The present disclosure relates to the field of heat transfer components, in particular the field of heat pipes.
Because the heat generated by electronic components can be significant and can impair the components' performance, it has been recognized that it is necessary to transport that heat away from the heat-generating component. Existing methods of doing so, are limited in their capabilities, which in turn imposes design constraints on electronic products, as the products cannot include components that generate more heat than can be removed by existing heat transfer components. Accordingly, there is a long-felt need in the art for heat transfer components that feature enhanced performance.
In meeting the described long-felt needs, the present disclosure provides heat transfer components, comprising: a sealed enclosure, the sealed enclosure having within a cavity having a first part, a second part, and a third part, the first part of the cavity being configured to receive heat from a heat source and the third part of the cavity being configured to deliver heat received from the heat source; a fluid disposed within the cavity; a wick disposed within the enclosure, the wick being in fluid communication with the fluid and also with at least the first part of the cavity and the third part of the cavity of the cavity, and the wick being capable of transporting fluid (a) between the first part of the cavity and the third part of the cavity, (b) between the third part of the cavity and the first part of the cavity, or both (a) and (b); and a first sealed evacuated space defined between two walls disposed between the second part of the cavity and the environment exterior to the heat transfer component.
Also provided are methods, comprising: with a heat transfer component according to the present disclosure, transferring with the heat transfer component heat that is received from a heat source.
Further provided are methods, comprising with a heat transfer component according to the present disclosure, exposing the heat component to heat from a heat source so as to vaporize fluid within the first part of the cavity, to effect condensation of the fluid within the third part of the cavity, and to effect transport of the condensed fluid along the wick from the third part of the cavity to the first part of the cavity.
Additionally provided are heat transfer components, comprising: a tubular enclosure, the tubular enclosure having within a sealed annular cavity, the sealed annular cavity having a first part, a second part, and a third part; a fluid disposed within the sealed annular cavity; and a wick disposed within the sealed annular cavity, the wick being in fluid communication with the fluid and the wick being capable of transporting fluid (a) between the first part of the cavity and the third part of the cavity, (b) between the third part of the cavity and the second part of the cavity, or both (a) and (b); and a first sealed evacuated space disposed between the second part of the cavity and the environment exterior to the heat transfer component.
Further provided are methods, comprising: with a heat transfer component according to the present disclosure, transferring with the heat transfer component heat that is received from a heat source.
Also disclosed are methods, comprising with a heat transfer component according to the present disclosure, exposing the heat component to heat from a heat source so as to vaporize fluid within the first part of the cavity, to effect condensation of the fluid within the third part of the cavity, and to effect transport of the condensed fluid along the wick from the third part of the cavity to the first part of the cavity.
In the drawings, which are not necessarily drawn to scale, like numerals may describe similar components in different views. Like numerals having different letter suffixes may represent different instances of similar components. The drawings illustrate generally, by way of example, but not by way of limitation, various aspects discussed in the present document. In the drawings:
The present disclosure may be understood more readily by reference to the following detailed description taken in connection with the accompanying figures and examples, which form a part of this disclosure. It is to be understood that this invention is not limited to the specific devices, methods, applications, conditions or parameters described and/or shown herein, and that the terminology used herein is for the purpose of describing particular embodiments by way of example only and is not intended to be limiting of the claimed invention.
Also, as used in the specification including the appended claims, the singular forms “a,” “an,” and “the” include the plural, and reference to a particular numerical value includes at least that particular value, unless the context clearly dictates otherwise. The term “plurality”, as used herein, means more than one. When a range of values is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about,” it will be understood that the particular value forms another embodiment. All ranges are inclusive and combinable, and it should be understood that steps may be performed in any order.
It is to be appreciated that certain features of the invention which are, for clarity, described herein in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention that are, for brevity, described in the context of a single embodiment, may also be provided separately or in any subcombination. All documents cited herein are incorporated herein in their entireties for any and all purposes.
Further, reference to values stated in ranges include each and every value within that range. In addition, the term “comprising” should be understood as having its standard, open-ended meaning, but also as encompassing “consisting” as well. For example, a device that comprises Part A and Part B may include parts in addition to Part A and Part B, but may also be formed only from Part A and Part B.
Figures
The attached non-limiting figures illustrate certain aspects of the disclosed technology.
