Cooling facilitated by shape of device

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H01L23/367

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/367Cooling facilitated by shape of device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 12,368,085
- Issue date Jul 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 12,369,381
- Issue date Jul 22, 2025
- Rohm Co., Ltd.
- Takaaki Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 12,368,148
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,368,083
- Issue date Jul 22, 2025
- Denso Corporation
- Hiroshi Ukegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting base and electronic device
- Patent number 12,362,254
- Issue date Jul 15, 2025
- Kyocera Corporation
- Kouichirou Sugai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,362,266
- Issue date Jul 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including direct-contact heat paths and methods of manufa...
- Patent number 12,362,255
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,362,274
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for driving power devices
- Patent number 12,363,819
- Issue date Jul 15, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Lifeng Qiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package structure
- Patent number 12,362,256
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, semiconductor apparatus, and vehicle
- Patent number 12,362,257
- Issue date Jul 15, 2025
- Fuji Electric Co., Ltd.
- Masahide Kamiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for fabrication of MMIC and RF devices on engineered substr...
- Patent number 12,362,296
- Issue date Jul 15, 2025
- QROMIS, Inc.
- Ozgur Aktas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with ball grid array connection having improv...
- Patent number 12,362,307
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,354,927
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sandwich structure power supply module
- Patent number 12,356,550
- Issue date Jul 8, 2025
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly, electronic device, and preparation method of...
- Patent number 12,354,967
- Issue date Jul 8, 2025
- Huawei Technologies Co., Ltd.
- Zhaozheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with external power sensor
- Patent number RE50485
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Juergen Hoegerl
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,354,929
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing
- Patent number 12,354,938
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,354,928
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method for manufacturing the same
- Patent number 12,354,926
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,355,009
- Issue date Jul 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion apparatus
- Patent number 12,349,323
- Issue date Jul 1, 2025
- PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
- Shinya Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with flipped high bandwidth memory device
- Patent number 12,347,780
- Issue date Jul 1, 2025
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,347,793
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fractal heat transfer device
- Patent number 12,345,479
- Issue date Jul 1, 2025
- FRACTAL HEATSINK TECHNOLOGIES LLC
- Alexander I Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of fabricating a conductive layer on an IC using non-lithogr...
- Patent number 12,347,800
- Issue date Jul 1, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Ken Williamson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION COMPONENT WITH ANISOTROPIC HEAT CONDUCTION AND MET...
- Publication number 20250236776
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chieh Yang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT SINK WITH HEAT PIPE HANDLE PORTION
- Publication number 20250239503
- Publication date Jul 24, 2025
- ZT Group Int’l, Inc. dba ZT Systems
- Sruti Chigullapalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250239568
- Publication date Jul 24, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...
- Publication number 20250239522
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20250239528
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250239534
- Publication date Jul 24, 2025
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MEMORY
- Publication number 20250240977
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- CHI WOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250239506
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE
- Publication number 20250233041
- Publication date Jul 17, 2025
- MIBA SINTER AUSTRIA GMBH
- Jürgen BAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERTER
- Publication number 20250233080
- Publication date Jul 17, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Shibo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233056
- Publication date Jul 17, 2025
- Mitsubishi Electric Corporation
- Hongbo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20250233057
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250233040
- Publication date Jul 17, 2025
- MEDIATEK INC.
- Sang-Mao CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250233038
- Publication date Jul 17, 2025
- United Microelectronics Corp.
- Tsung-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250233083
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE
- Publication number 20250233032
- Publication date Jul 17, 2025
- Power Master Semiconductor Co., Ltd.
- Ki-Myung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20250233039
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COOLING DEVICE
- Publication number 20250229328
- Publication date Jul 17, 2025
- MIBA SINTER AUSTRIA GMBH
- Manuel POHN
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226283
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Wooseup HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20250226323
- Publication date Jul 10, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY WITH BACK PLATE COMPRESSION
- Publication number 20250226280
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226374
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Yongbum Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AREA EFFECTIVE HEAT SINK
- Publication number 20250226279
- Publication date Jul 10, 2025
- MURATA MANUFACTURING CO., LTD.
- Saloni Chaurasia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250226281
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250226332
- Publication date Jul 10, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENVIRONMENTAL SEALING FOR ELECTRONICS CHIP PACKAGE SOCKETS
- Publication number 20250218909
- Publication date Jul 3, 2025
- Intel Corporation
- Donald Tiendung TRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250218890
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE
- Publication number 20250221310
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...
- Publication number 20250218914
- Publication date Jul 3, 2025
- INFINEON TECHNOLOGIES AG
- Hao ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS

Cooling facilitated by shape of device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integration of semiconductor device assemblies with thermal dissipa...

Systems and methods for power module for inverter for electric vehicle

Semiconductor device

Info packages including thermal dissipation blocks

Package structure and manufacturing method thereof

Semiconductor device

Electronic component mounting base and electronic device

Low stress asymmetric dual side module

Apparatus including direct-contact heat paths and methods of manufa...

Package structure and method of forming the same

System for driving power devices

3D semiconductor memory device and structure

Method for forming semiconductor package structure

Semiconductor module, semiconductor apparatus, and vehicle

Systems for fabrication of MMIC and RF devices on engineered substr...

Semiconductor package with ball grid array connection having improv...

Semiconductor device

Sandwich structure power supply module

Chip package assembly, electronic device, and preparation method of...

Semiconductor module with external power sensor

Package structure and manufacturing method thereof

Semiconductor package and methods of manufacturing

Semiconductor device and manufacturing method thereof

Package and method for manufacturing the same

Low stress asymmetric dual side module

Power conversion apparatus

Integrated circuit package with flipped high bandwidth memory device

Semiconductor package

Fractal heat transfer device

Method of fabricating a conductive layer on an IC using non-lithogr...

Patents Applicationslast 30 patents

HEAT DISSIPATION COMPONENT WITH ANISOTROPIC HEAT CONDUCTION AND MET...

HEAT SINK WITH HEAT PIPE HANDLE PORTION

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

ELECTRONIC DEVICE

HIGH BANDWIDTH MEMORY

SEMICONDUCTOR MODULE

COOLING DEVICE

POWER MODULE AND POWER CONVERTER

SEMICONDUCTOR DEVICE

JOINING STRUCTURE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE

METHOD OF FABRICATING PACKAGE STRUCTURE

METHOD FOR PRODUCING A COOLING DEVICE

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

PACKAGE ASSEMBLY WITH BACK PLATE COMPRESSION

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

AREA EFFECTIVE HEAT SINK

SEMICONDUCTOR DEVICE

MICROELECTRONIC ASSEMBLIES

ENVIRONMENTAL SEALING FOR ELECTRONICS CHIP PACKAGE SOCKETS

INTEGRATED CIRCUIT PACKAGES AND METHODS

ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE

PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...