Claims
- 1-40. (canceled).
- 41. A process for creating an encapsulated electrophoretic element having a plurality of capsules disposed on a substrate in substantially a single layer, the process comprising the steps of:
(a) providing the capsules; (b) mixing the capsules with a binder to create a capsule/binder mixture; (c) coating the capsule/binder mixture onto an at least partially conductive substrate, thereby to create a film comprising the capsules in substantially a single layer; and (d) curing the capsule/binder mixture.
- 42. The process of claim 41 wherein the binder is selected from the group consisting of acrylic, urethane, and poly(vinyl alcohol).
- 43. The process of claim 41 wherein the binder comprises a polymer latex.
- 44. The process of claim 41 wherein a fraction of the binder is capable of evaporating and the step of curing the mixture comprises evaporating the fraction of the binder.
- 45. The process of claim 41 wherein the substrate comprises an indium tin oxide sputtered polyester film.
- 46. The process of claim 41 wherein at least one of the capsules contains a plurality of particles dispersed in a suspending fluid.
- 47-49. (canceled).
- 50. The process of claim 41 wherein the coating step comprises applying pressurized gas to the capsule/binder mixture, thereby to cause deposition of the capsule/binder mixture onto the substrate such that the capsules are disposed on the substrate in substantially a single layer.
- 51. The process of claim 50 further comprising heating the pressurized gas to a temperature higher than an ambient temperature prior to applying the pressurized gas to the capsule/binder mixture.
- 52. The process of claim 50 further comprising cooling the pressurized gas to a temperature lower than an ambient temperature prior to applying the pressurized gas to the capsule/binder mixture.
- 53. The process of claim 50 further comprising adding a liquid to the pressurized gas.
- 54. The process of claim 53 wherein the liquid comprises at least one droplet.
- 55. The process of claim 53 wherein the liquid comprises an organic solvent.
- 56. The process of claim 55 wherein the organic solvent comprises an alcohol.
- 57. The process of claim 50 wherein the coating step comprises applying the pressurized gas with an air knife.
- 58. The process of claim 50 wherein the pressurized gas is applied from a distance of about 1 cm to about 15 cm from the surface of the capsule/binder mixture.
- 59. The process of claim 50 wherein the pressurized gas is applied at an angle of from 0 degrees to 90 degrees from the surface of the conductive substrate.
- 60-65. (canceled).
- 66. The process of claim 41 wherein the coating step comprises coating at least some of the capsules onto the substrate through a coating head comprising a slot die coating head.
- 67. The process of claim 66 wherein a width of a slot of the slot die coating head is between about 1 and about 2.5 times the mean diameter of the capsules.
- 68. (canceled).
- 69. The process of claim 41 further comprising laminating the film with a rear substrate.
- 70. The process of claim 69 wherein a layer of material is disposed between the film and the rear substrate.
- 71. The process of claim 70 wherein the layer of material is associated with the rear substrate prior to laminating.
- 72. The process of claim 70 wherein the layer of material is associated with the film prior to laminating.
- 73. The process of claim 69 wherein heating occurs during the step of laminating.
- 74. The process of claim 69 wherein pressurizing occurs during the step of laminating.
- 75. The process of claim 69 wherein evacuating of a gas occurs during the step of laminating.
- 76. The process of claim 70 wherein the layer of material comprises an insulator.
- 77. The process of claim 70 wherein the layer of material comprises a conductor.
- 78. The process of claim 70 wherein the layer of material comprises a semiconductor.
- 79. The process of claim 70 wherein the layer of material is in a liquid state during at least a portion of the laminating step.
- 80. The process of claim 70 wherein the layer of material comprises the binder.
- 81. The process of claim 70 wherein the step of laminating produces a stratum comprising the capsules, the binder, and the layer of material and having at least one substantially planar side proximate the rear substrate.
- 82. The process of claim 70 wherein the step of laminating produces a stratum comprising the capsules, the binder, and the layer of material, the stratum being substantially free from voids.
- 83. The process of claim 70 wherein the layer of material has a thickness of less than or equal to about 50 μm.
- 84-91. (canceled).
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims priority to and the benefit of U.S. provisional patent application Ser. No. 60/103,398, filed Oct. 7, 1998 and U.S. provisional patent application Ser. No. 60/118,794, filed Feb. 4, 1999. The entire disclosure of each of these provisional patent applications is incorporated herein by reference.
GOVERNMENT RIGHTS
[0002] This invention was made with Government support under Agreement No. DAAN02-98-3-0004, awarded by SSCOM. The Government has certain rights in the invention.
Provisional Applications (33)
|
Number |
Date |
Country |
|
60103398 |
Oct 1998 |
US |
|
60118794 |
Feb 1999 |
US |
|
60083252 |
Apr 1998 |
US |
|
60057133 |
Aug 1997 |
US |
|
60057716 |
Aug 1997 |
US |
|
60057799 |
Aug 1997 |
US |
|
60057163 |
Aug 1997 |
US |
|
60057122 |
Aug 1997 |
US |
|
60057798 |
Aug 1997 |
US |
|
60057118 |
Aug 1997 |
US |
|
60059358 |
Sep 1997 |
US |
|
60065630 |
Nov 1997 |
US |
|
60065605 |
Nov 1997 |
US |
|
60066147 |
Nov 1997 |
US |
|
60066245 |
Nov 1997 |
US |
|
60066246 |
Nov 1997 |
US |
|
60066115 |
Nov 1997 |
US |
|
60066334 |
Nov 1997 |
US |
|
60066418 |
Nov 1997 |
US |
|
60071371 |
Jan 1998 |
US |
|
60070940 |
Jan 1998 |
US |
|
60072390 |
Jan 1998 |
US |
|
60070939 |
Jan 1998 |
US |
|
60070935 |
Jan 1998 |
US |
|
60074454 |
Feb 1998 |
US |
|
60076955 |
Mar 1998 |
US |
|
60076959 |
Mar 1998 |
US |
|
60076957 |
Mar 1998 |
US |
|
60076978 |
Mar 1998 |
US |
|
60078363 |
Mar 1998 |
US |
|
60083252 |
Apr 1998 |
US |
|
60085096 |
May 1998 |
US |
|
60093689 |
Jul 1998 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09413444 |
Oct 1999 |
US |
Child |
10851706 |
May 2004 |
US |
Continuation in Parts (2)
|
Number |
Date |
Country |
Parent |
09300585 |
Apr 1999 |
US |
Child |
10851706 |
May 2004 |
US |
Parent |
09141105 |
Aug 1998 |
US |
Child |
09413444 |
|
US |