Without being bound to any particular theory, a heat transfer component can operate by utilizing thermal conductivity and phase transition to effectively transfer heat between two solid interfaces. At the hot interface of a heat pipe a liquid in contact with a thermally conductive solid surface turns into a vapor by absorbing heat from that surface. The vapor then travels along the heat pipe to the cold interface and condenses back into a liquid—releasing the latent heat. The liquid then returns to the hot interface through either capillary action, centrifugal force, or gravity, and the cycle repeats. Without being bound to any particular theory, the capillary action can transport fluid (e.g., liquid) against a pressure gradient that may exist within the heat pipe.
By reference to
As shown in
Without being bound to any particular theory or embodiment, a wall (e.g., wall 100) of a component can flare outwards. As one example, one or both walls of the assembly can flare outwards (in a bell-like geometry) at an end of the assembly that acts ast the “hot end” of the component, i.e., the region of the component where the working fluid is vaporized by heat absorbed by the component. Again without being bound to any particular theory, such a flared/expanding geometry can promote expansion and cause additional cooling, e.g., via the Joule-Thomson effect.
Without being bound in any particular theory, fluid that vaporizes (from heat absorption) within a part of cavity 302 is transported, as vapor, within cavity 304 to a location where the vapor condenses onto wick material. Following that condensation, the condensed fluid is transported, e.g., via capillary action, along the wick back to the portion of the component where the fluid is then vaporized by heat absorbed by the component, as described elsewhere herein.
Some exemplary sealed spaces (and related techniques for forming and using such structures) can be found in published United patent applications 2017/0253416; 2017/0225276; 2017/0120362; 2017/0062774; 2017/0043938; 2016/0084425; 2015/0260332; 2015/0110548; 2014/0090737; 2012/0090817; 2011/0264084; 2008/0121642; and 2005/0211711, as well as in PCT/US2019/027682. All of the foregoing documents (and any priority documents mentioned therein) are incorporated herein by reference in their entireties for any and all purposes. The pressure in a sealed space can be from, e.g., 1 to 10−9 Torr, or from 10−1 to 10−8 Torr, or from 10−2 to 10−7 Torr, or from 10−3 to 10−6 Torr, or even from 10−4 to 10−5 Torr.
A further close-up view of the component of
Without being bound to any particular theory or embodiment, one or both walls of the assembly can flare outwards. As one example, one or both walls of the assembly can flare outwards at an end of the assembly that is pointed/directed toward the “hot end” of the component, i.e., the region of the component where the working fluid is vaporized by heat absorbed by the component. Again without being bound to any particular theory, such a flared/expanding geometry can promote expansion and cause additional cooling, e.g., via the Joule-Thomson effect.
The following embodiments are illustrative only and do not limit the present disclosure or the appended claims.
Embodiment 1. A heat transfer component, comprising: a sealed enclosure, the sealed enclosure having within a cavity having a first part, a second part, and a third part, the first part of the cavity being configured to receive heat from a heat source and the third part of the cavity being configured to deliver heat received from the heat source; a fluid disposed within the cavity; a wick disposed within the enclosure, the wick being in fluid communication with the fluid and also with at least the first part of the cavity and the third part of the cavity of the cavity, and the wick being capable of transporting fluid (a) between the first part of the cavity and the third part of the cavity, (b) between the third part of the cavity and the first part of the cavity, or both (a) and (b); and a first sealed evacuated space defined between two walls disposed between the second part of the cavity and the environment exterior to the heat transfer component.
The enclosure can comprise metals, ceramics, or any combination thereof. Without being bound to any particular theory, the first part of the cavity can be where fluid is vaporized by heat absorbed by the component, and the third part of the cavity can be where fluid condenses onto wick material.
A wick material is suitable a material that supports capillary action transport of fluid. Materials formed by way of sintered-together particles are considered suitable. Porous materials, e.g., polymers, ceramics, metals (including alloys), metalloids, and the like, are also considered suitable.
Suitable fluids (which can be termed “working fluids” in some embodiments) can be chosen according to the temperatures at which the heat transfer component may operate. Some non-limiting examples include, e.g., liquid helium for comparatively low temperature applications (2-4 K), mercury (523-923 K), sodium (873-1473 K) and even indium (2000-3000 K) for comparatively high temperatures. Heat transfer components can use ammonia (213-373 K), alcohol (methanol (283-403 K) or ethanol (273-403 K)) or water (298-573 K) as the working fluid. The foregoing list is exemplary only, as other working fluids can be used. A user can select their own working fluid, depending on the user's needs.
