TREA

Cooling facilitated by shape of device

Follow

Industry

  • CPC
  • H01L23/367
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/367Cooling facilitated by shape of device
Industries