Patent Application
20070019386
The present invention relates to semiconductor thermal transfer, moreover microprocessor cooling.
The advent of the modern electronics is analogous with computers. The birth of the microprocessor in the 1970's lead to the creation of the modern desktop computer. At its initial creation the Central Processing Unit of the time was a basic mathematical calculating device. With technological growth in the 1980's the first's personal computers came of age, with them faster and more complex microprocessors. With skillful marketing and technology allowing consumers access to computers, micro processing capabilities would be forced to new heights. The initial processing was 4-bit, then came the 8-bit, 16-bit, which has mature to the modern 32-bit processing units. With this eventual growth the microprocessor has mature into a very complex very large scale integration device.
With exceptional growth in software, hardware, and the internet, the demands force on a processing unit are ever more demanding. This accelerated growth has lead to high heat dissipation from microprocessor force to processes millions even billions of calculations per second. Heat emitted by the microprocessor has become a problem forcing manufactures to device solutions. Heat accumulation has lead to thermal conductivity in and around the working parameter of the microprocessor. This has lead to software problems as heat accumulation deters processing abilities to work. The energy consume in today's CPU's is more than a modern light bulb. The energy consume is reradiated back into its surrounding areas by means of conduction, convection, and eventually through radiation.
Various methods for cooing a microprocessor has lead to the use of fanning, heat sinks, and combination of both. The use of heat sinks is a practical method of permitting heat to sink through a metallic arrangement. The heat emitted by the CPU is transfer by means of conductivity through the heat sink. Although the most common approach to transfer heat emitted by a CPU, the use of placing a heat sink on top of a CPU does not receives all the heat emitted by a CPU. The use of fanning is a practical approach widely use. Small fans force cool air throughout the system and into the pathway of the CPU. Even with the use of fans to actively force heat away from the source they nonetheless emit only the heat transfer into the heat sink, and not all the heat created by the CPU. The use of both heat sinks and fans together is the common way for keeping a microprocessor cool, or at room temperature.
Other approaches to other than fanning and heat sink use are the use of solutions, fluids, and eventual air conditioned air. The use of solutions is commonly use in juncture with heat sinks, whereby the solution creates a medium of heat transfer for the upper section of the CPU and a heat sink. Even with high efficient heat transfer qualities of solutions, they nevertheless form a very limited role in heat dissipation. Apart from this method the use of control liquid transfer from a radiator type heat sink to another looping device is another suitable approach. Although the use of liquids to transfer heat is not a novel idea, a possible leak can be disastrous to surrounding working electronics.
The eventual continual growth of microprocessor capabilities clearly dictates parallel growth in heat dissipation problems. The newly introduction of 64-bit microprocessor's into the consumer market is an indication of higher energy consumption by CPU's. Even with designing ducts, heat sinks, fans, the previous approaches mention will become obsolete or shrink in percentage in approach of heat extraction. Forthcoming microprocessor technologies emphasis new approaches in heat extraction capabilities.
The present invention is an improvement of modern central processor unit heat sink. The present invention overcomes an often left out objective of present day use of metallic heat sinks use in the extraction of accumulated heat energy of a central processor. As with other heat sinks the present invention extracts heat from the processor by conduction of heat energy from the upper part of central processor chip housing. This surface area is the usual target area of heat extraction. Although employing the same thermal mechanics use previously the present invention further emphasizes the use of the ceramic side housing that houses the microchip. The square area on a modern central processing unit can be from 10% to 15% of the area in proportion to the upper section housing.
The application of the use of a heat sink encompassing the side of a microprocessor aids in the further extraction of heat energy from a processing unit, by means of conduction, convection, and radiation as well. The use of the present invention further advances the thermal heat extraction efficiency by employing the use of side heat extraction design on a heat sink. This mechanism employs the means of extracting an additional thermal conductivity by means of conduction. The conducting matter of the heat sink draws in heat energy that would otherwise prolong in and around the central processor unit. Furthermore employment of side heat extraction lessens the convective energy to stay resident. Thereby the heat energy otherwise staying resident does not move by means of convection onto the surrounding areas of the CPU. As with matter that sustains heat energy, furthermore the resiliency of the working mechanics of the heat sink lessens also the movement of heat energy by means of radiation. Since the air is constantly moving throughout the surrounding areas of the CPU close components inside the computer are susceptible of receiving radiation heat energy.
Furthermore the use of a more efficient heat sink lessens the inefficiency of software working parameters. The ability of the operating system as well as applications are dependent on the CPU, the microprocessor must work in optimal efficiency. By working cooler the microprocessor is thereby able to execute orders and operations requested by the computer operating system and applications as well. By working in a more efficient manner the software applications allow requests and executions which are time sensitive to some applications.
Furthermore the more heat the heat sink is able to extract the less heat energy stays resident in the CPU. The fewer struggles the microprocessor does in executing orders and requests from open applications. Thereby the operating system and open software applications are able to make hardware to operate to OEM specifications. By working to OEM specifications hardware devices execute operations close to specifications. This includes hardware such as monitor, drives, video and audio cards, besides other devices which consumers and businesses integrate into their systems.
Furthermore the more heat energy the heat sink is able to extract and the less heat energy stays resident the operating system and applications are able to execute orders and requests. This includes and is not limited to connected and interconnected devices to a computer. This includes such devices as printers, scanners, plotters, other computers, internet, modems, radio devices, multimedia devices . . . therefore the more heat is extracted by the heat sink the less struggle is enforce to the CPU, thereby collaborate with connected and interconnected devices up to OEM specification.
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