The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
The fuse cell 401 includes NAND gates I1 and I3, inverters I2 and I4, the fuse F1, a program switch SP, and a read switch SR. Wherein the material of the fuse F1 may be polysilicon or metal. The fuse F1 is coupled to the MOSFET Q1. The program switch is coupled between the fuse F1 and a voltage source GFUSE. The read switch SR has a first terminal coupled between the fuse F1 and the program switch SP and a second terminal coupled to the output terminal BL of the fuse cell 401. In the present embodiment, the program switch SP is implemented with a MOSFET NFUS, and the read switch SR is implemented with a MOSFET NSW.
In the present embodiment, the voltage level of the voltage source VFUSE is higher than the voltage level of the voltage source GFUSE. The program switch SP is turned on or off according to a program signal PROG. When both the MOSFET Q1 and the program switch SP are turned on, the current flowing from the voltage source VFUSE to the voltage source GFUSE causes the temperature of the fuse F1 to increase and the fuse F1 is melted.
The read switch SR is turned on or off according to a read signal READ. The read switch SR outputs the bit data stored in a junction BIT to the output terminal BL of the fuse cell 401 when the read switch SR is turned on. When the fuse F1 is not melted, the voltage source VFUSE pulls the junction BIT up to a high voltage level through the fuse F1 so that the read switch SR outputs 1. Contrarily, after the fuse F1 has been melted, the voltage source GFUSE pulls the junction BIT down to a low voltage level so that the read switch SR outputs 0.
In the embodiment illustrated in
It should be understood by those having ordinary skill in the art that the circuit design of fuse cell is not limited to the one illustrated in
In summary, a MOSFET is adopted for absorbing ESD pulse in an ESD protection circuit of the present invention, and since the MOSFET is easy to manufacture and the issue of determining the resistance of a resistor does not exist in the present invention, the disadvantages in conventional techniques can be avoided.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Number | Date | Country | Kind |
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95135746 | Sep 2006 | TW | national |