Embodiment 2. The heat transfer component of Embodiment 1, wherein the cavity defines an aspect ratio of from about 10,000:1 to about 1:1. The aspect ratio of the cavity can be, e.g., from about 10,000:1 to about 1:1, or from about 5,000:1 to about 1:1, from about 1,000:1 to about 1:1, from about 500:1 to about 1:1, from about 250:1 to about 1:1, from about 100:1 to about 1:1, from about 50:1 to about 1:1, from about 20:1 to about 1:1, from about 10:1 to about 1:1, from about 5:1 to about 1:1, or even from about 2:1 to about 1:1.
Embodiment 3. The heat transfer component of any of Embodiments 1-2, wherein the first sealed evacuated space is characterized as annular.
Embodiment 4. The heat transfer component of any one of Embodiments 1-3, wherein at least one of the sealed enclosure and the cavity is characterized as elongate. Tubular or cylindrical enclosures and cavities are considered especially suitable. Cavities and enclosures can be coaxial with one another, but this is not a requirement.
Embodiment 5. The heat transfer component of any one of Embodiments 1-4, wherein at least one of the sealed enclosure and the cavity is characterized as serpentine. The enclosure and/or cavity can have one or more curves, corners, or bends.
Embodiment 6. The heat transfer component of any one of Embodiments 1-5, wherein the wick is characterized as tubular in configuration.
Embodiment 7. The heat transfer component of any one of Embodiments 1-6, wherein the wick is characterized as columnar (e.g., rod-shaped) in configuration. A wick can include one, two, three, or more materials. A wick can also include one, two, or more segments in fluid communication with one another.
Embodiment 8. The heat transfer component of any one of Embodiments 1-7, further comprising an assembly that comprises a second sealed evacuated space defined between two walls, the second sealed evacuated space being disposed between the wick and the second part of the cavity.
Embodiment 9. The heat transfer component of Embodiment 8, wherein the wick is in fluid communication with the second sealed evacuated space.
Embodiment 10. The heat transfer component of Embodiment 8, wherein the wick is at least partially enclosed within the second sealed evacuated space.
Embodiment 11. The heat transfer component of Embodiment 10, wherein the wick extends beyond at least one wall that defines the second sealed evacuated space.
Embodiment 12. The heat transfer component of any of Embodiments 8-11, wherein the assembly is secured in position within the enclosure. The assembly can be secured with, e.g., a hangar, a bracket, or other component.
Embodiment 13. The heat transfer component of any of Embodiments 8-12, wherein the assembly comprises at least one mounting feature. Exemplary mounting features include, e.g., hangars, brackets, tabs, slots, grooves, slots, and the like.
Embodiment 14. The heat transfer component of any of Embodiments 1-13, wherein the enclosure comprises at least one mounting feature.
Embodiment 15. The heat transfer component of any of Embodiments 1-14, wherein the enclosure comprises a nozzle. Nozzles can be formed by way of a narrowing cross-section, a slit, or other outlet.
Embodiment 16. The heat transfer component of any of Embodiments 8-14, wherein the assembly comprises a nozzle.
Embodiment 17. The heat transfer component of any of Embodiments 8-14, wherein the assembly defines a non-uniform cross-section along a length of the assembly.
Embodiment 18. The heat transfer component of Embodiment 8, wherein the second sealed evacuated space is characterized as annular.
Embodiment 19. A method, comprising: with a heat transfer component according to any one of Embodiments 1-18, transferring with the heat transfer component heat that is received from a heat source.
Embodiment 20. A method, comprising with a heat transfer component according to any one of Embodiments 1-18, exposing the heat component to heat from a heat source so as to vaporize fluid within the first part of the cavity, to effect condensation of the fluid within the third part of the cavity, and to effect transport of the condensed fluid along the wick from the third part of the cavity to the first part of the cavity.
Embodiment 21. A heat transfer component, comprising: a tubular enclosure, the tubular enclosure having within a sealed annular cavity, the sealed annular cavity having a first part, a second part, and a third part; a fluid disposed within the sealed annular cavity; and a wick disposed within the sealed annular cavity, the wick being in fluid communication with the fluid and the wick being capable of transporting fluid (a) between the first part of the cavity and the third part of the cavity, (b) between the third part of the cavity and the second part of the cavity, or both (a) and (b); and a first sealed evacuated space disposed between the second part of the cavity and the environment exterior to the heat transfer component.
Embodiment 22. The heat transfer component of Embodiment 21, wherein the wick is characterized as tubular. As described elsewhere herein, a wick can be rod-shaped.
Embodiment 23. The heat transfer component of any one of Embodiments 21-22, wherein the sealed annular cavity extends about less than the circumference of the tubular enclosure. As an example, the cavity can extend about 180 degrees of the circumference of the tubular enclosure.
Embodiment 24. The heat transfer component of any one of Embodiments 21-23, wherein the enclosure is characterized as serpentine.
Embodiment 25. The heat transfer component of any one of Embodiments 21-24, wherein the enclosure defines an aspect ratio of from about 10,000:1 to about 1:1.
Embodiment 26. A method, comprising: with a heat transfer component according to any one of Embodiments 21-25, transferring with the heat transfer component heat that is received from a heat source.
Embodiment 27. A method, comprising with a heat transfer component according to any one of Embodiments 21-26, exposing the heat component to heat from a heat source so as to vaporize fluid within the first part of the cavity, to effect condensation of the fluid within the third part of the cavity, and to effect transport of the condensed fluid along the wick from the third part of the cavity to the first part of the cavity.
Embodiment 28. A heat transfer component, comprising: a sealed enclosure, the sealed enclosure having within a cavity having a first part, a second part, and a third part, the first part of the cavity being configured to receive heat from a heat source and the third part of the cavity being configured to deliver heat received from the heat source; a fluid disposed within the cavity; further comprising an assembly that comprises a second sealed evacuated space defined between two walls, the second sealed evacuated space being disposed between the wick and the second part of the cavity, the component being configured so as to define a space between a wall of the assembly and the sealed enclosure, the space optionally being annular in shape.
As shown in the attached FIGs., wick material can be disposed about the interior of a wall that defines an enclosure of the disclosed components. Wick material can also be disposed within an assembly that itself defines a sealed, evacuated space between two walls, e.g., in
Wick material can (e.g.,
By reference to non-limiting
Without being bound to any particular theory or embodiment, wick 604 can extend beyond the one or both ends of walls 604 and 608 so as to extend into a region of the component where vapor condenses onto the wick. Also without being bound to any particular theory or embodiment, wick 604 can extend beyond the one or both ends of walls 604 and 608 so as to extend into a region of the component where fluid is vaporized by way of heat absorbed by the heat transfer component from a heat source.
A component according to the present disclosure can also include one or more features that are incorporated into the exterior (e.g., wall 604 of
Without being bound to any particular theory, a heat transfer component can operate by utilizing thermal conductivity and phase transition to effectively transfer heat between two solid interfaces. At the hot interface of a heat pipe a liquid in contact with a thermally conductive solid surface turns into a vapor by absorbing heat from that surface. The vapor then travels along the heat pipe to the cold interface and condenses back into a liquid—releasing the latent heat. The liquid then returns to the hot interface through either capillary action, centrifugal force, or gravity, and the cycle repeats.
Without being bound to any particular theory, phase change of the thermal transfer solution can be effected so as to occur (or begin to occur) inside the thermal insulation covering the wick. This can cause the thermal transfer solution to expand and helps to force the solution from the thermal insulation space.
In some embodiments, an end of a thermal insulation covering the wick can be tapered, e.g., to form a nozzle. Such a taper can be formed by pinching towards one another one or both walls that define the sealed evacuated space of such insulation, e.g., tapered region 622 of assembly 624 in
The present application claims priority to and the benefit of U.S. Application No. 62/771,354, “Enhanced Heat Conduction Components” (filed Nov. 26, 2018), the entirety of which application is incorporated herein by reference for any and all purposes.
Filing Document | Filing Date | Country | Kind |
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PCT/US2019/063207 | 11/26/2019 | WO | 00 |
Number | Date | Country | |
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62771354 | Nov 2018 | US |