Cooling facilitated by shape of device

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H01L23/367

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/367Cooling facilitated by shape of device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Antenna in package having antenna on package substrate
- Patent number 12,322,856
- Issue date Jun 3, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic power module using polymer p...
- Patent number 12,322,604
- Issue date Jun 3, 2025
- SAFRAN
- Baptiste Joël Christian Fedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and semiconductor manufacturing pro...
- Patent number 12,322,672
- Issue date Jun 3, 2025
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems for a heat exchanger with a biasing bracket and mounting plate
- Patent number 12,317,457
- Issue date May 27, 2025
- Dana Canada Corporation
- Andrei Catuneanu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor structure having heat dissipation structure
- Patent number 12,315,774
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package with an integrated heat sink
- Patent number 12,315,776
- Issue date May 27, 2025
- Analog Devices, Inc.
- Michael John Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with a ring-shaped hot spot area and multidirect...
- Patent number 12,315,783
- Issue date May 27, 2025
- Google LLC
- Madhusudan Krishnan Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,315,795
- Issue date May 27, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 12,308,364
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive chamber with stiffening structure for thermal...
- Patent number 12,309,966
- Issue date May 20, 2025
- Intel Corporation
- Jin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TEC-embedded dummy die to cool the bottom die edge hotspot
- Patent number 12,308,299
- Issue date May 20, 2025
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and powe...
- Patent number 12,308,304
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Kei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-board computer with interposer on the microprocessor chip
- Patent number 12,306,682
- Issue date May 20, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Christophe Poilvet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Magnetically secured semiconductor chip package loading assembly
- Patent number 12,309,933
- Issue date May 20, 2025
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics module
- Patent number 12,309,981
- Issue date May 20, 2025
- ZF Friedrichshafen AG
- Manuel Raimann
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device manufacturing method and molding press machine
- Patent number 12,308,260
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Kiyohiro Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power semiconductor devices
- Patent number 12,300,678
- Issue date May 13, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,300,624
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Densely packed electronic systems
- Patent number 12,302,497
- Issue date May 13, 2025
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 12,300,632
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid metal foam thermal interface material
- Patent number 12,300,567
- Issue date May 13, 2025
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 12,300,689
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with good thermal dissipation performance
- Patent number 12,300,566
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency heat dissipation using discrete thermal interface m...
- Patent number 12,300,568
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integrated multi-chip cooler module
- Patent number 12,300,577
- Issue date May 13, 2025
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor structure with package substrate
- Patent number 12,293,964
- Issue date May 6, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hailin Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...
- Publication number 20250174521
- Publication date May 29, 2025
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module, Manufacturing Method, and Electronic Device
- Publication number 20250174512
- Publication date May 29, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Gaojie Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEM FOR ADDITIVE MANUFACTURED SEMICONDUCTOR PACKAGIN...
- Publication number 20250174570
- Publication date May 29, 2025
- Advanced Printed Electronic Solutions LLC
- Richard Neill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250174539
- Publication date May 29, 2025
- nD-HI Technologies Lab, Inc.
- HO-MING TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid State Switching Power Module with Improved Current Rating
- Publication number 20250174610
- Publication date May 29, 2025
- ABB Schweiz AG
- Francisco Canales
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT DISSIPATION STR...
- Publication number 20250174510
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE COOLING MECHANISM AND SUBSTRATE...
- Publication number 20250174511
- Publication date May 29, 2025
- NEC Corporation
- Junichi Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THREE-DIMENSIONAL FAN-OUT PACKAGE STRUCTURE AND PREPARATIO...
- Publication number 20250174565
- Publication date May 29, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD.
- Wei ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES FORMED USING RDL-LAST PROCESS
- Publication number 20250167173
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC PACKAGES
- Publication number 20250167185
- Publication date May 22, 2025
- NXP USA, Inc.
- Sharan Kishore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR ON-CHIP HEAT ROUTING ARCHITECTURES
- Publication number 20250167064
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Radwanul Hasan SIDDIQUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A RADIATIVE NANOMATERIAL PACKAGE ARCHITECTURE
- Publication number 20250167069
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Radwanul Hasan SIDDIQUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE
- Publication number 20250167074
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE HAVING HIGH THERMAL DISSIPATION COMPRISI...
- Publication number 20250167100
- Publication date May 22, 2025
- STMicroelectronics International N.V.
- Cristiano Gianluca STELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE
- Publication number 20250168972
- Publication date May 22, 2025
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES
- Publication number 20250167066
- Publication date May 22, 2025
- Hyundai Motor Company
- Nam Sik KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDIE FLIP CHIP PACKAGE WITH HEAT SINK
- Publication number 20250167067
- Publication date May 22, 2025
- STMicroelectronics International N.V.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250167138
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DETERMINING INTERFACE SHAPE OF HEAT DISSIP...
- Publication number 20250167070
- Publication date May 22, 2025
- Beijing Zitiao Network Technology Co., Ltd.
- Pengbo Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING POWER SEMICO...
- Publication number 20250167073
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Yasuyuki SANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE AND METHOD OF MANUFACTURING THE MEMORY MODULE
- Publication number 20250167068
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jinkyu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...
- Publication number 20250167072
- Publication date May 22, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...
- Publication number 20250157862
- Publication date May 15, 2025
- NXP B.V.
- Yu Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE HEAT-DISSIPATION PACKAGE STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20250157873
- Publication date May 15, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Ting-An Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157892
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Takahiro KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157874
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
- Publication number 20250157876
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250157941
- Publication date May 15, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250157947
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Cooling facilitated by shape of device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Antenna in package having antenna on package substrate

