1. Field of the Invention
This invention relates to photomultiplier tubes and in particular, to a microchannel plate photomultiplier tube that provides suppression of ions generated throughout the microchannel plate when the photomultiplier tube is in operation.
2. Description of the Related Art
During operation of a transmission-mode microchannel plate photomultiplier tube (MCP-PMT) positive ions are generated along the length of the MCP pores and are accelerated directly towards the photocathode, where they impact with significant energy. This phenomenon is termed “ion feedback” and is responsible to a significant degree for degradation of photocathode sensitivity and adversely affects the expected lifetime of the device. There are known techniques directed at reducing or eliminating the ion feedback effect that generally involve reducing the number of ions through the use of sophisticated materials engineering and/or vacuum processing. Alternatively, physical ion barriers formed in the MCP geometry and/or ion barrier films deposited on an external surface of the MCP have been used.
In a transmission-mode MCP-PMT, photons are detected by their absorption and the subsequent ejection of photoelectrons from a semi-transparent photocathode deposited on the vacuum side of a window. The photoelectrons are amplified by a factor of at least 103 by means of a secondary-electron cascade in one or more MCP's. The electrons emitted by the MCP are collected as charge pulses on a single or multi-segment anode. The operational principle of a PMT having a single MCP is illustrated in
MCP's are wafers containing millions of high aspect-ratio hollow channels, the walls of which have been treated to provide a desired electrical conductivity and a high probability of releasing secondary electrons. Generally, MCP's are made using leaded-glass, although the use of conformal thin-film coatings has more recently enabled MCP's to be fabricated using other substrate materials.
When an energetic primary particle such as a photoelectron strikes the wall of an MCP pore channel, it can release one or more secondary electrons. In MCP-PMTs this initial event is facilitated by (i) accelerating the photoelectron across a potential difference of at least 100 V and (ii) orienting the MCP pores at an angle relative to the wafer normal direction. The secondary electrons are accelerated down the length of the pore channel by a large electric field (˜106 V/m) until they strike the channel wall and liberate additional secondary electrons. This cascade process is repeated numerous times as illustrated in
Throughout the amplification process positive ions are also generated by electron-molecule collisions. Given the ultrahigh vacuum (UHV) conditions inside the MCP-PMT, direct ionization of residual gases is relatively unimportant and the ion generation occurs predominately by electron stimulated desorption (ESD) from the surfaces of the MCP pore channels. Inside the MCP pores the electric field is axial, so the ions generated can be accelerated out of the MCP back toward and into the photocathode where they adversely affect the lifetime of the device. For a typical MCP the ion yield increases exponentially along the length of the MCP pores in direct correlation with the electron density and as a result, there is an increasing distribution of higher energy ions originating nearer the output side of the MCP as illustrated in
A common method of minimizing ion feedback is to treat the MCP surfaces such that fewer ions are created during the multiplication process. At a minimum this is done through the use of UHV techniques involving extreme cleanliness in the handling and processing environments and extended bake-outs of the MCP at elevated temperature. Additionally, extensive operation of MCP's under UHV conditions before their assembly into the PMT allows the ESD process to “scrub” the MCP surfaces which also decreases the ion feedback rate. In addition, techniques that involve either conformally depositing on the MCP a film with desirable properties to minimize damaging ion feedback or functionalizing the MCP entirely through the use of conformal coatings of desired materials have been demonstrated in the art.
Complementing the ion-minimizing methods, one solution is to physically interrupt the ions while they are in transit towards the photocathode. Certain devices such as Gen III image intensifiers make use of a thin barrier film deposited over the input of the MCP that can ensure that energetic ions cannot reach the photocathode. However, that technique is not without drawbacks in complexity and in certain aspects of performance. Another physical-barrier technique is to arrange multiple MCPs in series with their pore channel directions staggered, such that the majority of ions are guaranteed to collide with the MCP channel surfaces. The most common configurations are termed “chevron” and “Z-stack” when using two or three plates, respectively. A chevron arrangement of MCPs is shown in
The PLANACON photon detector is a square-shaped, multi-anode MCP-PMT that is manufactured and sold by PHOTONIS USA Pennsylvania Inc., of Lancaster, Pa. The PLANACON photon detector is used for many photon detection applications where large detection areas are required. The unique format of the PLANACON detector makes it the largest detector areally of its type on the market and allows for many PLANACON detector units to be tiled together in order to form a larger image.
The problems associated with ion feedback in an MCP-PMT are solved to a large degree by a photomultiplier tube in accordance with the present invention. In accordance with one aspect of the present invention there is provided a photomultiplier tube that includes a photocathode having a first surface for receiving light and a second surface opposite the first surface from which electrons are emitted in response to light that is incident on the first surface. The photomultiplier also includes an electron multiplying device positioned in spaced relation to the photocathode. The electron multiplying device has an electron receiving side that faces the second surface of the photocathode and an electron emission side opposite the electron receiving side. The electron multiplying device is positioned such that the electron receiving side is located at a preselected distance from the second surface of the photocathode. A first electrode is operatively connected to the electron receiving side of the electron multiplying device. A second electrode is operatively connected to the electron emission side of the electron multiplying device. An ion suppression electrode is positioned between the photocathode and the electron multiplying device and spaced therefrom. The ion suppression electrode preferably includes a conductive grid. The photomultiplier according to the present invention further includes a source of electric potential connected to the second electrode and to the ion suppression electrode. The electric potential source is configured and adapted to provide a first voltage to the second electrode and a second voltage to the suppression grid electrode wherein the second voltage has a magnitude equal to or greater than the magnitude of the first voltage.
In accordance with another aspect of the present invention there is described a method of making a photomultiplier that provides suppression of ions. The method includes the steps of providing a photocathode having a first surface for receiving light and a second surface opposite the first surface from which electrons are emitted in response to light that is incident on the first surface and providing an electron multiplying device in spaced relation from the photocathode, wherein the electron multiplying device has an electron receiving side that faces the second surface of the photocathode and an electron emission side opposing the electron receiving side. The electron multiplying device is positioned such that the electron receiving side is located at a preselected distance from the second surface of said photocathode. The method according to this invention also includes the steps of providing an ion suppression electrode between the photocathode and the electron multiplying device. Preferably, the ion suppression electrode is formed as a grid. Further steps of the method include energizing the electron receiving surface of the electron multiplying device with a first voltage, energizing the electron emission surface of the electron multiplying device with a second voltage that is greater in magnitude than the first voltage, and energizing the suppression electrode with a third voltage having a magnitude that is equal to or greater than the magnitude of the second voltage.
In accordance with a further aspect of the present invention, there is disclosed a method of suppressing feedback ions in the photomultiplier described above.
The foregoing summary as well as the following detailed description will be better understood when read with reference to the several views of the drawing, wherein:
Referring now to the drawings and in particular to
Referring now to
A first contact or electrode 20 is connected to the input surface of first microchannel plate 17. A second contact or electrode 22 is connected to the output surface of second microchannel plate 18. Suitable leads or other terminals are connected to the first and second electrodes so that the electrodes can be connected to a source of electric voltage. A charge collecting anode 24 is positioned between the microchannel plate 18 and the base of the photomultiplier tube 10. The anode 24 may consist of a single electrode or multiple electrodes depending on the application in which the photomultiplier will be used. A suitable lead or leads are connected to the anode so that it can be connected to a signal analyzing instrument that converts the collected charges into signal that can be used to generate and/or display useful information.
In addition to the foregoing features, the photomultiplier tube 10 has an ion suppression electrode 16 that is positioned between the photocathode 14 and the first microchannel plate 17. The ion suppression electrode 16 includes a grid that is preferably formed of a material and in a configuration that results in sufficient rigidity that the electrode 16 maintains a substantially planar form. The ability to maintain a planar form is important because of the relatively wide viewing/imaging area that the electrode 16 covers. Too much sagging of the electrode 16 will adversely affect performance of the device and in extreme cases could result in a catastrophic short circuit when the device is in operation.
Referring now to
In the embodiment of
Referring to
It is also contemplated that the electric potential source 30 may include means for varying the magnitude of the voltage applied to the suppression electrode. Referring to
The operation of a photomultiplier tube with a properly biased, ion suppression grid electrode located between the photocathode and input of the MCP in accordance with the present invention can effectively prevent positive ions from reaching the photocathode. The reduction of positive ion impingement on the photocathode effectively improves (increases) the life cycle of the photocathode. As illustrated in
In order to demonstrate the effectiveness of the photomultiplier (PMT) according to the present invention in suppressing ion feedback, a prototype device was constructed and tested as described below. The prototype device was constructed in accordance with the description presented in this specification and as shown in
The window of the PMT was illuminated with a 35-picosecond width laser pulse that was filtered to single photoelectron intensity. The corresponding charge pulses were measured using a high-speed digitizing oscilloscope connected to the anode. On the occasion when a positive ion from the MCP stack was accelerated to the photocathode, electrons would be released from the photocathode resulting in an after-pulse that followed the primary photoelectron pulse in time. The total after-pulse occurrence rates were measured with the ion suppression grid energized at each of six different electric potentials starting at the same potential as the input of the MCP stack and increased in five increments up to the potential of the output surface of the MCP stack. Additionally, the late arrival time region containing large ion masses (i.e., ions having mass/charge>100 AMU) was separately analyzed and tabulated as such ions are presumed to be more damaging to the photocathode.
The results of the testing are shown in the table below including the electric potential of the ion suppression grid as a percentage of the electric potential at the Chevron MCP interface, the total raw after-pulsing rate in % per photoelectron, the total after-pulse rate normalized relative to the unsuppressed rate, the raw high mass after-pulsing rate in % per photoelectron, and the normalized high mass after-pulse rate. The Chevron MCP interface is defined as the plane where the upper and lower MCP's meet in the stacked arrangement.
The results reported in the table show a clear effect of the ion suppression grid in significantly reducing the rate of positive ions reaching the photocathode. The data show that ion suppression appears to level off when the suppression grid potential is about 80% or more of the Chevron MCP interface potential which verifies that ions are in fact originating deep in the MCP pores. The data represent a minimum expectation for ion feedback suppression because some of the after-pulses can be attributed to suppressed ions directly generating electrons by impinging on the input ends of the MCP pores. Another possible contribution of after-pulses may result from energetic neutral atoms or molecules that would not be affected by the suppression grid.
It will be recognized by those skilled in the art that changes or modifications may be made to the above-described embodiments without departing from the broad inventive concepts of the invention. It is understood, therefore, that the invention is not limited to the particular embodiments which are described, but is intended to cover all modifications and changes within the scope and spirit of the invention as described above and set forth in the appended claims.
This application claims the benefit of U.S. Provisional Application No. 61/831,808, filed Jun. 6, 2013, the entirety of which is incorporated herein by reference.
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Number | Date | Country | |
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20140361683 A1 | Dec 2014 | US |
Number | Date | Country | |
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61831808 | Jun 2013 | US |