Claims
- 1. An electrooptical coupling component, comprising:a first substrate formed as a molded synthetic-material body having a first alignment device formed by oblique surfaces; a second substrate having a second alignment device matched to said first alignment device and formed by oblique surfaces corresponding to said oblique surfaces of said first alignment device; a plurality of optical waveguides disposed in one given plane on said first substrate and having coupling-side end surfaces and longitudinal axes; and a multichannel electrooptical converter positioned on said second substrate independently of said optical waveguides and precisely relative to said second alignment device, said multichannel electrooptical converter having optically active surfaces oriented toward said coupling-side end surfaces of said optical waveguides; said coupling-side end surfaces of said optical waveguides causing a beam deflection to said optically active surfaces of said multichannel electrooptical converter; said oblique surfaces having one dimension extended parallel to said longitudinal axes of said optical waveguides, said oblique surfaces located in planes intersecting said given plane of said optical waveguides, and said oblique surfaces form-lockingly engaged with each other for laterally adjusting said end surfaces of said optical waveguides relative to said optically active surfaces of said multichannel electrooptical converter; one of said first substrate and said second substrate having only one prismatic indentation formed therein, and the other of said first substrate and said second substrate having only one prismatic protrusion formed thereon, said indentation and said protrusion having inclined side surfaces forming said oblique surfaces.
- 2. The coupling component according to claim 1, wherein said second substrate is formed of a material having approximately the same coefficient of thermal expansion as said first substrate.
- 3. The coupling component according to claim 1, wherein said first substrate has a lower surface with grooves formed therein in which said optical waveguides are disposed, and said first substrate has an oblique polished surface flush with said coupling-side end surfaces.
- 4. The coupling component according to claim 3, wherein said first substrate has another polished surface, and said optical waveguides each have another end surface flush with said other polished surface.
- 5. The coupling component according to claim 1, wherein said first substrate has a polished surface, and said optical waveguides each have another end surface flush with said polished surface.
- 6. The coupling component according to claim 1, wherein said first substrate has a guide device aligned parallel with said given plane of said optical waveguides.
- 7. The coupling component according to claim 1, wherein said optical waveguides are formed by material placed in grooves, said material in said grooves having an index of refraction higher than an index of refraction of said synthetic material of said first substrate.
Priority Claims (1)
Number |
Date |
Country |
Kind |
197 09 842 |
Feb 1997 |
DE |
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CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation of copending International Application No. PCT/DE98/00588, filed Feb. 27, 1998, which designated the United States.
US Referenced Citations (4)
Foreign Referenced Citations (2)
Number |
Date |
Country |
0699931A1 |
Mar 1996 |
EP |
0713112A1 |
May 1996 |
EP |
Non-Patent Literature Citations (2)
Entry |
“Photonic Interconnections: More Bandwidth, Less Real Estate”, Eric R. Fossum, Photonics Spectra, May 1987, pp. 151-157. |
Japanese Patent Abstract No. 07162098 (Kazunori), dated Jun. 23, 1995. |
Continuations (1)
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Number |
Date |
Country |
Parent |
PCT/DE98/00588 |
Feb 1998 |
US |
Child |
09/386038 |
|
US |