Claims
- 1. A heat fixing method comprising;
- imparting a toner image onto a recording medium, wherein a toner that forms said toner image comprises a binder resin and a colorant, wherein said binder resin contains a THF-insoluble component in an amount of less than 10 wt. % based on the binder resin, and, in the molecular weight distribution measured by GPC (gel permeation chromatography) of a THF-soluble component, has a weight average molecular weight/number average molecular weight (Mw/Mn) of .gtoreq.18, a molecular weight peak MA in the region of a molecular weight of from 3,000 to 20,000, a molecular weight peak MB in the region of a molecular weight of from 380,000 to 1,000,000, a molecular weight minimum Md in the region of a molecular weight of from 20,000 to 380,000, provided that MB/MA is in the range of from 30 to 150, and a molecular weight distribution curve area ratio SA:SB:Sd of 1:0.3 to 0.8:0.35 to 0.8 when the area of a molecular weight distribution curve of a molecular weight of from 400 to the Md is represented by SA, the area of a molecular weight distribution curve of a molecular weight of from the Md to 5,000,000 by SB, and the area of the region defined by a straight line connecting the apex A corresponding to the molecular weight peak MA and the apex B corresponding to the molecular weight peak MB and a molecular weight distribution curve by Sd; and
- heat-fixing said toner image to said recording medium by means of a heater element stationarily supported and a pressure member that stands opposite to said heat element in pressure contact and brings said recording medium into close contact with said heater element through a film interposed between them.
- 2. A heat fixing method according to claim 1, wherein said heater element has a temperature of from 100.degree. C. to 300.degree. C.
- 3. A heat fixing method according to claim 1, wherein said toner image is heated with a heater element having a temperature of from 100.degree. C. to 300.degree. C., through a film having a thickness of from 1 .mu.m to 100 .mu.m.
- 4. A heat fixing method according to claim 1, wherein said film has a heat resistance.
- 5. A heat fixing method according to claim 4, wherein said film comprises a layer formed of a polymer selected from the group consisting of polyimide, polyester, polyethylene terephthalate, a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, polytetrafluoroethylene and polyamide.
- 6. A heat fixing method according to claim 4, wherein said film comprises a layer formed of a metal.
- 7. A heat fixing method according to claim 4, wherein said film has at least one of a release layer and a low-resistance layer.
- 8. A heat fixing method according to claim 4, wherein said film comprises a layer of a polyimide film and a fluorine resin layer.
- 9. A heat fixing method according to claim 8, wherein said fluorine resin layer comprises a conductive material dispersed therein.
- 10. A heat fixing method according to claim 9, wherein said fluorine resin layer comprises polytetrafluoroethylene.
- 11. A heat fixing method according to claim 1, wherein said film is brought into pressure contact with said heater element by means of said pressure member under a total pressure of from 4 kg to 20 kg.
- 12. A heat fixing method according to claim 11, wherein said pressure member is provided with a pressure roller having a rubber elastic layer.
- 13. A heat fixing method according to claim 11, wherein said pressure member is provided with a pressure roller having an elastic layer formed of silicone rubber.
- 14. A heat fixing method according to claim 1, wherein said heater element is heated by applying to a resistance material a current with a pulse-like waveform.
- 15. A heat fixing method according to claim 1, wherein said heater element has a low heat capacitance and has a linear structure.
- 16. A heat fixing method according to claim 1, wherein said heater element is provided with a resistance material and a temperature sensor, and when the heater element temperature detected by the temperature sensor is T.sub.1, the surface temperature T.sub.2 of the film opposed to said resistance material is about 10.degree. C. to about 30.degree. C. lower than the temperature T.sub.1 and the surface temperature T.sub.3 of the film on the part at which the film is peeled from a fixed toner image is a temperature substantially equal to the temperature T.sub.2.
- 17. A heat fixing method according to claim 1, wherein said binder resin contains the THF-insoluble matter in an amount of not more than 5% by weight.
- 18. A heat fixing method according to claim 1, wherein said binder resin has an Mw/Mn of not less than 20.
- 19. A heat fixing method according to claim 1, wherein said binder resin has an Mw/Mn of from 25 to 60.
- 20. A heat fixing method according to claim 1, wherein said binder resin has a molecular weight peak MA in the region of a molecular weight of from 5,000 to 15,000, a molecular weight peak MB in the region of a molecular weight of from 450,000 to 900,000, a molecular weight minimum Md in the region of a molecular weight of from 30,000 to 300,000.
- 21. A heat fixing method according to claim 1, wherein said binder resin has an MB/MA of from 30 to 120.
- 22. A heat fixing method according to claim 1, wherein said binder resin has an MB/MA of from 40 to 100.
- 23. A heat fixing method according to claim 1, wherein said binder resin has a molecular weight peak other than the MA, in the region of a molecular weight of from 3,000 to 20,000.
- 24. A heat fixing method according to claim 1, wherein said binder resin has a molecular weight peak other than the MB, in the region of a molecular weight of from 380,000 to 1,000,000.
- 25. A heat fixing method according to claim 1, wherein said binder resin has a molecular weight minimum other than the Md, in the region of a molecular weight of from 20,000 to 380,000.