Method for manufacturing an electronic power module using polymer p...

Semiconductor package structure and semiconductor manufacturing pro...

Systems and methods for data recorder for inverter for electric veh...

Systems and methods for an interlocking feature on a power module

Systems for a heat exchanger with a biasing bracket and mounting plate

Semiconductor structure having heat dissipation structure

Integrated device package with an integrated heat sink

Integrated circuit with a ring-shaped hot spot area and multidirect...

Semiconductor structure and manufacturing method thereof

Power module package for direct cooling multiple power modules

Thermally conductive chamber with stiffening structure for thermal...

TEC-embedded dummy die to cool the bottom die edge hotspot

Semiconductor device and method of manufacturing the same, and powe...

On-board computer with interposer on the microprocessor chip

Magnetically secured semiconductor chip package loading assembly

Power electronics module

Semiconductor device manufacturing method and molding press machine

Package for power semiconductor devices

Electronic device

Backside contact for thermal displacement in a multi-wafer stacked...

Densely packed electronic systems

Semiconductor device having a heat dissipation structure connected...

Chip package with lid

Solid metal foam thermal interface material

Dual cool power module with stress buffer layer

Integrated chip with good thermal dissipation performance

High efficiency heat dissipation using discrete thermal interface m...

Heterogeneous integrated multi-chip cooler module

Package substrate and semiconductor structure with package substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

Power Module, Manufacturing Method, and Electronic Device

METHODS AND SYSTEM FOR ADDITIVE MANUFACTURED SEMICONDUCTOR PACKAGIN...

3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF

Solid State Switching Power Module with Improved Current Rating

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT DISSIPATION STR...

METHOD FOR MANUFACTURING SUBSTRATE COOLING MECHANISM AND SUBSTRATE...

EMBEDDED THREE-DIMENSIONAL FAN-OUT PACKAGE STRUCTURE AND PREPARATIO...

PACKAGES FORMED USING RDL-LAST PROCESS

STACKED ELECTRONIC PACKAGES

SYSTEM AND METHODS FOR ON-CHIP HEAT ROUTING ARCHITECTURES

SYSTEM AND METHODS FOR A RADIATIVE NANOMATERIAL PACKAGE ARCHITECTURE

PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE

PACKAGED ELECTRONIC DEVICE HAVING HIGH THERMAL DISSIPATION COMPRISI...

ELECTRONIC COMPONENT MOUNTING SUBSTRATE

POWER MODULES

MULTIDIE FLIP CHIP PACKAGE WITH HEAT SINK

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

METHOD AND APPARATUS FOR DETERMINING INTERFACE SHAPE OF HEAT DISSIP...

POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING POWER SEMICO...

MEMORY MODULE AND METHOD OF MANUFACTURING THE MEMORY MODULE

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...

SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...

DUAL-SIDE HEAT-DISSIPATION PACKAGE STRUCTURE AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE FOR HEAT DISSIPATION

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME