Claims
- 1. A process for preparing an embossed, laminated picture frame molding comprising the steps of:providing an elongate, picture frame molding substrate having a desired cross-sectional profile; laminating a wrap about at least a portion of the profile of the substrate using a coating consisting essentially of a liquid adhesive, the wrap having paper as a maior component; and embossing a pattern on at least a portion of the laminated portion of the substrate while the liquid adhesive remains in a liquid condition to cause the liquid adhesive to move into raised portions of the embossed pattern to support and enhance the embossed pattern.
- 2. The process of claim 1 wherein the substrate is selected from the group consisting of wood, MDF, metal, and plastic moldings.
- 3. The process of claim 1 comprising the additional step of controlling the depth of the embossing.
- 4. The process of claim 3 wherein the controlling step comprises moving an embossing wheel under pressure against the laminated substrate.
- 5. The process of claim 3 comprising the additional step of limiting the depth of embossing.
- 6. The process of claim 5 wherein the limiting step is accomplished by providing a mechanical stop.
- 7. The process of claim 5 wherein the limiting step is accomplished by an electromechanical limit switch.
- 8. The process of claim 5 wherein the limiting step is accomplished by a photoelectric limit switch.
- 9. The process of claim 5 wherein the limiting step is accomplished by a proximity switch.
- 10. The process of claim 1 wherein at least two spaced apart areas of the laminated substrate are embossed simultaneously.
- 11. The process of claim 1 wherein at least two spaced apart areas of the laminated substrate are embossed sequentially.
CROSS-REFERENCES TO RELATED APPLICATIONS , IF ANY
This is a Divisional application of U.S. application Ser. No. 08/670,329, filed on Jun. 25, 1996, now abandoned.
US Referenced Citations (11)