an outer surface of the electronic device 100, and the image processor 131 is in communication with the film structure 132 and is arranged in the housing assembly 110. It should be noted that the thin film camera 130 captures the image by processing the incident lights with the photosensitive array, and each element in the array is configured to receive light waves. Due to superposition of the light waves, the light waves in one of incident directions will be enhanced, and the light waves in other directions will be offset. The photosensitive array may be formed by quantum films of special materials, and an image acquisition is realized by the image processor 131 and the light capturing.
As compared with the related art, the image is achieved by replacing the lens (or the lens assembly) with the film structure 132. The film structure 132 may be directly attached to the outer surface of the electronic device 100, and the image processor 131 may be disposed inside the housing assembly 110, which can reduce or eliminate a local protrusion of the electronic device 100 due to an excessive thickness of the camera assembly, such that the thickness of the thin film camera 130 can be reduced, thus making it convenient to arrange the thin film camera 130 to the housing assembly 110.
As illustrated in
In some embodiments, as illustrated in
According to some embodiments of the present disclosure, the image processor 131 is connected to the battery cover 111, so as to optimize positions of various components in the housing assembly 110. Certainly, the position of the image processor 131 is not limited to this. In some embodiments, as illustrated in
In some embodiments, as illustrated in
In the present disclosure, it should be understand that terms such as “thickness”, “up”, “down”, “inside”, “outside” refer to directions and location relations which are the directions and location relations shown in the drawings, intended for describing the present disclosure conveniently and simplifying the description, but are not intended to indicate or imply that the devices or the elements are arranged in particular orientations or are configured and operated in the particular orientations, which thus should not be construed to limit the present disclosure.
Reference throughout this specification to “an embodiment”, “some embodiments”, “an exemplary embodiment”, “an example”, “a specific example”, or “some examples” means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, exemplary descriptions of aforesaid terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
Although embodiments of present disclosure have been shown and described above, it should be understood by those skilled in the art that changes, alternatives, and modifications can be made to the embodiments without departing from spirit and principles of the present disclosure. The scope of the present disclosure is limited by the attached claims and its equivalents.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201810889130.3 | Aug 2018 | CN | national |
