| Daviet Et Al., “Electrostatic Clamping Applied to Semiconductor Plasma Processing-I. Theoretical Modeling, ” J. Electrochem. Soc., 140(11):3245-3256, Nov. 1993. |
| Daviet Et Al., “Electrostatic Clamping Applied to Semiconductor Plasma Processing-II. Experimental Results, ” J. Electrochem. Soc., 140(11):3256-3261, Nov. 1993. |
| Field, “Electrostatic wafer clamping for next-generation manufacturing,” Solid State Technology, pp. 91-98, Sep., 1994. |
| Hartsough, “Electrostatic Wafer Holding,” Solid State Technology, pp. 87-90, Jan., 1993. |
| Nakasuji Et Al., “Low voltage and high speed operating electrostatic wafer chuck using sputtered tantalum oxide membrane,” J. Vac. Sci. Technol. A, 12(5):2834-2839, Sep./Oct., 1994. |
| Seanor, “Triboelectrification Of Polymers,” in K.C. Frisch and A. Patsis, Electrical Properties of Polymers, Technomic Publications, Westport, CT, pp. 37-58. |
| Singer, “Electrostatic Chucks in Wafer Processing, ” Semiconductor International, pp. 57-64, Apr., 1995. |
| Watanabe Et Al., “Electrostatic Force and Absorption Current of Alumina Electrostatic Chuck,” J. Appl. Phys., 31(7):2145-2150, Jul., 1992. |
| Watanabe Et Al., “Electrostatic charge distribution in the dielectric layer of alumina electrostatic chuck,” Journal of Materials Science, 29:3510-3516, 1994. |
| Copy of International Search Report dated Jul. 16, 1997, from corresponding international application PCT/US97/05352. |