- 26. A heat fixing method according to claim 1, wherein said binder resin has a molecular weight distribution curve area ratio SA:SB:Sd of 1:0.3 to 0.7:0.4 to 0.7.
- 27. A heat fixing method according to claim 1, wherein said binder resin has a molecular weight distribution curve area ratio SA:SB:Sd of 1:0.3 to 0.6:0.5 to 0.7.
- 28. A heat fixing method according to claim 1, wherein said binder resin further comprises a release agent.
- 29. A heat fixing method according to claim 28, wherein said release agent is contained in an amount of from 0.1% by weight to 20% by weight based on the binder resin.
- 30. A heat fixing method according to claim 28, wherein said release agent is contained in an amount of from 1% by weight to 10% by weight based on the binder resin.
- 31. A heat fixing method according to claim 28, wherein said release agent has a number average molecular weight (Mn) of not more than 1,000, a weight average molecular weight (Mw) of not more than 2,500, an Mw/Mn of not more than 3, and a melting point of from 60.degree. to 120.degree. C.
- 32. A heat fixing method according to claim 28, wherein said release agent comprises a graft-modified wax, a low molecular weight polyethylene wax, a low-molecular weight ethylene-propylene copolymer, a low-molecular weight polypropylene wax or a paraffin wax.
- 33. A heat fixing method according to claim 28, wherein said release agent comprises a polyolefin wax graft-modified with an aromatic vinyl monomer, an unsaturated fatty acid or an unsaturated fatty acid ester.
- 34. A heat fixing method according to claim 33, wherein said graft-modified polyolefin wax has an Mn of not more than 1,000, an Mw of not more than 2,500, an Mw/Mn of not more than 3.0, and a melting point of from 60.degree. C. to 120.degree. C.
- 35. A heat fixing method according to claim 33, wherein said graft-modified polyolefin wax has an Mn of from 400 to 700, an Mw of from 700 to 1,500, an Mw/Mn of not more than 2.0, and a melting point of from 60.degree. C. to 100.degree. C.
- 36. A heat fixing method according to claim 33, wherein said graft-modified polyolefin wax has a graft component in an amount of from 0.1 part by weight to 100 parts by weight based on 100 parts by weight of the polyolefin.
- 37. A heat fixing method according to claim 33, wherein said graft-modified polyolefin wax has a graft component in an amount of from 1 part by weight to 50 parts by weight based on 100 parts by weight of the polyolefin.
- 38. A heat fixing method according to claim 33, wherein said graft-modified polyolefin wax has a melt viscosity of from 1 cps to 250 cps at a temperature of 160.degree. C.
- 39. A heat fixing method according to claim 1, wherein said release agent has an Mn of from 400 to 700, an Mw of from 500 to 1,500, an Mw/Mn of not more than 2.5, and a melting point of from 60.degree. C. to 100.degree. C. and is contained in an amount of from 1% by weight to 10% by weight based on the binder resin.
- 40. A heat fixing method according to claim 1, wherein said binder resin contains a styrene-acrylate copolymer low-temperature softening resin; a styrene-acrylate copolymer high-temperature softening resin; and a graft-modified polyolefin,
- said low-temperature softening resin having a weight average molecular weight (Mw) of from 5.0.times.10.sup.3 to 3.0.times.10.sup.4, a ratio of Mw to a number average molecular weight (Mn) (Mw/Mn) of not more than 3.0, a flow-out point in a flow tester of from 75.degree. C. to 90.degree. C., a softening point of from 80.degree. C. to 110.degree. C., and a glass transition point (Tg) of from 55.degree. C. to 65.degree. C. and being contained in said binder resin in an amount of not less than 65 wt. %;
- said high-temperature softening resin having a weight average molecular weight (Mw) of from 4.0.times.10.sup.5 to 1.5.times.10.sup.6, a ratio of Mw to a number average molecular weight (Mn) (Mw/Mn) of not more than 3.0, a flow-out point in a flow tester of from 110.degree. C. to 160.degree. C., a softening point of from 150.degree. C. to 230.degree. C., and a glass transition point (Tg) of not less than 55.degree. C.;
- said low-temperature softening resin and said high-temperature softening resin being in a proportion ranging from 50:50 to 90:10 in weight proportion; and said low-temperature softening resin being obtained by solution polymerization, said high-temperature softening resin being obtained by suspension polymerization, and both said low temperature- and said high temperature-softening resin being mixed in a solvent capable of dissolving both said resins; and said graft-modified polyolefin having a number average molecular weight (Mn) of not more than 1.0.times.10.sup.3, a weight average molecular weight (Mw) of not more than 2.5.times.10.sup.3, an Mw/Mn of not more than 3.0 and a melting point from 60.degree. C. to 120.degree. C.
Priority Claims (2)
Number |
Date |
Country |
Kind |
2-010340 |
Jan 1990 |
JPX |
|
2-011724 |
Jan 1990 |
JPX |
|
Parent Case Info
This application is a division of application Ser. No. 07/642,782 filed Jan. 18, 1991, now U.S. Pat. No. 5,135,833.
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Divisions (1)
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Number |
Date |
Country |
Parent |
642782 |
Jan 1991 |
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